Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements

Abstract

Conductive elements that include a plurality of adjacent, mutually adhered regions are disclosed. All of the regions may include the same type of material. At least a portion of such a conductive element may be configured to extend laterally. In a semiconductor device assembly, such a conductive element is in electrical communication with a contact of at least one semiconductor device component, and may extend between corresponding contacts of two or more semiconductor device components.

1 . A semiconductor device assembly, comprising: 
 a semiconductor device component including at least one contact; and    at least one conductive element in electrical communication with the at least one contact, the at least one conductive element including a plurality of adjacent, mutually adhered regions.    
     
     
         2 . The semiconductor device assembly of  claim 1 , wherein the at least one conductive element includes at least a portion that extends laterally relative to a plane within which at least one of the semiconductor device and the at least one other semiconductor device is disposed.  
     
     
         3 . The semiconductor device assembly of  claim 1 , wherein at least one region of the plurality of adjacent, mutually adhered regions comprises a polymer.  
     
     
         4 . The semiconductor device assembly of  claim 1 , wherein at least one region of the plurality of adjacent, mutually adhered regions comprises metal.  
     
     
         5 . The semiconductor device assembly of  claim 1 , further comprising: 
 another semiconductor device component including a corresponding bond pad in electrical communication with the at least one conductive element.    
     
     
         6 . The semiconductor device assembly of  claim 5 , further comprising: 
 a carrier to which at least one of the semiconductor device component and the another semiconductor device component is secured.    
     
     
         7 . The semiconductor device assembly of  claim 6 , further comprising: 
 at least one other conductive element connecting at least one contact of at least one of the semiconductor devices to a contact of the carrier and comprising a plurality of adjacent, mutually adhered regions.    
     
     
         8 . The semiconductor device assembly of  claim 1 , wherein the plurality of adjacent, mutually adhered regions comprises a plurality of superimposed, contiguous, mutually adhered layers.  
     
     
         9 . The semiconductor device assembly of  claim 1 , wherein the plurality of adjacent, mutually adhered regions comprise the same type of conductive material.  
     
     
         10 . The semiconductor device assembly of  claim 9 , wherein the at least one conductive element comprises a semiconductor device.  
     
     
         11 . A semiconductor device assembly, comprising: 
 a first semiconductor device component including at least one first contact;    a second semiconductor device component including a second contact corresponding to the at least one first contact; and    at least one conductive element extending between and facilitating electrical communication between the at least one first contact and the corresponding second contact, the at least one conductive element comprising a plurality of adjacent, mutually adhered regions.    
     
     
         12 . The semiconductor device assembly of  claim 11 , wherein the at least one conductive element includes at least a portion that extends laterally relative to a plane within which at least one of the first semiconductor device and the second semiconductor device is disposed.  
     
     
         13 . The semiconductor device assembly of  claim 11 , wherein each region of the plurality of adjacent, mutually adhered regions comprises a same type of material as all of the other regions of the plurality of adjacent, mutually adhered regions.  
     
     
         14 . The semiconductor device assembly of  claim 11 , wherein at least one region of the plurality of adjacent, mutually adhered regions comprises a polymer.  
     
     
         15 . The semiconductor device assembly of  claim 11 , wherein at least one region of the plurality of adjacent, mutually adhered regions comprises a metal.  
     
     
         16 . The semiconductor device assembly of  claim 11 , wherein the plurality of adjacent, mutually adhered regions comprises a plurality of superimposed, contiguous, mutually adhered layers.  
     
     
         17 . The semiconductor device assembly of  claim 11 , wherein the first semiconductor device component comprises a semiconductor device.  
     
     
         18 . The semiconductor device assembly of  claim 17 , wherein the second semiconductor device component comprises a semiconductor device.  
     
     
         19 . A conductive element for electrically connecting two contacts of an electronic component to one another, comprising a plurality of adjacent, mutually adhered regions.  
     
     
         20 . The conductive element of  claim 19 , at least a portion of which extends laterally.  
     
     
         21 . The conductive element of  claim 19 , wherein each region of the plurality of adjacent, mutually adhered regions comprises a same type of material as all of the other regions of the plurality of adjacent, mutually adhered regions.  
     
     
         22 . The conductive element of  claim 19 , wherein at least one region of the plurality of adjacent, mutually adhered regions comprises a polymer.  
     
     
         23 . The conductive element of  claim 19 , wherein at least one region of the plurality of adjacent, mutually adhered regions comprises a metal.  
     
     
         24 . The conductive element of  claim 19 , wherein the plurality of adjacent, mutually adhered regions comprises a plurality of superimposed, contiguous, mutually adhered layers.