Assignee
LEE IN YOUNG
KR·3 granted patents·3 pending applications·5 citations·filing 2005–2016
Top patents by PatentIndex Score
6 records- 0176US10767248B2Plastic deformation magnesium alloy having excellent thermal conductivity and flame retardancy, and preparation methodLEE IN YOUNG·Filed 2016·Granted Sep 8, 2020·1 cites·2 claims
- 0271US8324733B2Semiconductor device comprising a through electrode and a pad connected to the through electrode and having an exposed portion and method for fabricating the sameLEE IN YOUNG·Filed 2010·Granted Dec 4, 2012·4 cites·11 claims
- 0351US2007205512A1Solder bump structure for flip chip package and method for manufacturing the sameLEE IN-YOUNG·Filed 2007·Application pending·0 cites
- 0445US8482129B2Wafer-level stack package and method of fabricating the sameLEE IN-YOUNG·Filed 2011·Granted Jul 9, 2013·0 cites·6 claims
- 0543US2006019467A1Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed therebyLEE IN-YOUNG·Filed 2005·Application pending·0 cites
- 0638US2019112693A1Plastic deformation magnesium alloy having excellent thermal conductivity and flame retardancy, and preparation method thereforLEE IN YOUNG·Filed 2016·Application pending·0 cites
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