Substrate processing method and substrate processing apparatus

Abstract

A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12 , polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.

1 - 18 . (canceled) 
     
     
         19 . A substrate processing apparatus for polishing a peripheral portion of a substrate, said apparatus comprising:
 a motor for rotating the substrate;   a polishing mechanism for polishing the peripheral portion of the substrate by pressing a polishing surface of said polishing mechanism against the peripheral portion while the substrate is rotated by said motor; and   an arithmetic unit for monitoring a load of the motor during polishing of the peripheral portion,   wherein said arithmetic unit is configured to
 measure an average load per unit time of the motor during polishing of the peripheral portion and a load fluctuation magnitude with respect to the average load, 
 compare the load fluctuation magnitude with a threshold value, and 
 determine an occurrence of an anomaly in polishing of the peripheral portion when the load fluctuation magnitude exceeds the threshold value. 
   
     
     
         20 . The substrate processing apparatus according to  claim 19 , wherein said polishing mechanism is configured to stop polishing of the peripheral portion of the substrate when the occurrence of the anomaly is determined. 
     
     
         21 . The substrate processing apparatus according to  claim 19 , wherein the polishing mechanism comprises a polishing tape having the polishing surface, and a polishing head for pressing the polishing tape against the peripheral portion of the substrate. 
     
     
         22 . The substrate processing apparatus according to  claim 19 , wherein said arithmetic unit is configured to monitor the load of the motor continuously or intermittently. 
     
     
         23 . A substrate processing apparatus for polishing a peripheral portion of a substrate, said apparatus comprising:
 a motor for rotating the substrate;   a polishing mechanism for polishing a first surface of the peripheral portion of the substrate by pressing a polishing surface of said polishing mechanism against the first surface; and   an arithmetic unit for calculating a polishing time of the peripheral portion,   wherein said arithmetic unit is configured to
 determine a polishing end point of the first surface by monitoring a polished state of the first surface, 
 determine a polishing time spent in polishing the first surface, and 
 determine a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface. 
   
     
     
         24 . The polishing processing apparatus according to  claim 23 , wherein said polishing mechanism comprises a polishing tape having the polishing surface, and a polishing head for pressing said polishing tape against the peripheral portion of the substrate. 
     
     
         25 . The substrate processing apparatus according to  claim 23 , wherein:
 the first surface comprises an end surface substantially perpendicular to a front surface of the substrate; and   the second surface comprises an upper sloping surface and a lower sloping surface which are adjacent to the first surface.