Inventor · disambiguated record
Kishou Kaneko
Also filed as: KANEKO KISHOU
31 granted patents·13 pending applications·292 citations·filing 2009–2019
96Inventor score
Files withRENESAS ELECTRONICS CORP30HUAIAN IMAGING DEVICE MFT CORP6KANEKO KISHOU5INOUE NAOYA2SUNAMURA HIROSHI1
Top patents by PatentIndex Score
44 records- 0199US8378341B2Semiconductor device and method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Feb 19, 2013·94 cites·20 claims
- 0298US9312394B2Semiconductor device and method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Apr 12, 2016·29 cites·19 claims
- 0398US9129937B2Semiconductor device and method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 8, 2015·48 cites·6 claims
- 0496US9754816B2Semiconductor device and method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Sep 5, 2017·14 cites·20 claims
- 0596US8618537B2Semiconductor device and method for manufacturing the sameKANEKO KISHOU·Filed 2011·Granted Dec 31, 2013·38 cites·21 claims
- 0692US9331071B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted May 3, 2016·13 cites·25 claims
- 0790US9349844B2Semiconductor device manufacturing methodRENESAS ELECTRONICS CORP·Filed 2014·Granted May 24, 2016·7 cites·11 claims
- 0890US8901553B2Semiconductor device and manufacturing method thereofINOUE NAOYA·Filed 2012·Granted Dec 2, 2014·9 cites·22 claims
- 0989US8373256B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 12, 2013·11 cites·12 claims
- 1085US9053961B2Semiconductor device and method of manufacturing the semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2012·Granted Jun 9, 2015·5 cites·13 claims
- 1183US8779594B2Semiconductor device having multi-layered interconnect structureRENESAS ELECTRONICS CORP·Filed 2012·Granted Jul 15, 2014·5 cites·14 claims
- 1278US8390124B2Semiconductor device and method of manufacturing semiconductor device including wiring via and switch via for connecting first and second wiringsINOUE NAOYA·Filed 2010·Granted Mar 5, 2013·5 cites·20 claims
- 1374US9190475B2Semiconductor device and semiconductor device manufacturing methodRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 17, 2015·2 cites·19 claims
- 1470US9000540B2Semiconductor device and a method for manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Apr 7, 2015·2 cites·18 claims
- 1569US9263399B2Semiconductor device with electro-static discharge protection device above semiconductor device areaKANEKO KISHOU·Filed 2012·Granted Feb 16, 2016·2 cites·13 claims
- 1669US8835190B2Semiconductor apparatusKANEKO KISHOU·Filed 2011·Granted Sep 16, 2014·2 cites·19 claims
- 1768US9362318B2Method of manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jun 7, 2016·1 cites·15 claims
- 1866US9680031B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted Jun 13, 2017·1 cites·6 claims
- 1966US9530769B2Semiconductor device with electro-static discharge protection device above semiconductor device areaRENESAS ELECTRONICS CORP·Filed 2016·Granted Dec 27, 2016·1 cites·6 claims
- 2065US9048291B2Method of manufacturing a semiconductor device having multi-layered interconnect structureRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 2, 2015·1 cites·12 claims
- 2164US8072048B2Semiconductor apparatusKANEKO KISHOU·Filed 2009·Granted Dec 6, 2011·2 cites·19 claims
- 2255US9166057B2Semiconductor device having the bottom gate type transistor formed in a wiring layerRENESAS ELECTRONICS CORP·Filed 2013·Granted Oct 20, 2015·0 cites·17 claims
- 2353US9356026B2Semiconductor device and semiconductor device manufacturing methodRENESAS ELECTRONICS CORP·Filed 2015·Granted May 31, 2016·0 cites·1 claims
- 2453US9153588B2Semiconductor device and a method for manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Oct 6, 2015·0 cites·17 claims
- 2553US9082643B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Jul 14, 2015·0 cites·14 claims
- 2652US9230865B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Granted Jan 5, 2016·0 cites·4 claims
- 2752US9035360B2Semiconductor device and SiP device using the sameKANEKO KISHOU·Filed 2012·Granted May 19, 2015·0 cites·19 claims
- 2852US2016240625A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 2950US2016148845A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 3050US2016240564A1Semiconductor device and semiconductor device manufacturing methodRENESAS ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 3147US9337187B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted May 10, 2016·0 cites·3 claims
- 3246US9368403B2Method for manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jun 14, 2016·0 cites·3 claims
- 3346US2015349134A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 3446US2016043006A1Method for manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 3543US9496403B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2012·Granted Nov 15, 2016·0 cites·12 claims
- 3643US8664769B2Semiconductor deviceSUNAMURA HIROSHI·Filed 2012·Granted Mar 4, 2014·0 cites·27 claims
- 3743US2020152551A1Stacked semiconductor devices and methods of manufacturing the sameHUAIAN IMAGING DEVICE MFT CORP·Filed 2019·Application pending·0 cites
- 3843US2020152674A1Image sensor and method for manufacturing image sensorHUAIAN IMAGING DEVICE MFT CORP·Filed 2019·Application pending·0 cites
- 3943US2020152686A1Stacked tsv structure and manufacturing method thereofHUAIAN IMAGING DEVICE MFT CORP·Filed 2019·Application pending·0 cites
- 4043US2020075651A1Double-layer color filter and method for forming the sameHUAIAN IMAGING DEVICE MFT CORP·Filed 2019·Application pending·0 cites
- 4142US2015014682A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 4241US2013009150A1Semiconductor device, electronic device, wiring substrate, manufacturing method of semiconductor device, and manufacturing method of wiring substrateRENESAS ELECTRONICS CORP·Filed 2012·Application pending·0 cites
- 4340US2020043969A1Semiconductor device and method of manufacturing the sameHUAIAN IMAGING DEVICE MFT CORP·Filed 2019·Application pending·0 cites
- 4435US2019237501A1Semiconductor device and manufacturing method thereofHUAIAN IMAGING DEVICE MFT CORP·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kishou Kaneko files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →