Inventor · disambiguated record
Ian D. Melville
Also filed as: MELVILLE IAN · MELVILLE IAN D · MELVILLE IAN D W
39 granted patents·11 pending applications·248 citations·filing 2002–2018
97Inventor score
Top patents by PatentIndex Score
50 records- 0198US7955955B2Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structuresIBM·Filed 2007·Granted Jun 7, 2011·70 cites·22 claims
- 0294US8076756B2Structure for inhibiting back end of line damage from dicing and chip packaging interaction failuresLANE MICHAEL W·Filed 2011·Granted Dec 13, 2011·21 cites·20 claims
- 0392US10438894B1Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devicesGLOBALFOUNDRIES INC·Filed 2018·Granted Oct 8, 2019·13 cites·20 claims
- 0492US8120175B2Soft error rate mitigation by interconnect structureFAROOQ MUKTA G·Filed 2007·Granted Feb 21, 2012·23 cites·8 claims
- 0591US10068899B2IC structure on two sides of substrate and method of formingGLOBALFOUNDRIES INC·Filed 2016·Granted Sep 4, 2018·8 cites·17 claims
- 0690US9059167B2Structure and method for making crack stop for 3D integrated circuitsIBM·Filed 2014·Granted Jun 16, 2015·8 cites·17 claims
- 0789US8859390B2Structure and method for making crack stop for 3D integrated circuitsFAROOQ MUKTA G·Filed 2010·Granted Oct 14, 2014·9 cites·10 claims
- 0883US8610283B2Semiconductor device having a copper plugFAROOQ MUKTA G·Filed 2009·Granted Dec 17, 2013·7 cites·12 claims
- 0983US8022543B2Underbump metallurgy for enhanced electromigration resistanceIBM·Filed 2008·Granted Sep 20, 2011·11 cites·16 claims
- 1083US7648891B2Semiconductor chip shape alterationIBM·Filed 2006·Granted Jan 19, 2010·7 cites·6 claims
- 1181US7875502B2Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/cornersIBM·Filed 2010·Granted Jan 25, 2011·5 cites·9 claims
- 1281US7375021B2Method and structure for eliminating aluminum terminal pad material in semiconductor devicesIBM·Filed 2006·Granted May 20, 2008·10 cites·8 claims
- 1379US7919356B2Method and structure to reduce cracking in flip chip underfillIBM·Filed 2007·Granted Apr 5, 2011·8 cites·12 claims
- 1477US10049979B2IC structure including TSV having metal resistant to high temperatures and method of forming sameGLOBALFOUNDRIES INC·Filed 2016·Granted Aug 14, 2018·2 cites·13 claims
- 1577US7622737B2Test structures for electrically detecting back end of the line failures and methods of making and using the sameIBM·Filed 2007·Granted Nov 24, 2009·7 cites·19 claims
- 1676US8563416B2Coaxial solder bump support structureERWIN BRIAN MICHAEL·Filed 2011·Granted Oct 22, 2013·5 cites·10 claims
- 1772US6831363B2Structure and method for reducing thermo-mechanical stress in stacked viasIBM·Filed 2002·Granted Dec 14, 2004·18 cites·15 claims
- 1869US10784200B2Ionizing radiation blocking in IC chip to reduce soft errorsFAROOQ MUKTA G·Filed 2012·Granted Sep 22, 2020·2 cites·15 claims
- 1967US7573115B2Structure and method for enhancing resistance to fracture of bonding padsIBM·Filed 2006·Granted Aug 11, 2009·3 cites·14 claims
- 2064US8999764B2Ionizing radiation blocking in IC chip to reduce soft errorsFAROOQ MUKTA G·Filed 2007·Granted Apr 7, 2015·2 cites·15 claims
- 2164US8674506B2Structures and methods to reduce maximum current density in a solder ballIBM·Filed 2013·Granted Mar 18, 2014·1 cites·13 claims
- 2264US7470985B2Solder connector structure and methodIBM·Filed 2006·Granted Dec 30, 2008·2 cites·11 claims
- 2363US8446006B2Structures and methods to reduce maximum current density in a solder ballBEZAMA RASCHID J·Filed 2009·Granted May 21, 2013·2 cites·22 claims
- 2460US7732932B2Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/cornersIBM·Filed 2007·Granted Jun 8, 2010·1 cites·31 claims
- 2559US8786059B2Passivation layer surface topography modifications for improved integrity in packaged assembliesBLANDER ALEXANDRE·Filed 2012·Granted Jul 22, 2014·1 cites·17 claims
- 2656US8486814B2Wafer backside defectivity clean-up utilizing selective removal of substrate materialCLARK JENNIFER C·Filed 2011·Granted Jul 16, 2013·1 cites·4 claims
- 2756US8236615B2Passivation layer surface topography modifications for improved integrity in packaged assembliesBLANDER ALEXANDRE·Filed 2009·Granted Aug 7, 2012·1 cites·9 claims
- 2856US2010019354A1Semiconductor chip shape alterationIBM·Filed 2009·Application pending·0 cites
- 2955US8741769B2Semiconductor device having a copper plugIBM·Filed 2013·Granted Jun 3, 2014·0 cites·7 claims
- 3054US8749059B2Semiconductor device having a copper plugFAROOQ MUKTA G·Filed 2012·Granted Jun 10, 2014·0 cites·7 claims
- 3152US8835289B2Wafer backside defectivity clean-up utilizing selective removal of substrate materialIBM·Filed 2013·Granted Sep 16, 2014·0 cites·12 claims
- 3252US7867887B2Structure and method for enhancing resistance to fracture of bonding padsIBM·Filed 2008·Granted Jan 11, 2011·0 cites·6 claims
- 3352US2018337089A1Ic structure including tsv having metal resistant to high temperatures and method of forming sameGLOBALFOUNDRIES INC·Filed 2018·Application pending·0 cites
- 3451US8922019B2Semiconductor device having a copper plugINTERNATINOAL BUSINESS MACHINES CORP·Filed 2013·Granted Dec 30, 2014·0 cites·21 claims
- 3551US8445374B2Soft error rate mitigation by interconnect structureFAROOQ MUKTA G·Filed 2012·Granted May 21, 2013·0 cites·15 claims
- 3650US9431359B2Coaxial solder bump support structureIBM·Filed 2013·Granted Aug 30, 2016·0 cites·18 claims
- 3749US7816248B2Solder connector structure and methodIBM·Filed 2008·Granted Oct 19, 2010·0 cites·14 claims
- 3849US2015001714A1Stress-resilient chip structure and dicing processIBM·Filed 2014·Application pending·0 cites
- 3948US2013161822A1Controlling density of particles within underfill surrounding solder bump contactsIBM·Filed 2013·Application pending·0 cites
- 4046US10211175B2Stress-resilient chip structure and dicing processIBM·Filed 2012·Granted Feb 19, 2019·0 cites·13 claims
- 4145US9947645B2Multi-project wafer with IP protection by reticle mask pattern modificationGLOBALFOUNDRIES SG PTE LTD·Filed 2015·Granted Apr 17, 2018·0 cites·20 claims
- 4244US9069923B2IP protectionTAN SOON YOENG·Filed 2011·Granted Jun 30, 2015·0 cites·19 claims
- 4343US10276461B2Split probe pad structure and methodGLOBALFOUNDRIES INC·Filed 2017·Granted Apr 30, 2019·0 cites·20 claims
- 4443US2008038913A1Methods of forming aluminum-free wire bond pad and pad so formedIBM·Filed 2006·Application pending·0 cites
- 4543US2012168956A1Controlling density of particles within underfill surrounding solder bump contactsBARBEAU STEPHANE S·Filed 2011·Application pending·0 cites
- 4642US2007187828A1Ild layer with intermediate dielectric constant material immediately below silicon dioxide based ild layerIBM·Filed 2006·Application pending·0 cites
- 4742US2008029898A1Via stack structuresFAROOQ MUKTA G·Filed 2006·Application pending·0 cites
- 4841US2008057677A1Chip location identificationIBM·Filed 2006·Application pending·0 cites
- 4940US2007080455A1Semiconductors and methods of makingIBM·Filed 2005·Application pending·0 cites
- 5040US2015303102A1Semiconductor wafer with nonstick seal regionIBM·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →