Assignee
LEE CHUNG-SUN
KR·2 granted patents·3 pending applications·109 citations·filing 2005–2011
Top patents by PatentIndex Score
5 records- 0197US8604615B2Semiconductor device including a stack of semiconductor chips, underfill material and molding materialLEE CHUNG-SUN·Filed 2011·Granted Dec 10, 2013·75 cites·42 claims
- 0294US8791562B2Stack package and semiconductor package including the sameLEE CHUNG-SUN·Filed 2011·Granted Jul 29, 2014·34 cites·17 claims
- 0343US2006071303A1Film substrate of a semiconductor package and a manufacturing methodLEE CHUNG-SUN·Filed 2005·Application pending·0 cites
- 0439US2005205524A1Method of manufacturing tape wiring substrateLEE CHUNG-SUN·Filed 2005·Application pending·0 cites
- 0537US2007007664A1Semiconductor package with molded back side and method of fabricating the sameLEE CHUNG-SUN·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →