Inventor · disambiguated record
Son-Kwan Hwang
Also filed as: HWANG SON-KWAN
18 granted patents·9 pending applications·84 citations·filing 2007–2025
93Inventor score
Technology areasH10W
Top patents by PatentIndex Score
27 records- 0195US8957526B2Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 17, 2015·19 cites·8 claims
- 0286US8513802B2Multi-chip package having semiconductor chips of different thicknesses from each other and related deviceMA KEUM-HEE·Filed 2011·Granted Aug 20, 2013·14 cites·22 claims
- 0384US7777345B2Semiconductor device having through electrode and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 17, 2010·12 cites·12 claims
- 0481US7875552B2Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 25, 2011·7 cites·5 claims
- 0580US9698051B2Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 4, 2017·3 cites·19 claims
- 0679US10128168B2Integrated circuit device including through-silicon via structure and method of manufacturing the sameCHOI JU IL·Filed 2014·Granted Nov 13, 2018·4 cites·17 claims
- 0777US8415804B2Semiconductor chip, method of fabricating the same, and stack module and memory card including the sameLEE HO-JIN·Filed 2009·Granted Apr 9, 2013·7 cites·28 claims
- 0875US8629059B2Methods of forming integrated circuit chips having vertically extended through-substrate vias thereinLEE HO-JIN·Filed 2010·Granted Jan 14, 2014·3 cites·18 claims
- 0972US7897511B2Wafer-level stack package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 1, 2011·4 cites·30 claims
- 1071US10777487B2Integrated circuit device including through-silicon via structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 15, 2020·1 cites·20 claims
- 1169US7847416B2Wafer level package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Dec 7, 2010·3 cites·9 claims
- 1268US8183673B2Through-silicon via structures providing reduced solder spreading and methods of fabricating the sameHWANG SON-KWAN·Filed 2009·Granted May 22, 2012·5 cites·30 claims
- 1368US2025210529A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1466US12266609B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 1, 2025·0 cites·19 claims
- 1565US9219035B2Integrated circuit chips having vertically extended through-substrate vias thereinLEE HO-JIN·Filed 2014·Granted Dec 22, 2015·1 cites·8 claims
- 1658US7948089B2Chip stack package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 24, 2011·1 cites·15 claims
- 1752US2017345713A1Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 1849US2007269931A1Wafer level package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1946US2008230877A1Semiconductor package having wire redistribution layer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2046US2009085224A1Stack-type semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2145US8482129B2Wafer-level stack package and method of fabricating the sameLEE IN-YOUNG·Filed 2011·Granted Jul 9, 2013·0 cites·6 claims
- 2243US2014329382A1Method of fabricating semiconductor device having bumpSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2342US2013313722A1Through-silicon via (tsv) semiconductor devices having via pad inlaysSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2441US2013221519A1Semiconductor devices including dummy solder bumpsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2540US8564102B2Semiconductor device having through silicon via (TSV)CHOI JU-IL·Filed 2011·Granted Oct 22, 2013·0 cites·12 claims
- 2639US8119448B2Semiconductor chip, wafer stack package using the same, and methods of manufacturing the sameHWANG SON-KWAN·Filed 2010·Granted Feb 21, 2012·0 cites·12 claims
- 2739US2018122721A1Plug structure of a semiconductor chip and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →