US2007148818A1PendingUtilityA1

Electrical connection methods employing corresponding, insulator-coated members of interconnection elements

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Individually held — no corporate assignee on recordPriority: Jun 8, 2000Filed: Feb 20, 2007Published: Jun 28, 2007
Est. expiryJun 8, 2020(expired)· nominal 20-yr term from priority
Inventors:Vernon WilliamsFord B. GriggBret K. Street
H10W 90/724H10W 72/9415H10W 72/07236H10W 72/07227H10W 72/01261H10W 72/283H10W 72/251H10W 72/90H10W 90/701H10W 72/0112H10W 72/20H10W 70/652H10W 70/65H10W 72/9445H10P 95/00H05K 2203/167B33Y 30/00H05K 2203/0594H05K 3/321H05K 2201/0367H05K 3/12H05K 2201/10977H05K 3/4007B33Y 80/00H05K 3/3436Y02P70/50
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Claims

Abstract

A method of electrically connecting corresponding contact pads of semiconductor device components to each other includes interconnecting first and second members of an interconnection element. The first and second members respectively protrude from first and second semiconductor device components, with a conductive element of each member in communication with a contact pad of its corresponding semiconductor device component. Each member of the interconnection element also includes an insulative coating, or shell. When the first and second member of an interconnection element are interconnected, the insulative coating, or shell, may substantially cover or encase the conductive elements of the interconnection element.

Claims

exact text as granted — not AI-modified
1 . A method for electrically connecting corresponding contact pads of semiconductor device components to each other, comprising: 
 providing a first semiconductor device component having a first member of an interconnection element protruding from at least one contact pad thereof, the first member of the interconnection element including a conductive element and an insulative coating on the conductive element;    providing a second semiconductor device component having a second member of the interconnection element protruding from at least one contact pad thereof, the second member of the interconnection element including a conductive element and an insulative coating on the conductive element;    orienting the first and second semiconductor device components with the first member and the second member in at least rough alignment; and    interconnecting the first member and the second member such that the conductive elements of the first and second members establish electrical communication between the at least one contact pad of the semiconductor device and the at least one contact pad of the substrate.    
   
   
       2 . The method of  claim 1 , wherein interconnecting comprises inserting a portion of the conductive element of the first member that protrudes beyond the insulative coating of the first member into a receptacle of the second member.  
   
   
       3 . The method of  claim 1 , wherein interconnecting comprises establishing electrical communication between the conductive element of the first member and the conductive element of the second member.  
   
   
       4 . The method of  claim 1 , wherein interconnecting comprises mutually engaging complementary features of the insulative coatings of the first and second members.  
   
   
       5 . The method of  claim 1 , wherein interconnecting comprises interconnecting the first and second members such that the peripheries thereof are substantially covered by the insulative coatings of the first and second members.  
   
   
       6 . The method of  claim 5 , wherein interconnecting comprises at least partially reflowing material of the conductive elements of the first and second members.  
   
   
       7 . The method of  claim 6 , wherein at least partially reflowing comprises wetting a material of at least one of the conductive elements of the first and second members.  
   
   
       8 . The method of  claim 6 , wherein at least partially reflowing comprises substantially reflowing a material of at least one of the conductive elements of the first and second members.  
   
   
       9 . The method of  claim 8 , wherein insulative coatings of the first and second members maintain a combined shape of the conductive elements while substantially reflowing the material of at least one of the conductive elements of the first and second members.  
   
   
       10 . The method of  claim 1 , further comprising: 
 integrating a conductive element of the first member with a conductive element of the second member.    
   
   
       11 . The method of  claim 10 , wherein integrating comprises polymerizing at least a portion of at least one of the conductive elements of the first and second members.  
   
   
       12 . The method of  claim 1 , wherein providing the first semiconductor device component comprises providing a semiconductor device.  
   
   
       13 . The method of  claim 12 , wherein providing the second semiconductor device component comprises providing a carrier for the semiconductor device.  
   
   
       14 . A method of electrically connecting corresponding contact pads of semiconductor device components to each other, comprising: 
 orienting a first member of an interconnection element protruding from a surface of a first semiconductor device component in at least rough alignment with a second member of a second interconnection element protruding from a surface of a second semiconductor device component; and    interconnecting the first and second members of the interconnection element, insulative shells of the first and second members encasing conductive elements of the first and second members.    
   
   
       15 . The method of  claim 14 , further comprising: 
 establishing electrical contact between the conductive elements of the first and second members.    
   
   
       16 . The method of  claim 15 , wherein establishing electrical contact occurs while interconnecting the first and second members.  
   
   
       17 . The method of  claim 15 , wherein establishing electrical contact comprises at securing the conductive elements of the first and second members to one another.  
   
   
       18 . The method of  claim 17 , wherein securing comprises at least partially liquefying material of at least one of the conductive elements of the first and second members and allowing the material to resolidify.  
   
   
       19 . The method of  claim 18 , wherein at least partially liquefying comprises substantially liquefying material of at least one of the conductive elements of the first and second members.  
   
   
       20 . The method of  claim 17 , wherein securing comprises at least partially consolidating material of at least one of the conductive elements of the first and second members.  
   
   
       21 . The method of  claim 20 , wherein at least partially consolidating comprises at least partially polymerizing material of at least one of the conductive elements of the first and second members.  
   
   
       22 . The method of  claim 14 , wherein interconnecting comprises mutually engaging complementary features of the insulative coatings of the first and second members.

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