US2007178701A1PendingUtilityA1
Method of processing a substrate
Est. expiryMar 24, 2024(expired)· nominal 20-yr term from priority
H10P 90/128H10P 52/402H10P 70/10B24B 9/065B24B 37/02
51
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
There is disclosed a method of processing a substrate, which comprises applying a surfactant or a water soluble polymer agent onto a surface of a substrate to be processed, and sliding a circumferential portion of the substrate and a polishing member against each other to polish the circumferential portion of the substrate.
Claims
exact text as granted — not AI-modified1 - 18 . (canceled)
19 . A program of processing a substrate readable and executable by a computer, comprising:
applying a surfactant or a water soluble polymer agent onto a surface of a substrate to be processed; and sliding a circumferential portion of the substrate and a polishing member against each other to polish the circumferential portion of the substrate.
20 . A program of processing a substrate readable and executable by a computer, according to claim 19 , further comprising cleaning the surface of the substrate, after the circumferential portion of the substrate is polished.Join the waitlist — get patent alerts
Track US2007178701A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.