Methods for fabricating reinforced, self-aligning conductive structures for semiconductor device components

Abstract

A method for fabricating an electrical interconnection element, or conductive structure, includes disposing a jacket of a first member of the electrical interconnection element laterally around a contact of a semiconductor device structure and introducing conductive material into the jacket. The jacket, which may be electrically insulative, may include a plurality of adjacent, mutually adhered regions. Such regions may be formed by programmed material consolidation processes, such as stereolithography, in which material is selectively consolidated in a manner controlled by a program. The first member is configured to interconnect with a second member of the electrical interconnection element, which may be secured to and electrically communicate with a contact of another semiconductor device component.

1 . A method for fabricating an electrical interconnection element for use with a semiconductor device structure, comprising: 
 providing at least one substrate having at least one contact pad exposed at a surface thereof; and    disposing at least a first member of an electrical interconnection element over the at least one contact pad, the first member having a conductive center and an insulative jacket configured to laterally contain material of the conductive center over the at least one contact pad, the first member being configured to connect with a complementary second member of the electrical interconnection element.    
   
   
       2 . The method of  claim 1 , wherein disposing at least the first member comprises securing the jacket to the at least one substrate with at least a portion of the at least one contact pad being exposed therethrough.  
   
   
       3 . The method of  claim 2 , further comprising: 
 disposing the conductive center in communication with the at least one contact pad after securing the jacket.    
   
   
       4 . The method of  claim 3 , wherein disposing the conductive center comprises disposing at least partially unconsolidated conductive material in communication with the at least one contact pad.  
   
   
       5 . The method of  claim 4 , wherein disposing at least partially unconsolidated conductive material comprises disposing at least partially uncured conductive resin in communication with the at least one contact pad.  
   
   
       6 . The method of  claim 4 , wherein disposing at least partially unconsolidated conductive material comprises disposing at least one of a solder paste, a molten solder, a metal, or a metal alloy, in communication with the at least one contact pad.  
   
   
       7 . The method of  claim 4 , wherein disposing at least partially unconsolidated conductive material comprises disposing an at least partially melted conductive elastomer in communication with the at least one contact pad.  
   
   
       8 . The method of  claim 3 , wherein disposing the conductive center comprises disposing a preformed conductive center in communication with the at least one contact pad.  
   
   
       9 . The method of  claim 1 , wherein disposing at least the first member comprises positioning the jacket around a conductive center secured to the at least one contact pad.  
   
   
       10 . The method of  claim 1 , wherein disposing at least the first member comprises fabricating the jacket on the surface.  
   
   
       11 . The method of  claim 10 , wherein fabricating comprises fabricating the jacket from a photopolymer.  
   
   
       12 . The method of  claim 3 , wherein fabricating comprises fabricating the jacket as at least two adjacent, mutually adhered regions.  
   
   
       13 . The method of  claim 1 , wherein providing comprises providing at least one semiconductor device.  
   
   
       14 . The method of  claim 13 , wherein providing comprises providing at least one semiconductor wafer with a plurality of semiconductor dice.  
   
   
       15 . The method of  claim 13 , wherein providing comprises providing at least one of a ball grid array package and a chip-scale package.  
   
   
       16 . The method of  claim 1 , wherein providing comprises providing at least one carrier substrate.  
   
   
       17 . The method of  claim 1 , wherein disposing comprises securing the jacket to the surface.  
   
   
       18 . The method of  claim 17 , further comprising: 
 prior to disposing, fabricating the jacket to have at least two adjacent, mutually adhered regions.    
   
   
       19 . The method of  claim 18 , wherein fabricating comprises fabricating at least one of the at least two regions from a photopolymer material.  
   
   
       20 . A method for fabricating a semiconductor device component, comprising: 
 providing at least one substrate with at least one contact pad exposed at a surface thereof; and    sequentially forming at least one region of at least one jacket of a first member of a conductive structure on the surface around the at least one contact pad, the at least one jacket having an aperture formed through the length thereof and configured to laterally contain conductive material over the at least one contact pad, the at least one jacket configured to interconnect with a jacket of a second member of the conductive structure.    
   
   
       21 . The method of  claim 20 , wherein sequentially forming comprises forming the at least one region from a photopolymer.  
   
   
       22 . The method of  claim 20 , wherein providing comprises providing at least one semiconductor device.  
   
   
       23 . The method of  claim 22 , wherein providing comprises providing at least one wafer including a plurality of semiconductor dice.  
   
   
       24 . The method of  claim 22 , wherein providing comprises providing at least one of a ball grid array package and a chip-scale package.  
   
   
       25 . The method of  claim 20 , wherein providing comprises providing at least one carrier substrate.  
   
   
       26 . The method of  claim 20 , wherein sequentially forming comprises forming the aperture to have a larger periphery at an upper portion thereof than at a base portion thereof.  
   
   
       27 . The method of  claim 26 , wherein forming comprises forming an inner ledge between the upper portion and the base portion.  
   
   
       28 . The method of  claim 26 , wherein forming comprises forming at least a portion of a wall of the aperture to taper inwardly from the upper portion to the base portion.  
   
   
       29 . The method of  claim 20 , wherein sequentially forming comprises forming the at least one jacket to have an outer surface with a smaller periphery at an end thereof than at a base portion thereof.  
   
   
       30 . The method of  claim 29 , wherein forming comprises forming an outer ledge on the outer surface between the end and the base portion.  
   
   
       31 . The method of  claim 29 , wherein forming comprises forming at least a portion of the outer surface to taper outwardly from the end to the base portion.  
   
   
       32 . The method of  claim 31 , wherein forming comprises forming the at least one jacket to have a frustoconical configuration.  
   
   
       33 . The method of  claim 20 , further comprising: 
 disposing conductive material in the aperture.    
   
   
       34 . The method of  claim 33 , wherein disposing comprises substantially filling the aperture with the conductive material.  
   
   
       35 . The method of  claim 33 , wherein disposing comprises partially filling the aperture with the conductive material.  
   
   
       36 . The method of  claim 35 , wherein sequentially forming comprises forming the aperture to receive at least an end of the second member.  
   
   
       37 . The method of  claim 33 , wherein disposing comprises disposing at least partially unconsolidated conductive material in the aperture.  
   
   
       38 . The method of  claim 37 , wherein disposing comprises disposing at least partially uncured conductive resin in the aperture.  
   
   
       39 . The method of  claim 37 , wherein disposing at least partially unconsolidated conductive material comprises disposing at least one of a solder paste, a molten solder, a metal, and a metal alloy in the aperture.  
   
   
       40 . The method of  claim 37 , wherein disposing at least partially unconsolidated conductive material comprises disposing an at least partially melted conductive elastomer in the aperture.  
   
   
       41 . The method of  claim 20 , further comprising: 
 securing a preformed conductive center to the at least one contact pad.    
   
   
       42 . The method of  claim 41 , wherein securing the preformed conductive center is effected before the sequentially forming.  
   
   
       43 . The method of  claim 41 , wherein securing the preformed conductive center is effected after the sequentially forming.  
   
   
       44 . A method for fabricating a semiconductor device component, comprising: 
 placing at least one substrate with contact pads in a horizontal plane;    recognizing a location and orientation of the at least one substrate; and    fabricating at least one jacket of a first member of a conductive structure by selectively consolidating material of the at least one jacket in a manner controlled by a program, the first member comprising at least one region of at least semisolid material on a surface of the at least one substrate, the at least one jacket around at least one contact pad of the contact pads, the at least one jacket protruding from the surface so as to laterally contain conductive material of a conductive center of the first member over at least a portion of the at least one contact pad, the first member being configured to connect with a complementarily configured second member of the conductive structure.    
   
   
       45 . The method of  claim 44 , further comprising: 
 storing data including at least one physical parameter of the at least one substrate and of the at least one jacket in computer memory, and using the stored data in conjunction with a machine vision system to recognize the location and orientation of the at least one substrate.    
   
   
       46 . The method of  claim 45 , further including, in computer memory, at least one physical parameter of the at least one contact pad around which the at least one jacket is to be fabricated.  
   
   
       47 . The method of  claim 45 , further including, in computer memory, at least one parameter of another substrate component with which the at least one substrate is to be assembled.  
   
   
       48 . The method of  claim 45 , further comprising: 
 using the stored data, in conjunction with the machine vision system, to effect fabricating the at least one jacket.    
   
   
       49 . The method of  claim 44 , further comprising: 
 recognizing a location of the at least one contact pad.    
   
   
       50 . The method of  claim 44 , further including securing the at least one substrate to a carrier prior to placing the at least one substrate in the horizontal plane.