Inventor · disambiguated record
Nobuyuki Kurashima
Also filed as: KURASHIMA NOBUYUKI
40 granted patents·16 pending applications·249 citations·filing 2001–2021
97Inventor score
Top patents by PatentIndex Score
56 records- 0195US10352626B2Heat pipeSHINKO ELECTRIC IND CO·Filed 2017·Granted Jul 16, 2019·6 cites·14 claims
- 0292US9137900B2Electronic component incorporated substrate and method for manufacturing electronic component incorporated substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Sep 15, 2015·15 cites·12 claims
- 0391US11592240B2Loop-type heat pipe with vapor moving path in liquid pipeSHINKO ELECTRIC IND CO·Filed 2020·Granted Feb 28, 2023·2 cites·11 claims
- 0491US10704838B2Loop heat pipeSHINKO ELECTRIC IND CO·Filed 2017·Granted Jul 7, 2020·8 cites·10 claims
- 0590US9036362B2Electronic component incorporated substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted May 19, 2015·11 cites·7 claims
- 0690US7307344B2Semiconductor device including a discontinuous film and method for manufacturing the sameTOSHIBA KK·Filed 2005·Granted Dec 11, 2007·17 cites·4 claims
- 0788US10408546B2Loop heat pipeSHINKO ELECTRIC IND CO·Filed 2017·Granted Sep 10, 2019·5 cites·12 claims
- 0887US7042099B2Semiconductor device containing a dummy wireTOSHIBA KK·Filed 2003·Granted May 9, 2006·35 cites·22 claims
- 0986US10524388B2Loop heat pipe and electronic deviceSHINKO ELECTRIC IND CO·Filed 2018·Granted Dec 31, 2019·2 cites·10 claims
- 1083US7842191B2CMP slurry for metallic film, polishing method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2006·Granted Nov 30, 2010·7 cites·11 claims
- 1183US7105423B2Method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted Sep 12, 2006·12 cites·7 claims
- 1283US6924227B2Slurry for chemical mechanical polishing and method of manufacturing semiconductor deviceJSR CORP·Filed 2001·Granted Aug 2, 2005·28 cites·20 claims
- 1383US6858539B2Post-CMP treating liquid and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2002·Granted Feb 22, 2005·24 cites·9 claims
- 1481US11384993B2Heat pipeSHINKO ELECTRIC IND CO·Filed 2019·Granted Jul 12, 2022·1 cites·14 claims
- 1580US6935928B2Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing methodTOSHIBA KK·Filed 2004·Granted Aug 30, 2005·24 cites·20 claims
- 1679US10497640B2Heat pipeSHINKO ELECTRIC IND CO·Filed 2018·Granted Dec 3, 2019·2 cites·7 claims
- 1779US7655559B2Post-CMP treating liquid and manufacturing method of semiconductor device using the sameTOSHIBA KK·Filed 2006·Granted Feb 2, 2010·5 cites·9 claims
- 1876US8575030B2Semiconductor device manufacturing methodMINAMIHABA GAKU·Filed 2011·Granted Nov 5, 2013·4 cites·20 claims
- 1976US7498259B2Through electrode and method for forming the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Mar 3, 2009·5 cites·6 claims
- 2072US7521350B2Manufacturing method of a semiconductor deviceTOSHIBA KK·Filed 2006·Granted Apr 21, 2009·4 cites·18 claims
- 2171US7833431B2Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2006·Granted Nov 16, 2010·3 cites·20 claims
- 2270US10962301B2Loop heat pipeSHINKO ELECTRIC IND CO·Filed 2019·Granted Mar 30, 2021·1 cites·11 claims
- 2370US8337715B2CMP slurry for metallic film, polishing method and method of manufacturing semiconductor deviceMINAMIHABA GAKU·Filed 2010·Granted Dec 25, 2012·2 cites·12 claims
- 2468US11333443B2Loop heat pipeSHINKO ELECTRIC IND CO·Filed 2019·Granted May 17, 2022·1 cites·20 claims
- 2568US10712098B2Loop heat pipe and method of manufacturing loop heat pipeSHINKO ELECTRIC IND CO·Filed 2018·Granted Jul 14, 2020·1 cites·12 claims
- 2668US8987919B2Built-in electronic component substrate and method for manufacturing the substrateSHINKO ELECTRIC IND CO·Filed 2014·Granted Mar 24, 2015·2 cites·15 claims
- 2766US10495386B2Loop heat pipe and electronic deviceSHINKO ELECTRIC IND CO·Filed 2018·Granted Dec 3, 2019·1 cites·18 claims
- 2863US7494931B2Method for fabricating semiconductor device and polishing methodTOSHIBA KK·Filed 2006·Granted Feb 24, 2009·1 cites·16 claims
- 2963US2022011055A1Flat loop heat pipeSHINKO ELECTRIC IND CO·Filed 2021·Application pending·0 cites
- 3061US6790769B2CMP slurry and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2002·Granted Sep 14, 2004·6 cites·8 claims
- 3160US7827681B2Method of manufacturing electronic component integrated substrateSHINKO ELECTRIC IND CO·Filed 2008·Granted Nov 9, 2010·2 cites·7 claims
- 3259US6995090B2Polishing slurry for use in CMP of SiC series compound, polishing method, and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2002·Granted Feb 7, 2006·6 cites·17 claims
- 3355US11143461B2Flat loop heat pipeSHINKO ELECTRIC IND CO·Filed 2019·Granted Oct 12, 2021·0 cites·6 claims
- 3455US7951717B2Post-CMP treating liquid and manufacturing method of semiconductor device using the sameTOSHIBA KK·Filed 2007·Granted May 31, 2011·0 cites·9 claims
- 3554US7825028B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2008·Granted Nov 2, 2010·0 cites·19 claims
- 3652US6737363B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2001·Granted May 18, 2004·3 cites·6 claims
- 3750US2010093585A1Post-cmp treating liquid and manufacturing method of semiconductor device using the sameKURASHIMA NOBUYUKI·Filed 2009·Application pending·0 cites
- 3850US2008124927A1Semiconductor device including a discontinuous film and method for manufacturing the sameTOSHIBA KK·Filed 2007·Application pending·0 cites
- 3949US6945854B2Semiconductor device fabrication method and apparatusTOSHIBA KK·Filed 2004·Granted Sep 20, 2005·3 cites·20 claims
- 4049US2006001173A1Through electrode and method for forming the sameYAMANO TAKAHARU·Filed 2005·Application pending·0 cites
- 4148US8174125B2Manufacturing method of a semiconductor deviceKURASHIMA NOBUYUKI·Filed 2009·Granted May 8, 2012·0 cites·22 claims
- 4248US2005118819A1Post-CMP treating liquid and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Application pending·0 cites
- 4348US2010155992A1Mold resin molding method and mold resin molding apparatusSHINKO ELECTRIC IND CO·Filed 2009·Application pending·0 cites
- 4446US2009176372A1Chemical mechanical polishing slurry and semiconductor device manufacturing methodMINAMIHABA GAKU·Filed 2008·Application pending·0 cites
- 4545US7198729B2CMP slurry and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2004·Granted Apr 3, 2007·0 cites·17 claims
- 4644US2009068840A1Polishing liquid and method for manufacturing semiconductor deviceMINAMIHABA GAKU·Filed 2008·Application pending·0 cites
- 4743US2007232068A1Slurry for touch-up CMP and method of manufacturing semiconductor deviceMINAMIHABA GAKU·Filed 2007·Application pending·0 cites
- 4843US2007049180A1Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devicesTOSHIBA KK·Filed 2006·Application pending·0 cites
- 4943US2008045016A1Cleaning composition, cleaning method, and manufacturing method of semiconductor deviceJSR CORP·Filed 2007·Application pending·0 cites
- 5042US8736053B2Semiconductor deviceTANAKA KOICHI·Filed 2012·Granted May 27, 2014·0 cites·10 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →