Assignee
LEE HO JIN
KR·20 granted patents·3 pending applications·150 citations·filing 2007–2016
Top patents by PatentIndex Score
23 records- 0197US8592991B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO-JIN·Filed 2011·Granted Nov 26, 2013·31 cites·30 claims
- 0294US9859191B2Semiconductor device including conductive via with buffer layer at tapered portion of conductive viaLEE HO-JIN·Filed 2016·Granted Jan 2, 2018·12 cites·11 claims
- 0393US8592988B2Semiconductor deviceLEE HO-JIN·Filed 2011·Granted Nov 26, 2013·19 cites·11 claims
- 0492US8952543B2Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devicesLEE HO-JIN·Filed 2012·Granted Feb 10, 2015·15 cites·25 claims
- 0589US9941196B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO JIN·Filed 2016·Granted Apr 10, 2018·5 cites·16 claims
- 0689US8335255B2Motion estimation method, medium, and system with fast motion estimationLEE HO-JIN·Filed 2007·Granted Dec 18, 2012·13 cites·17 claims
- 0788US9852965B2Semiconductor devices with through electrodes and methods of fabricating the sameLEE HO-JIN·Filed 2016·Granted Dec 26, 2017·6 cites·20 claims
- 0888US8637989B2Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodesLEE HO-JIN·Filed 2012·Granted Jan 28, 2014·9 cites·5 claims
- 0984US8492902B2Multi-layer TSV insulation and methods of fabricating the sameLEE HO-JIN·Filed 2011·Granted Jul 23, 2013·8 cites·14 claims
- 1083US9171753B2Semiconductor devices having conductive via structures and methods for fabricating the sameLEE HO-JIN·Filed 2013·Granted Oct 27, 2015·7 cites·19 claims
- 1178US9153489B2Microelectronic devices having conductive through via electrodes insulated by gap regionsLEE HO-JIN·Filed 2012·Granted Oct 6, 2015·5 cites·20 claims
- 1277US8564139B2Semiconductor devices including protected barrier layersLEE HO-JIN·Filed 2012·Granted Oct 22, 2013·4 cites·18 claims
- 1377US8415804B2Semiconductor chip, method of fabricating the same, and stack module and memory card including the sameLEE HO-JIN·Filed 2009·Granted Apr 9, 2013·7 cites·28 claims
- 1475US8629059B2Methods of forming integrated circuit chips having vertically extended through-substrate vias thereinLEE HO-JIN·Filed 2010·Granted Jan 14, 2014·3 cites·18 claims
- 1570US8433293B2Apparatus and method for providing contents push service, and mobile terminal and operation method thereofLEE HO-JIN·Filed 2007·Granted Apr 30, 2013·4 cites·15 claims
- 1665US9219035B2Integrated circuit chips having vertically extended through-substrate vias thereinLEE HO-JIN·Filed 2014·Granted Dec 22, 2015·1 cites·8 claims
- 1763US9025089B2Touch panel deviceLEE HO-JIN·Filed 2010·Granted May 5, 2015·1 cites·11 claims
- 1859US8442359B2Image interpolation method and apparatus using reference block based on directionLEE HO JIN·Filed 2010·Granted May 14, 2013·0 cites·19 claims
- 1957US8395678B2Apparatus and method of reproducing colorLEE HO JIN·Filed 2009·Granted Mar 12, 2013·0 cites·19 claims
- 2057US8217768B2Video reproduction apparatus and method for providing haptic effectsLEE HO-JIN·Filed 2009·Granted Jul 10, 2012·0 cites·12 claims
- 2151US2010105169A1Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodesLEE HO-JIN·Filed 2009·Application pending·0 cites
- 2239US2012092214A1Method of receiving gnss signal and apparatus thereofLEE HO JIN·Filed 2011·Application pending·0 cites
- 2338US2012049349A1Semiconductor chips and methods of forming the sameLEE HO-JIN·Filed 2011·Application pending·0 cites
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