Inventor · disambiguated record
Kevin L. Beaman
Also filed as: BEAMAN KEVIN L
34 granted patents·11 pending applications·955 citations·filing 2000–2013
98Inventor score
Top patents by PatentIndex Score
45 records- 0199US7422635B2Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 9, 2008·483 cites·17 claims
- 0296US7514366B2Methods for forming shallow trench isolationMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 7, 2009·42 cites·42 claims
- 0395US6437375B1PD-SOI substrate with suppressed floating body effect and method for its fabricationMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 20, 2002·77 cites·55 claims
- 0492US7647886B2Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambersMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 19, 2010·45 cites·8 claims
- 0589US6429070B1DRAM cell constructions, and methods of forming DRAM cellsMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 6, 2002·37 cites·34 claims
- 0688US6686298B1Methods of forming structures over semiconductor substrates, and methods of forming transistors associated with semiconductor substratesMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 3, 2004·31 cites·31 claims
- 0787US6746937B2PD-SOI substrate with suppressed floating body effect and method for its fabricationMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 8, 2004·32 cites·12 claims
- 0886US7771537B2Methods and systems for controlling temperature during microfeature workpiece processing, E.G. CVD depositionMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 10, 2010·5 cites·13 claims
- 0986US7279398B2Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 9, 2007·6 cites·12 claims
- 1085US7056806B2Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 6, 2006·23 cites·31 claims
- 1185US6690046B2Semiconductor assemblies, methods of forming structures over semiconductor substrates, and methods of forming transistors associated with semiconductor substratesMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 10, 2004·24 cites·5 claims
- 1284US7919829B2Liner for shallow trench isolationMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 5, 2011·9 cites·9 claims
- 1380US7371647B2Methods of forming transistorsMICRON TECHNOLOGY INC·Filed 2005·Granted May 13, 2008·5 cites·20 claims
- 1480US6723599B2Methods of forming capacitors and methods of forming capacitor dielectric layersMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 20, 2004·22 cites·36 claims
- 1579US7258892B2Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD depositionMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 21, 2007·13 cites·27 claims
- 1678US7235138B2Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 26, 2007·14 cites·20 claims
- 1776US6734062B2Methods of forming DRAM cellsMICRON TECHNOLOGY INC·Filed 2002·Granted May 11, 2004·16 cites·12 claims
- 1875US7803678B2Method of forming a structure over a semiconductor substrateROUND ROCK RES LLC·Filed 2008·Granted Sep 28, 2010·3 cites·24 claims
- 1974US8384192B2Methods for forming small-scale capacitor structuresMICRON TECHNOLOGY INC·Filed 2011·Granted Feb 26, 2013·2 cites·22 claims
- 2074US7271464B2Liner for shallow trench isolationMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 18, 2007·15 cites·18 claims
- 2171US7344755B2Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambersMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 18, 2008·10 cites·12 claims
- 2268US7153736B2Methods of forming capacitors and methods of forming capacitor dielectric layersMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 26, 2006·10 cites·34 claims
- 2367US7906393B2Methods for forming small-scale capacitor structuresMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 15, 2011·8 cites·44 claims
- 2461US2006205187A1Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 2561US2006213440A1Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 2659US2006198955A1Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 2756US8518184B2Methods and systems for controlling temperature during microfeature workpiece processing, E.G., CVD depositionBEAMAN KEVIN L·Filed 2010·Granted Aug 27, 2013·0 cites·22 claims
- 2854US7651910B2Methods of forming programmable memory devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 26, 2010·5 cites·24 claims
- 2954US7399714B2Method of forming a structure over a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2004·Granted Jul 15, 2008·3 cites·30 claims
- 3053US8030170B2Methods of forming isolation structures, and methods of forming nonvolatile memoryMICRON TECHNOLOGY INC·Filed 2009·Granted Oct 4, 2011·2 cites·16 claims
- 3153US2013166057A1Methods for forming small-scale capacitor structuresMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 3251US8017470B2Method of forming a structure over a semiconductor substrateROUND ROCK RES LLC·Filed 2010·Granted Sep 13, 2011·0 cites·8 claims
- 3351US6707090B2DRAM cell constructionsMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 16, 2004·3 cites·13 claims
- 3451US6639243B2DRAM cell constructionsMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 28, 2003·3 cites·9 claims
- 3549US6617262B2Sputtered insulating layer for wordline stacksMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 9, 2003·2 cites·35 claims
- 3649US6455441B1Sputtered insulating layer for wordline stacksMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 24, 2002·2 cites·18 claims
- 3748US6589843B1Methods of forming FLASH field effect transistor gates and non-FLASH field effect transistor gatesMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 8, 2003·3 cites·13 claims
- 3846US2006196538A1Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambersMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 3945US2006194452A1Plasma nitridization for adjusting transistor threshold voltageBEAMAN KEVIN L·Filed 2006·Application pending·0 cites
- 4045US2006194446A1Plasma nitridization for adjusting transistor threshold voltageBEAMAN KEVIN L·Filed 2006·Application pending·0 cites
- 4142US6815372B2Sputtered insulating layer for wordline stacksMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 9, 2004·0 cites·24 claims
- 4242US2004183144A1Plasma nitridization for adjusting transistor threshold voltageFiled 2003·Application pending·0 cites
- 4340US2006252207A1Methods of forming programmable memory devicesBEAMAN KEVIN L·Filed 2006·Application pending·0 cites
- 4438US2001052621A1PD-SOI substrate with suppressed floating body effect and method for its fabricationFiled 2001·Application pending·0 cites
- 4535US2002090783A1Use of atomic oxidation for fabrication of oxide-nitride-oxide stack for flash memory devicesFiled 2001·Application pending·0 cites
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