Inventor · disambiguated record
Atsushi Shigeta
Also filed as: SHIGETA ATSUSHI
44 granted patents·13 pending applications·1,099 citations·filing 1993–2013
98Inventor score
Top patents by PatentIndex Score
57 records- 0194US7217662B2Method of processing a substrateTOSHIBA KK·Filed 2005·Granted May 15, 2007·26 cites·18 claims
- 0293US7014529B1Substrate processing method and substrate processing apparatusTOSHIBA KK·Filed 2005·Granted Mar 21, 2006·26 cites·20 claims
- 0392US8554356B2Processing end point detection method, polishing method, and polishing apparatusSHIMIZU NOBURU·Filed 2007·Granted Oct 8, 2013·25 cites·9 claims
- 0492US5679059APolishing aparatus and methodEBARA CORP·Filed 1995·Granted Oct 21, 1997·110 cites·83 claims
- 0591US7744445B2Polishing apparatus and polishing methodTOSHIBA KK·Filed 2005·Granted Jun 29, 2010·26 cites·13 claims
- 0691US5398459AMethod and apparatus for polishing a workpieceTOSHIBA KK·Filed 1993·Granted Mar 21, 1995·74 cites·15 claims
- 0789US5445996AMethod for planarizing a semiconductor device having a amorphous layerTOSHIBA KK·Filed 1993·Granted Aug 29, 1995·87 cites·1 claims
- 0888US5616063APolishing apparatusTOKYO SHIBAURA ELECTRIC CO·Filed 1994·Granted Apr 1, 1997·123 cites·16 claims
- 0987US8388409B2Substrate polishing apparatusNAKAO HIDETAKA·Filed 2010·Granted Mar 5, 2013·9 cites·8 claims
- 1087US5597341ASemiconductor planarizing apparatusTOSHIBA KK·Filed 1995·Granted Jan 28, 1997·60 cites·14 claims
- 1186US8152598B2Substrate treating method and substrate treating apparatusFUKUSHIMA DAI·Filed 2008·Granted Apr 10, 2012·13 cites·19 claims
- 1286US7638439B2Peripheral processing method and method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2006·Granted Dec 29, 2009·12 cites·17 claims
- 1383US7402521B2Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program thereforTOSHIBA KK·Filed 2006·Granted Jul 22, 2008·8 cites·20 claims
- 1482US7005382B2Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishingTOSHIBA KK·Filed 2003·Granted Feb 28, 2006·30 cites·8 claims
- 1582US5860181AMethod of and apparatus for cleaning workpieceEBARA CORP·Filed 1996·Granted Jan 19, 1999·64 cites·9 claims
- 1681US7435682B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Granted Oct 14, 2008·8 cites·20 claims
- 1781US5914275APolishing apparatus and method for planarizing layer on a semiconductor waferTOSHIBA KK·Filed 1997·Granted Jun 22, 1999·43 cites·24 claims
- 1881US5653623APolishing apparatus with improved exhaustEBARA CORP·Filed 1994·Granted Aug 5, 1997·38 cites·9 claims
- 1979US5948205APolishing apparatus and method for planarizing layer on a semiconductor waferTOSHIBA KK·Filed 1997·Granted Sep 7, 1999·41 cites·17 claims
- 2079US5695601AMethod for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the methodTOSHIBA KK·Filed 1995·Granted Dec 9, 1997·60 cites·10 claims
- 2178US7092045B2Projection-type display apparatusHITACHI LTD·Filed 2003·Granted Aug 15, 2006·17 cites·15 claims
- 2278US6997782B2Polishing apparatus and a method of polishing and cleaning and drying a waferTOSHIBA KK·Filed 2002·Granted Feb 14, 2006·16 cites·20 claims
- 2376US7416942B2Method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2007·Granted Aug 26, 2008·5 cites·20 claims
- 2475US5830041AMethod and apparatus for determining endpoint during a polishing processEBARA CORP·Filed 1996·Granted Nov 3, 1998·49 cites·10 claims
- 2572US7241205B2Method of processing a substrateTOSHIBA KK·Filed 2005·Granted Jul 10, 2007·5 cites·5 claims
- 2670US8119517B2Chemical mechanical polishing method and method of manufacturing semiconductor deviceSHIDA HIROTAKA·Filed 2009·Granted Feb 21, 2012·3 cites·15 claims
- 2770US7767472B2Substrate processing method and substrate processing apparatusEBARA CORP·Filed 2007·Granted Aug 3, 2010·2 cites·14 claims
- 2870US7198552B2Polishing apparatusTOSHIBA KK·Filed 2005·Granted Apr 3, 2007·2 cites·18 claims
- 2970US5846335AMethod for cleaning workpieceEBARA CORP·Filed 1997·Granted Dec 8, 1998·40 cites·39 claims
- 3067US8568199B2Polishing endpoint detection apparatusOHTA SHINROU·Filed 2010·Granted Oct 29, 2013·2 cites·11 claims
- 3167US8114776B2Method of manufacturing semiconductor deviceEDA HAJIME·Filed 2010·Granted Feb 14, 2012·3 cites·21 claims
- 3267US6743645B2Method of inspecting process for manufacturing semiconductor device and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2002·Granted Jun 1, 2004·11 cites·18 claims
- 3367US6500051B1Polishing apparatus and methodEBARA CORP·Filed 1997·Granted Dec 31, 2002·25 cites·57 claims
- 3466US8696924B2Polishing apparatus and polishing methodTADA MITSUO·Filed 2007·Granted Apr 15, 2014·4 cites·7 claims
- 3566US8685857B2Chemical mechanical polishing method of organic film and method of manufacturing semiconductor deviceMATSUI YUKITERU·Filed 2008·Granted Apr 1, 2014·2 cites·8 claims
- 3665US10207390B2Processing end point detection method, polishing method, and polishing apparatusEBARA CORP·Filed 2013·Granted Feb 19, 2019·1 cites·12 claims
- 3758US8777694B2Polishing endpoint detection methodEBARA CORP·Filed 2013·Granted Jul 15, 2014·0 cites·10 claims
- 3855US7700489B2Method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2004·Granted Apr 20, 2010·4 cites·14 claims
- 3953US7452819B2Chemical mechanical polishing method of organic film and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2004·Granted Nov 18, 2008·3 cites·15 claims
- 4052US5578531AMethod for manufacturing semiconductor deviceTOSHIBA KK·Filed 1995·Granted Nov 26, 1996·18 cites·9 claims
- 4151US6984532B2Method of judging residual film by optical measurementTOSHIBA KK·Filed 2003·Granted Jan 10, 2006·3 cites·18 claims
- 4251US2007178701A1Method of processing a substrateTOSHIBA KK·Filed 2007·Application pending·0 cites
- 4349US2007128874A1Chemical mechanical polishing method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2006·Application pending·0 cites
- 4449US2006019417A1Substrate processing method and substrate processing apparatusSHIGETA ATSUSHI·Filed 2005·Application pending·0 cites
- 4547US8506362B2Polishing apparatus and polishing methodFUKUSHIMA DAI·Filed 2008·Granted Aug 13, 2013·0 cites·8 claims
- 4647US2010255757A1Substrate processing method and substrate processing apparatusSHIGETA ATSUSHI·Filed 2010·Application pending·0 cites
- 4747US2008254719A1Substrate processing methodSHIGETA ATSUSHI·Filed 2008·Application pending·0 cites
- 4846US7413989B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2004·Granted Aug 19, 2008·1 cites·19 claims
- 4946US2009156000A1Method of manufacturing semiconductor deviceMATSUI YUKITERU·Filed 2008·Application pending·0 cites
- 5046US2009176372A1Chemical mechanical polishing slurry and semiconductor device manufacturing methodMINAMIHABA GAKU·Filed 2008·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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