Inventor · disambiguated record
Yun-Hyeok Im
Also filed as: IM YUN-HYEOK
27 granted patents·10 pending applications·379 citations·filing 2002–2021
96Inventor score
Top patents by PatentIndex Score
37 records- 0198US8921990B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 30, 2014·86 cites·13 claims
- 0295US9589945B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 7, 2017·15 cites·16 claims
- 0394US8791562B2Stack package and semiconductor package including the sameLEE CHUNG-SUN·Filed 2011·Granted Jul 29, 2014·34 cites·17 claims
- 0494US6891259B2Semiconductor package having dam and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 10, 2005·80 cites·5 claims
- 0589US8643179B2Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor packageIM YUN-HYEOK·Filed 2011·Granted Feb 4, 2014·11 cites·22 claims
- 0689US6835598B2Stacked semiconductor module and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 28, 2004·61 cites·28 claims
- 0785US7699520B2Micro heat flux sensor arraySAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Apr 20, 2010·10 cites·14 claims
- 0884US11244936B2Semiconductor device package and apparatus comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 8, 2022·3 cites·13 claims
- 0984US8587134B2Semiconductor packagesIM YUN-HYEOK·Filed 2012·Granted Nov 19, 2013·8 cites·20 claims
- 1084US7388286B2Semiconductor package having enhanced heat dissipation and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 17, 2008·2 cites·20 claims
- 1184US7372148B2Semiconductor chip having coolant path, semiconductor package and package cooling system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 13, 2008·12 cites·43 claims
- 1280US9076881B2Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 7, 2015·4 cites·13 claims
- 1378US10607971B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 31, 2020·2 cites·23 claims
- 1474US6756668B2Semiconductor package having thermal interface material (TIM)SAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jun 29, 2004·19 cites·15 claims
- 1573US8104952B2Micro heat flux sensor arrayYOO JAE-WOOK·Filed 2010·Granted Jan 31, 2012·3 cites·8 claims
- 1672US2008213992A1Semiconductor package having enhanced heat dissipation and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1771US6781849B2Multi-chip package having improved heat spread characteristics and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 24, 2004·18 cites·24 claims
- 1870US11119517B2Method of dynamic thermal management of electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 14, 2021·1 cites·18 claims
- 1969US10852080B2Controllers, apparatuses, and methods for thermal management using adaptive thermal resistance and thermal capacitySAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 1, 2020·1 cites·16 claims
- 2069US9482584B2System and method for predicting the temperature of a deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 1, 2016·2 cites·13 claims
- 2163US11782466B2Method of dynamic thermal management of electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 10, 2023·0 cites·18 claims
- 2261US7375426B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 20, 2008·2 cites·43 claims
- 2359US11171128B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·15 claims
- 2459US7601561B2Heat-radiating tape carrier package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 13, 2009·1 cites·23 claims
- 2554US9293389B2Method of manufacturing a semiconductor package including a surface profile modifierSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 22, 2016·0 cites·3 claims
- 2652US7081375B2Semiconductor package having thermal interface material (TIM)SAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 25, 2006·4 cites·8 claims
- 2751US2005189093A1Apparatus for transferring heat and method of manufacturing the sameFiled 2005·Application pending·0 cites
- 2850US2018315740A1Semiconductor device package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 2947US9666503B2Semiconductor package and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 30, 2017·0 cites·20 claims
- 3042US2007108599A1Semiconductor chip package with a metal substrate and semiconductor module having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3141US11658094B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 23, 2023·0 cites·18 claims
- 3241US2006157826A1Multi-path printed circuit board having heterogeneous layers and power delivery system including the sameLEE HEE-SEOK·Filed 2005·Application pending·0 cites
- 3341US2015062824A1Semiconductor device having thermoelectric moduleSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 3439US2003085475A1Semiconductor package having dam and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Application pending·0 cites
- 3538US2004250989A1Clothespin type heat dissipating apparatus for semiconductor moduleFiled 2004·Application pending·0 cites
- 3638US2006075760A1Temperature measuring device using a matrix switch, a semiconductor package and a cooling systemIM YUN-HYEOK·Filed 2005·Application pending·0 cites
- 3730US2016315029A1Semiconductor package and three-dimensional semiconductor package including the sameLEE DONG-HAN·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →