Inventor · disambiguated record
Kyung Taeg Han
Also filed as: HAN KYUNG T · HAN KYUNG TAEG
27 granted patents·7 pending applications·2,779 citations·filing 2003–2015
97Inventor score
Top patents by PatentIndex Score
34 records- 0199US8013352B2Chip coated light emitting diode package and manufacturing method thereofSAMSUNG LED CO LTD·Filed 2010·Granted Sep 6, 2011·479 cites·13 claims
- 0299US7790482B2Light emitting diode package with diffuser and method of manufacturing the sameSAMSUNG LED CO LTD·Filed 2009·Granted Sep 7, 2010·474 cites·3 claims
- 0399US7501656B2Light emitting diode package with diffuser and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Mar 10, 2009·486 cites·6 claims
- 0498US8324646B2Chip coated light emitting diode package and manufacturing method thereofLEE SEON GOO·Filed 2010·Granted Dec 4, 2012·479 cites·25 claims
- 0598US7208772B2High power light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2005·Granted Apr 24, 2007·69 cites·29 claims
- 0697US7458703B2Light emitting diode package having dual lens structure for lateral light emissionSAMSUNG ELECTRO MECH·Filed 2006·Granted Dec 2, 2008·60 cites·12 claims
- 0796US8735931B2Light emitting diode package and fabrication method thereofHAN KYUNG TAEG·Filed 2010·Granted May 27, 2014·460 cites·10 claims
- 0896US7714342B2Chip coated light emitting diode package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted May 11, 2010·41 cites·11 claims
- 0992US7626250B2High power LED package and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Dec 1, 2009·19 cites·21 claims
- 1090US7156538B2LED package for backlight unitSAMSUNG ELECTRO MECH·Filed 2004·Granted Jan 2, 2007·66 cites·5 claims
- 1189US7338823B2Side-emitting LED package and manufacturing method of the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Mar 4, 2008·16 cites·8 claims
- 1288US7833811B2Side-emitting LED package and method of manufacturing the sameSAMSUNG LED CO LTD·Filed 2008·Granted Nov 16, 2010·14 cites·4 claims
- 1387US7687292B2Light emitting diode package with metal reflective layer and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Mar 30, 2010·12 cites·7 claims
- 1487USD512694SLight-emitting diodeSAMSUNG ELECTRO MECH·Filed 2004·Granted Dec 13, 2005·33 cites·1 claims
- 1586US7462871B2Side-view light emitting diode having protective deviceSAMSUNG ELECTRO MECH·Filed 2006·Granted Dec 9, 2008·16 cites·10 claims
- 1684US7887225B2Direct-type backlight unit having surface light sourceSAMSUNG LED CO LTD·Filed 2007·Granted Feb 15, 2011·8 cites·15 claims
- 1783USD512029SLight-emitting diodeSAMSUNG ELECTRO MECH·Filed 2004·Granted Nov 29, 2005·27 cites·1 claims
- 1877US7875476B2High power LED package and fabrication method thereofSAMSUNG LED CO LTD·Filed 2009·Granted Jan 25, 2011·5 cites·10 claims
- 1977US7795052B2Chip coated light emitting diode package and manufacturing method thereofSAMSUNG LED CO LTD·Filed 2010·Granted Sep 14, 2010·3 cites·7 claims
- 2073US7678592B2LED housing and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted Mar 16, 2010·4 cites·20 claims
- 2169USRE46851EHigh power light emitting diode packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 15, 2018·1 cites·42 claims
- 2267US8168453B2Light emitting diode package and fabrication method thereofHAN KYUNG TAEG·Filed 2009·Granted May 1, 2012·3 cites·5 claims
- 2355US8435808B2Light emitting diode package and manufacturing method thereofJUNG WON HO·Filed 2011·Granted May 7, 2013·2 cites·9 claims
- 2454USRE43200EHigh power light emitting diode packageLEE SEON GOO·Filed 2008·Granted Feb 21, 2012·0 cites·33 claims
- 2553USRE44811EHigh power light emitting diode packageLEE SEON GOO·Filed 2011·Granted Mar 18, 2014·0 cites·36 claims
- 2650US2007241362A1Light emitting diode package and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2750US2008128736A1Side-emitting LED package and manufacturing method of the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2847US2006180925A1LED housing and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2947US2006284207A1Light emitting diode package with metal reflective layer and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3046US2006273337A1Side-emitting LED package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3143US8169128B2LED package having recess in heat conducting partLEE SEON GOO·Filed 2006·Granted May 1, 2012·0 cites·24 claims
- 3243US7102283B2Full-color light emitting device with four leadsSAMSUNG ELECTRO MECH·Filed 2003·Granted Sep 5, 2006·2 cites·15 claims
- 3343US2007029572A1LED having improved soldering structure, method for soldering the LED to PCB, and LED assembly manufactured by the methodSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3435US2005110027A1LED lamp having heat dissipating portionFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →