Individual holder
WILLIAMS VERNON M
0 granted patents·7 pending applications·0 citations·filing 2005–2007
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
7 records- 0154US2007062033A1Selective consolidation methods for fabricating semiconductor device components and conductive features thereofWILLIAMS VERNON M·Filed 2006·Application pending·0 cites
- 0251US2005230806A1Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elementsWILLIAMS VERNON M·Filed 2005·Application pending·0 cites
- 0351US2005221531A1Carrier substrates and conductive elements thereofWILLIAMS VERNON M·Filed 2005·Application pending·0 cites
- 0451US2005230843A1Flip-chip type semiconductor devices and conductive elements thereofWILLIAMS VERNON M·Filed 2005·Application pending·0 cites
- 0550US2007148818A1Electrical connection methods employing corresponding, insulator-coated members of interconnection elementsWILLIAMS VERNON M·Filed 2007·Application pending·0 cites
- 0650US2007148817A1Methods for fabricating reinforced, self-aligning conductive structures for semiconductor device componentsWILLIAMS VERNON M·Filed 2007·Application pending·0 cites
- 0745US2006082021A1Leadframe and method for reducing mold compound adhesion problemsWILLIAMS VERNON M·Filed 2005·Application pending·0 cites
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