US2005221531A1PendingUtilityA1

Carrier substrates and conductive elements thereof

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Individually held — no corporate assignee on recordPriority: Feb 24, 2000Filed: May 31, 2005Published: Oct 6, 2005
Est. expiryFeb 24, 2020(expired)· nominal 20-yr term from priority
Inventors:Vernon Williams
H10W 90/10H10W 72/07131H10W 72/951H10W 72/251H10W 72/075H10W 72/29H10W 70/655H10W 70/093H10W 90/00H10W 72/012H10W 70/465H10W 70/60H10W 70/05H10W 72/20B33Y 10/00Y10T29/49155Y02P80/30Y10T29/49126B33Y 30/00B33Y 80/00H05K 3/02Y10T29/49128H05K 3/4664Y10T29/49117H05K 2203/1469H05K 2203/107Y10T29/4913H05K 3/32H05K 3/321H05K 2203/0514H05K 3/0023B33Y 70/00
51
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Claims

Abstract

A carrier substrate includes a substrate and at least one conductive element. The at least one conductive element may include a plurality of adjacent, mutually adhered regions, which may include the same type of material. A portion of the at least one conductive element may be disposed within a recess formed in a surface of the substrate. The at least one conductive element may include a portion that extends through the substrate.

Claims

exact text as granted — not AI-modified
1 . A carrier substrate, comprising: 
 a substrate; and    at least one conductive element comprising a plurality of adjacent, mutually adhered regions.    
     
     
         2 . The carrier substrate of  claim 1 , wherein each region of the plurality of adjacent, mutually adhered regions comprises the same type of material as each other region of the plurality of adjacent, mutually adhered regions.  
     
     
         3 . The carrier substrate of  claim 1 , wherein at least a portion of the at least one conductive element extends laterally relative to a plane within which the substrate is located.  
     
     
         4 . The carrier substrate of  claim 1 , wherein the at least one conductive element extends at least partially through the substrate.  
     
     
         5 . The carrier substrate of  claim 1 , wherein the at least one conductive element is at least partially carried by the substrate.  
     
     
         6 . The carrier substrate of  claim 5 , wherein at least a portion of the at least one conductive element extends laterally relative to a plane within which the substrate is located.  
     
     
         7 . The carrier substrate of  claim 6 , wherein at least the portion of the at least one conductive element extends through a recess formed in a surface of the substrate.  
     
     
         8 . The carrier substrate of  claim 6 , wherein at least another portion of the at least one conductive element extends at least partially through the substrate.  
     
     
         9 . The carrier substrate of  claim 6 , wherein at least a portion of the at least one conductive element extends at least partially through the substrate.  
     
     
         10 . The carrier substrate of  claim 1 , wherein the plurality of adjacent, mutually adhered regions comprises a plurality of at least partially superimposed, contiguous, mutually adhered layers.  
     
     
         11 . The carrier substrate of  claim 1 , wherein at least one region of the plurality of adjacent, mutually adhered regions comprises polymer.  
     
     
         12 . The carrier substrate of  claim 1 , wherein at least one region of the plurality of adjacent, mutually adhered regions comprises metal.  
     
     
         13 . A carrier substrate, comprising: 
 a substrate with at least one recess formed in a surface thereof; and    at least one conductive element including a laterally extending portion disposed within the at least one recess.    
     
     
         14 . The carrier substrate of  claim 13 , wherein the at least one conductive element includes a portion that extends at least partially through the substrate.  
     
     
         15 . The carrier substrate of  claim 13 , wherein the at least one conductive element includes a plurality of adjacent, mutually adhered regions.  
     
     
         16 . The carrier substrate of  claim 15 , wherein each region of the plurality of adjacent, mutually adhered regions comprises the same type of material as each other region of the plurality of adjacent, mutually adhered regions.  
     
     
         17 . The carrier substrate of  claim 15 , wherein the plurality of adjacent, mutually adhered regions comprises a plurality of at least partially superimposed, contiguous, mutually adhered layers.  
     
     
         18 . The carrier substrate of  claim 15 , wherein at least one region of the plurality of adjacent, mutually adhered regions comprises polymer.  
     
     
         19 . The carrier substrate of  claim 15 , wherein at least one region of the plurality of adjacent, mutually adhered regions comprises metal.

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