Inventor · disambiguated record
Norikazu Mizuno
Also filed as: MIZUNO NORIKAZU
32 granted patents·21 pending applications·208 citations·filing 2000–2025
96Inventor score
Files withHITACHI INT ELECTRIC INC26KOKUSAI ELECTRIC CORP12MIZUNO NORIKAZU5KOKUSAI ELECTRIC CO LTD4MIYA HIRONOBU4
Top patents by PatentIndex Score
53 records- 0194US6486083B1Semiconductor device manufacturing method and semiconductor manufacturing apparatusKOKUSAI ELECTRIC CO LTD·Filed 2000·Granted Nov 26, 2002·74 cites·18 claims
- 0293US7779785B2Production method for semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2006·Granted Aug 24, 2010·21 cites·3 claims
- 0392US11705325B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jul 18, 2023·1 cites·21 claims
- 0492US8227346B2Method of producing semiconductor deviceMIYA HIRONOBU·Filed 2011·Granted Jul 24, 2012·12 cites·10 claims
- 0590US8039404B2Production method for semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2010·Granted Oct 18, 2011·9 cites·3 claims
- 0689US9018104B2Method for manufacturing semiconductor device, method for processing substrate and substrate processing apparatusHIROSE YOSHIRO·Filed 2011·Granted Apr 28, 2015·8 cites·16 claims
- 0785US9343290B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted May 17, 2016·6 cites·19 claims
- 0885US8176871B2Substrate processing apparatusOKUDA KAZUYUKI·Filed 2007·Granted May 15, 2012·11 cites·7 claims
- 0985US7767594B2Semiconductor device producing methodHITACHI INT ELECTRIC INC·Filed 2007·Granted Aug 3, 2010·9 cites·15 claims
- 1084US9334567B2Method for manufacturing semiconductor device, method for processing substrate and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted May 10, 2016·3 cites·14 claims
- 1184US8105957B2Method of producing semiconductor deviceMIYA HIRONOBU·Filed 2009·Granted Jan 31, 2012·7 cites·12 claims
- 1283US2025022702A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1381US12142476B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Nov 12, 2024·0 cites·21 claims
- 1480US9548198B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jan 17, 2017·4 cites·16 claims
- 1579US8557716B2Semiconductor device manufacturing method and substrate processing apparatusMIZUNO NORIKAZU·Filed 2010·Granted Oct 15, 2013·5 cites·5 claims
- 1673US8535479B2Manufacturing method of semiconductor device, and semiconductor deviceMIZUNO NORIKAZU·Filed 2011·Granted Sep 17, 2013·2 cites·10 claims
- 1773US8093159B2Manufacturing method of semiconductor device, and semiconductor deviceMIZUNO NORIKAZU·Filed 2008·Granted Jan 10, 2012·3 cites·30 claims
- 1872US2025022708A1Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1972US2025069898A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2070US9263251B2Method of manufacturing semiconductor device, semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Feb 16, 2016·1 cites·10 claims
- 2170US6790793B2Method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2003·Granted Sep 14, 2004·13 cites·15 claims
- 2269US12170206B2Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 17, 2024·0 cites·9 claims
- 2369US11527401B2Method of processing substate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 2468US9217199B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Dec 22, 2015·1 cites·15 claims
- 2567US7662727B2Method for manufacturing semiconductor device backgroundHITACHI INT ELECTRIC INC·Filed 2007·Granted Feb 16, 2010·2 cites·7 claims
- 2663US12148614B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 19, 2024·0 cites·19 claims
- 2763US7892983B2Substrate processing apparatus and producing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2005·Granted Feb 22, 2011·1 cites·3 claims
- 2863US6720274B2Method for fabricating a semiconductor device and a substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2002·Granted Apr 13, 2004·8 cites·13 claims
- 2963US6716772B2Semiconductor device manufacturing method and semiconductor manufacturing apparatusKOKUSAI ELECTRIC CO LTD·Filed 2002·Granted Apr 6, 2004·7 cites·14 claims
- 3063US2025149331A1Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3159US9123531B2Method of manufacturing semiconductor device, semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2014·Granted Sep 1, 2015·0 cites·11 claims
- 3257US2009277382A1Semiconductor manufacturing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 3357US2025308920A1Processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3456US2023230845A1Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3555US2009181547A1Method of producing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 3654US7432215B2Semiconductor device manufacturing method and semiconductor manufacturing apparatusKOKUSAI ELECTRIC CO LTD·Filed 2007·Granted Oct 7, 2008·0 cites·10 claims
- 3754US2009205568A1Substrate processing method and substrate processing apparatusMIZUNO NORIKAZU·Filed 2009·Application pending·0 cites
- 3854US2023091654A1Method of processing substrate, recording medium, substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3954US2016111466A1Method of manufacturing semiconductor device, semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
- 4053US8847343B2Method of manufacturing semiconductor device, semiconductor device and substrate processing apparatusMIZUNO NORIKAZU·Filed 2011·Granted Sep 30, 2014·0 cites·15 claims
- 4149US2010087069A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 4249US2006121746A1Semiconductor device manufacturing method and semiconductor manufacturing apparatusKOKUSAI ELECTRIC CO LTD·Filed 2006·Application pending·0 cites
- 4349US2007292974A1Substrate Processing Method and Substrate Processing ApparatusHITACHI INT ELECTRIC INC·Filed 2006·Application pending·0 cites
- 4447US2009035951A1Manufacturing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 4546US2010323507A1Substrate processing apparatus and producing method of deviceHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
- 4646US2010258530A1Substrate processing apparatus and producing method of deviceHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
- 4746US2008166886A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2007·Application pending·0 cites
- 4845US8058184B2Semiconductor device producing methodMIYA HIRONOBU·Filed 2010·Granted Nov 15, 2011·0 cites·2 claims
- 4945US2011045675A1Substrate processing apparatus and producing method of semiconductor deviceMIYA HIRONOBU·Filed 2010·Application pending·0 cites
- 5045US2009074984A1Substrate processing apparatus and coating methodHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →