Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces

Abstract

The present disclosure describes apparatus and methods for processing microfeature workpieces, e.g., by depositing material on a microelectronic semiconductor using atomic layer deposition. Some of these apparatus include microfeature workpiece holders that include gas distributors. One exemplary implementation provides a microfeature workpiece holder adapted to hold a plurality of microfeature workpieces. This workpiece holder includes a plurality of workpiece supports and a gas distributor. The workpiece supports are adapted to support a plurality of microfeature workpieces in a spaced-apart relationship to define a process space adjacent a surface of each microfeature workpiece. The gas distributor includes an inlet and a plurality of outlets, with each of the outlets positioned to direct a flow of process gas into one of the process spaces.

1 - 43 . (canceled)  
   
   
       44 . A method of processing microfeature workpieces, comprising: 
 positioning a microfeature workpiece holder in a process chamber, the microfeature workpiece holder supporting first, second and third microfeature workpieces in a spaced-apart relationship to define a first process space between the first and second microfeature workpieces and define a second process space between the second and third microfeature workpieces;    delivering a first process gas to the microfeature workpiece holder, the microfeature workpiece holder carrying a gas distributor that delivers a first flow of the first process gas transversely into the first process space and delivers a second flow of the first process gas transversely into the second process space;    delivering a second process gas to the process chamber; and    removing the microfeature workpiece holder and the microfeature workpieces from the process chamber.    
   
   
       45 . The method of  claim 44  positioning the microfeature workpiece holder in the process chamber comprises placing the microfeature workpiece holder in an enclosure and substantially sealing the enclosure to define the process chamber.  
   
   
       46 . The method of  claim 44  wherein delivering the second process gas to the process chamber comprises delivering the second process gas directly to the process chamber through a delivery conduit independent of the gas distributor.  
   
   
       47 . The method of  claim 44  wherein delivering the second process gas to the process chamber comprises delivering the second process gas to the microfeature workpiece holder and delivering a first flow of the second process gas transversely into the first process space via the gas distributor and delivering a second flow of the second process gas transversely into the second process space via the gas distributor.  
   
   
       48 . The method of  claim 44  wherein the gas distributor includes a first gas delivery conduit and an independent second gas delivery conduit, and wherein delivering the first process gas to the microfeature workpiece holder comprises delivering the first process gas to the first conduit and delivering the second process gas to the process chamber comprises delivering the second process gas to the second gas delivery conduit.  
   
   
       49 . The method of  claim 48  wherein the second gas delivery conduit delivers a first flow of the second process gas transversely into the first process space and delivers a second flow of the second process gas transversely into the second process space.  
   
   
       50 . The method of  claim 44  wherein the gas distributor includes a gas delivery conduit, and wherein the first flow of the first process gas is delivered through the gas delivery conduit to a first outlet that directs the first process gas into the first process space and the second flow of the first process gas is delivered through the gas delivery conduit to a second outlet that directs the first process gas into the second process space.  
   
   
       51 . The method of  claim 50  wherein the gas distributor includes a first gas delivery conduit and a second gas delivery conduit, and wherein: 
 the first flow of the first process gas is delivered through the gas delivery conduit to a first outlet that directs the first process gas into the first process space;    the second flow of the first process gas is delivered through the gas delivery conduit to a second outlet that directs the first process gas into the second process space; and    delivering the second process gas to the process chamber comprises: 
 delivering a first flow of the second process gas through the second gas delivery conduit to a third outlet that directs the second process gas transversely into the first process space; and  
 delivering a second flow of the second process gas through the second gas delivery conduit to a fourth outlet that directs the second process gas transversely into the second process space.  
   
   
   
       52 . A method of depositing a material on microfeature workpieces, comprising: 
 positioning a microfeature workpiece holder in a process chamber, the microfeature workpiece holder supporting first, second, and third microfeature workpieces in a spaced-apart relationship to define a first process space between the first and second microfeature workpieces and define a second process space between the second and third microfeature workpieces;    delivering a first precursor gas to the process chamber to deposit a quantity of the first precursor gas on a surface of each of the first, second, and third microfeature workpieces;    delivering a purge gas to the microfeature workpiece holder, the microfeature workpiece holder carrying a gas distributor that delivers a first flow of the purge gas transversely into the first process space and delivers a second flow of the purge gas transversely into the second process space;    delivering a second precursor gas to the process chamber, the second precursor gas reacting with the quantity of the first precursor gas to form a layer of material on the surfaces of the first, second, and third microfeature workpieces; and    removing the microfeature workpiece holder and the microfeature workpieces from the process chamber.