LED housing and fabrication method thereof

Abstract

The invention relates to an LED housing and its fabrication method. In the LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body. In this fashion, the invention can overcome restricted application problems by isolating the electrical connecting parts from the heat conducting part.

1 . A light emitting diode housing comprising: 
 a heat conducting part having a chip mounting area to be mounted with a light emitting diode chip, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area;    an electrical connecting part having a wiring area placed adjacent to the chip mounting area of the heat conducting part and an external power connecting area led to the wiring area; and    a housing body made of molding resin, and integrally holding the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part, wherein the housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body.    
   
   
       2 . The light emitting diode housing according to  claim 1 , wherein the electrical connecting part comprises a pair of lead to be connected with the light emitting diode chip by wires, respectively.  
   
   
       3 . The light emitting diode housing according to claim  1 , wherein the heat conducting part is electrically connected to the light emitting diode chip.  
   
   
       4 . The light emitting diode housing according to  claim 1 , wherein the chip mounting area has at outer peripheral portion extended in a light emitting direction forming into a reflector.  
   
   
       5 . The light emitting diode housing according to  claim 1 , wherein the housing body is configured to expose the chip mounting area and the heat connecting area of the heat conducting part and the wiring area of the electrical connecting part.  
   
   
       6 . The light emitting diode housing according to  claim 5 , wherein the housing body has a peripheral portion formed around and extended beyond the chip mounting area of the heat conducting part and the wiring area of the electrical connecting part, thereby forming a recess therein.  
   
   
       7 . The light emitting diode housing according to  claim 1 , wherein the heat conducting part further comprises a neck formed along an outer peripheral portion between the chip mounting area and the groove.  
   
   
       8 . A fabrication method of a light emitting diode housing, comprising steps of: 
 (a) preparing a heat conducting part having a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area;    (b) machining a sheet metal to prepare a frame having an outer periphery, at least one electrical connecting part and a plurality of holders extended from the outer periphery to the center of the frame and a hole formed in the outer periphery;    (c) inserting distal ends of the holders into the groove and placing a distal end of the electrical connecting part having the wiring area adjacent to the chip mounting area of the heat conducting part to assemble the heat conducting part to the frame;    (d) mounting a resultant structure of the heat conducting part and the frame to a mold;    (e) injecting resin into the mold to form a housing body integrally holding the heat conducting part, the electrical connecting part and the holders, with a portion of the electrical connecting part and the holders being exposed in part, while isolating the heat conducting part from the electrical connecting part; and    (f) cutting the electrical connecting part from the frame and separating the holders from the heat conducting part.    
   
   
       9 . The fabrication method according to  claim 8 , wherein the machining step (b) comprises punching.  
   
   
       10 . The fabrication method according to  claim 8 , wherein the machining step (b) comprises bending the electrical connecting part.  
   
   
       11 . The fabrication method according to  claim 8 , wherein the machining step (b) comprises bending the holders, 
 the method further comprising a step of: (g) bending the electrical connecting part after the cutting step (f).    
   
   
       12 . The fabrication method according to  claim 8 , wherein the inserting step (c) comprises arranging the distal ends of the holders opposite to each other and inserting the distal ends into the groove of the heat conducting part.  
   
   
       13 . The fabrication method according to  claim 8 , wherein the mounting step (d) comprises using the hole of the frame as a guide hole.  
   
   
       14 . The fabrication method according to  claim 8 , wherein the housing body formed in the resin injecting step (e) is configured to expose the chip mounting area and the heat connecting area of the heat conducting part, a side of the distal end of the electrical connecting part and a side of the distal end of the holders adjacent to the heat conducting part.  
   
   
       15 . The fabrication method according to  claim 8 , wherein the holder separating step (f) forms recesses each extended along bottom portions of the housing body from the groove of the heat conducting part to a side of the housing body.  
   
   
       16 . A fabrication method of light emitting diode housings, comprising steps of: 
 (a) preparing a plurality of heat conducting parts each having a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area;    (b) machining a sheet metal to prepare a frame array sheet each having an outer periphery, at least one electrical connecting part and a plurality of holders extended from the outer periphery to the center of the frame and a hole formed in the outer periphery;    (c) inserting distal ends of the holders into the groove and placing a distal end of the electrical connecting part having the wiring area adjacent to the chip mounting area of the heat conducting part to assemble the heat conducting part to the frame;    (d) mounting a resultant structure of the heat conducting parts and the frame array sheet to molds;    (e) injecting resin into the mold to form a plurality of housing bodies each integrally holding the heat conducting part, the electrical connecting part and the holders, with a portion of the electrical connecting part and the holders being exposed in part, while isolating the heat conducting part from the electrical connecting part; and    (f) cutting the electrical connecting parts from the frame array sheet and separating the holders from the heat conducting parts.    
   
   
       17 . The fabrication method according to  claim 16 , wherein the machining step (b) comprises punching.  
   
   
       18 . The fabrication method according to  claim 16 , wherein the machining step (b) comprises bending the electrical connecting parts.  
   
   
       19 . The fabrication method according to  claim 16 , wherein the machining step (b) comprises bending the holders, 
 the method further comprising a step of: (g) bending the electrical connecting parts after the cutting step (f).    
   
   
       20 . The fabrication method according to  claim 16 , wherein the inserting step (c) comprises arranging the distal ends of the holders opposite to each other and inserting the distal ends into the grooves of the heat conducting parts.  
   
   
       21 . The fabrication method according to  claim 16 , wherein the mounting step (d) comprises using the hole of the frame array sheet as a guide hole.  
   
   
       22 . The fabrication method according to  claim 16 , wherein each of the housing bodies formed in the resin injecting step (e) is configured to expose the chip mounting area and the heat connecting area of the heat conducting part, a side of the distal end of the electrical connecting part and a side of the distal end of the holders adjacent to the heat conducting part.  
   
   
       23 . The fabrication method according to  claim 16 , wherein the holder separating step (f) forms recesses each extended along bottom portions of the housing body from the groove of the heat conducting part to a side of the housing body.