Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces

Abstract

The present disclosure suggests several systems and methods for batch processing of microfeature workpieces, e.g., semiconductor wafers or the like. One exemplary implementation provides a method of depositing a reaction product on each of a batch of workpieces positioned in a process chamber in a spaced-apart relationship. A first gas may be delivered to an elongate first delivery conduit that includes a plurality of outlets spaced along a length of the conduit. A first gas flow may be directed by the outlets to flow into at least one of the process spaces between adjacent workpieces along a first vector that is transverse to the direction in which the workpieces are spaced. A second gas may be delivered to an elongate second delivery conduit that also has outlets spaced along its length. A second gas flow of the second gas may be directed by the outlets to flow into the process spaces along a second vector that is transverse to the first direction.

1 - 20 . (canceled)  
     
     
         21 . A microfeature workpiece processing system comprising: 
 a process chamber adapted to receive a plurality of transversely oriented microfeature workpieces spaced from one another in a longitudinal direction;    a first gas conduit extending longitudinally within the process chamber and having a plurality of outlets spaced longitudinally along a length of the first gas conduit, the outlets being oriented to direct a first gas flow transversely across surfaces of the microfeature workpieces;    a second gas conduit having a second outlet oriented to direct a second gas flow longitudinally within the process chamber;    a first gas supply line adapted to deliver a first gas to the first gas conduit; and    a second gas supply line adapted to deliver a second gas to the second gas conduit.    
     
     
         22 . The microfeature workpiece processing system of  claim 21  wherein the first gas and the second gas are the same and the first gas supply line and the second gas supply line are in communication with a common gas supply.  
     
     
         23 . The microfeature workpiece processing system of  claim 21  wherein the first gas is different from the second gas and the second gas supply line is independent of the first gas supply line.  
     
     
         24 . The microfeature workpiece processing system of  claim 21  wherein the first gas flow is generally perpendicular to the second gas flow.  
     
     
         25 . The microfeature workpiece processing system of  claim 21  wherein the second outlet is one of a plurality of second outlets arranged peripherally about a workpiece area of the process chamber, the workpiece area being adapted to receive the plurality of microfeature workpieces.  
     
     
         26 . The microfeature workpiece processing system of  claim 21  wherein the first outlets are oriented to direct the first gas flow toward centers of the microfeature workpieces.  
     
     
         27 . The microfeature workpiece processing system of  claim 21  further comprising a third gas supply line adapted to deliver a third gas to the process chamber.  
     
     
         28 . The microfeature workpiece processing system of  claim 21  further comprising a controller operatively coupled to the first gas supply line and the second gas supply line, the controller being programmed to terminate the first gas flow before initiating the second gas flow.  
     
     
         29 . The microfeature workpiece processing system of  claim 21  further comprising a controller operatively coupled to the first gas supply line and the second gas supply line, the controller being programmed to deliver the first gas flow to the process chamber while delivering the second gas flow to the process chamber.  
     
     
         30 - 43 . (canceled)  
     
     
         44 . A microfeature workpiece processing system, comprising: 
 a process chamber configured to receive a plurality of microfeature workpieces spaced from one another in a first direction to define process spaces between adjacent workpieces;    a first gas supply line;    a second gas supply line;    a first gas conduit in fluid communication with the first gas supply line and having an outlet length extending in the first direction within the process chamber, the first gas conduit having a plurality of first outlets spaced along the outlet length in the first direction, the first outlets being configured to direct a first gas flow from the first gas conduit transversely into the process spaces;    a second gas conduit having a second outlet oriented to direct a second gas flow in a direction generally transverse to the first gas flow; and    a controller operatively coupled to the first gas supply line and to the second gas supply line and configured to selectively control the first gas flow and the second gas flow.    
     
     
         45 . The microfeature workpiece processing system of  claim 44  wherein the first gas and the second gas are the same and the first gas supply line and the second gas supply line are in communication with a common gas supply.  
     
     
         46 . The microfeature workpiece processing system of  claim 44  wherein the first gas is different from the second gas and the second gas supply line is independent of the first gas supply line.  
     
     
         47 . The microfeature workpiece processing system of  claim 44  wherein the first gas flow is generally perpendicular to the second gas flow.  
     
     
         48 . The microfeature workpiece processing system of  claim 44  wherein the first outlets are oriented to direct the first gas flow toward centers of the microfeature workpieces.  
     
     
         49 . The microfeature workpiece processing system of  claim 44 , further comprising a third gas supply line configured to deliver a third gas to the process chamber.  
     
     
         50 . The microfeature workpiece processing system of  claim 44  wherein the controller is programmed to terminate the first gas flow before initiating the second gas flow.  
     
     
         51 . The microfeature workpiece processing system of  claim 44  wherein the controller is programmed to deliver the first gas flow to the process chamber while delivering the second gas flow to the process chamber.  
     
     
         52 . A microfeature workpiece processing system, comprising: 
 a process chamber having a workpiece area configured to receive a plurality of spaced-apart microfeature workpieces arranged relative to a longitudinal axis of the process chamber;    a first gas conduit extending longitudinally within the process chamber proximate the workpiece area, the first gas conduit having a plurality of first outlets spaced longitudinally along a length of the first gas conduit, the first outlets being oriented toward the workpiece area and configured to direct a first gas flow transverse to the longitudinal axis;    a second gas conduit having a second outlet oriented to direct a second gas flow generally parallel to the longitudinally axis within the process chamber;    a first gas supply line configured to deliver a first gas to the first gas conduit; and    a second gas supply line configured to deliver a second gas to the second gas conduit, the second gas supply line being independent of the first gas supply line and the second gas being different from the first gas.    
     
     
         53 . The microfeature workpiece processing system of  claim 52 , further comprising a controller operatively coupled to the first gas supply line and the second gas supply line, the controller being programmed to terminate the first gas flow before initiating the second gas flow.  
     
     
         54 . The microfeature workpiece processing system of  claim 52 , further comprising a controller operatively coupled to the first gas supply line and the second gas supply line, the controller being programmed to deliver the first gas flow to the process chamber while delivering the second gas flow to the process chamber.