Apparatus for transferring heat and method of manufacturing the same

Abstract

An apparatus and method for manufacturing a heat transfer device for a semiconductor device are provided. The method of manufacturing the heat transfer device may include at least providing a composite material film having uniformly dispersed metal powder and binder powder and a region intended for a fluid channel packed with a packing material, melting the binder powder by heating the composite material film, pressing the metal powder, sintering the metal powder to form the thin film metal sintered body, and forming the fluid channel inside the thin film metal sintered body by removing the packing structure.

1 . A method of manufacturing, comprising: 
 providing a composite material film having uniformly dispersed metal powder and binder powder and a region intended for a fluid channel packed with a packing material;    melting the binder powder by heating the composite material film;    forming a packing structure in the region intended for the fluid channel by heating the packing material;    pressing the metal powder;    sintering the metal powder to form a thin film metal sintered body; and    forming the fluid channel inside the thin film metal sintered body by removing the packing structure.    
     
     
         2 . The method of  claim 1 , wherein the thin film metal sintered body has a thickness of approximately 0.1 to 3 mm.  
     
     
         3 . The method of  claim 1 , wherein the fluid channel has a diameter of approximately 0.1 to 2.5 mm.  
     
     
         4 . The method of  claim 1 , wherein the binder powder is a thermoplastic resin.  
     
     
         5 . The method of  claim 4 , wherein the thermoplastic resin is a polyolefin.  
     
     
         6 . The method of  claim 5 , wherein the polyolefin is one or more of a polyethylene, polypropylene, ethylene-vinylacetate copolymer, polymethylacrylate, polybutylacrylate, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyester, polyether, and polyvinyl alcohol.  
     
     
         7 . The method of  claim 1 , wherein the binder powder includes a plasticizer.  
     
     
         8 . The method of  claim 1 , wherein the packing material is a thermally curable resin.  
     
     
         9 . The method of  claim 8 , wherein thermally curable resin is one or more of a phthalic ester, adipic ester, trimeritic ester, and sebacic ester.  
     
     
         10 . The method of  claim 8 , wherein the packing material is cured at approximately a higher temperature than the melting temperature of the binder powder.  
     
     
         11 . The method of  claim 10 , wherein the metal powder is pressed at approximately a higher temperature than the curing temperature of the packing material.  
     
     
         12 . The method of  claim 1 , further comprising removing the binder powder performed between the pressing of the metal powder and the sintering of the metal powder.  
     
     
         13 . The method of  claim 12 , wherein the binder powder is removed by at least one of heating and decomposition.  
     
     
         14 . The method of  claim 13 , wherein the binder powder is decomposed at approximately a higher temperature than the pressing temperature of the metal powder.  
     
     
         15 . The method of  claim 12 , wherein the metal powder is sintered at approximately a higher temperature than the decomposition temperature of the binder powder.  
     
     
         16 . The method of  claim 1 , wherein the packing structure is removed by at least one of heating and decomposition.  
     
     
         17 . The method of  claim 16 , wherein the packing material is decomposed at approximately a higher temperature than the sintering temperature of the metal powder.  
     
     
         18 . A method of manufacturing, comprising: 
 providing a composite material film having uniformly dispersed metal powder and binder powder and a region intended for a fluid channel embedded with a packing structure;    melting the binder powder by heating the composite material film;    pressing the metal powder;    sintering the metal powder to form a thin film metal sintered body; and    forming the fluid channel inside the thin film metal sintered body by removing the packing structure.    
     
     
         19 . The method of  claim 18 , wherein the thin film metal sintered body has a thickness of approximately 0.1 to 3 mm.  
     
     
         20 . The method of  claim 18 , wherein the fluid channel has a diameter of approximately 0.1 to 2.5 mm.  
     
     
         21 . The method of  claim 18 , wherein the binder powder is a thermoplastic resin.  
     
     
         22 . The method of  claim 21 , wherein the thermoplastic resin is a polyolefin.  
     
     
         23 . The method of  claim 22 , wherein the polyolefin is one or more of a polyethylene, polypropylene, ethylene-vinylacetate copolymer, polymethylacrylate, polybutylacrylate, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyester, polyether, and polyvinyl alcohol.  
     
     
         24 . The method of  claim 18 , wherein the binder powder includes a plasticizer.  
     
     
         25 . The method of  claim 18 , wherein the packing structure is a thermally curable resin.  
     
     
         26 . The method of  claim 25 , wherein thermally curable resin is one of a phthalic ester, adipic ester, trimeritic ester, and sebacic ester.  
     
     
         27 . The method of  claim 18 , wherein the metal powder is pressed at approximately a higher temperature than the melting temperature of the binder powder.  
     
     
         28 . The method of  claim 18 , further comprising removing the binder powder performed between the pressing of the metal powder and the sintering of the metal powder.  
     
     
         29 . The method of  claim 28 , wherein the binder powder is removed by at least one of heating and decomposition.  
     
     
         30 . The method of  claim 29 , wherein the binder powder is decomposed at approximately a higher temperature than the pressing temperature of the metal powder.  
     
     
         31 . The method of  claim 28 , wherein the metal powder is sintered at approximately a higher temperature than the decomposition temperature of the binder powder.  
     
     
         32 . The method of  claim 31 , wherein the packing structure is melted at approximately a higher temperature than the sintering temperature of the metal powder.  
     
     
         33 . A heat transfer apparatus for a semiconductor device, comprising: 
 a thin film metal sintered body including a fluid channel passing through inside the thin film metal sintered body so that a cooling fluid flows inside the thin film metal sintered body.    
     
     
         34 . The heat transfer apparatus of  claim 33 , wherein the fluid channel is formed in a curved shape.  
     
     
         35 . The heat transfer apparatus of  claim 33 , wherein the thin film metal sintered body has a thickness of approximately 0.1 to 3 mm.  
     
     
         36 . The heat transfer apparatus of  claim 33 , wherein the fluid channel has a diameter of approximately 0.1 to 2.5 mm.  
     
     
         37 . The heat transfer apparatus of  claim 33 , wherein the thin film metal sintered body is uniformly dispersed with metal power and binder powder.  
     
     
         38 . The heat transfer apparatus of  claim 37 , wherein the binder powder is a thermoplastic resin.  
     
     
         39 . The heat transfer apparatus of  claim 38 , wherein the thermoplastic resin is a polyolefin.  
     
     
         40 . The heat transfer apparatus of  claim 39 , wherein the polyolefin is one or more of a polyethylene, polypropylene, ethylene-vinylacetate copolymer, polymethylacrylate, polybutylacrylate, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyester, polyether, and polyvinyl alcohol.  
     
     
         41 . The heat transfer apparatus of  claim 37 , wherein the binder powder includes a plasticizer.  
     
     
         42 . The heat transfer apparatus of  claim 33 , wherein the cooling fluid is at least one of a distilled water, a methyl alcohol, an acetone, a gas cooling fluid, and a powder cooling fluid.  
     
     
         43 . A heat transfer apparatus manufactured according to the method of  claim 1 .  
     
     
         44 . A heat transfer apparatus manufactured according to the method of  claim 18.