Semiconductor package having enhanced heat dissipation and method of fabricating the same

Abstract

A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate. A method of fabricating the semiconductor chip package is also provided.

1 . A method of fabricating a semiconductor package, comprising:
 adhering a semiconductor chip to a top surface of a substrate;   adhering metal balls to a flat metal plate;   forming a first heat spreader by cutting the flat metal plate in accordance with a size of an upper surface of the semiconductor chip;   adhering the first heat spreader to the upper surface of the semiconductor chip; and,   adhering a ball terminal to a ball terminal land formed on a bottom surface of the substrate.   
   
   
       2 . The method of  claim 1 , further comprising coating the upper surface of the semiconductor chip with a polyamide material. 
   
   
       3 . The method of  claim 1 , wherein adhering metal balls to the flat metal plate comprises adhering the metal balls to the metal plate through a metal bonding method. 
   
   
       4 . The method of  claim 1 , wherein adhering metal balls to the flat metal plate comprises adhering the metal balls to the metal plate using a reflow process. 
   
   
       5 . The method of  claim 1 , wherein adhering metal balls to the flat metal plate comprises adhering the metal balls to the metal plate with an adhesive. 
   
   
       6 . The method of  claim 1 , further comprising:
 molding the semiconductor chip and the substrate with a molding material leaving an upper surface of the first heat spreader exposed after adhering the first heat spreader to the upper surface of the semiconductor chip;   adhering a heat sink plate to the molded semiconductor chip, wherein the heat sink plate covers the first heat spreader; and,   adhering a heat sink to the heat sink plate.   
   
   
       7 . The method of  claim 1 , further comprising forming a second heat spreader on the first heat spreader. 
   
   
       8 . The method of  claim 7 , wherein an upper surface of the first heat spreader contacts an inside surface of the second heat spreader. 
   
   
       9 . The method of  claim 7 , further comprising heating an upper surface of the second heat spreader using an infrared ray in order to reflow the metal balls of the first heat spreader to firmly connect the metal balls to an inside surface of the second heat spreader. 
   
   
       10 . The method of  claim 7 , wherein the inside surface of the second spreader contacts an upper surface of the molding material and the upper surface of the first heat spreader.