Side-emitting LED package and manufacturing method of the same

Abstract

The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.

1 . A side-emitting LED package for emitting light from a light source sideward, comprising:
 a substrate with an electrode formed thereon;   a light source electrically connected to the electrode and disposed on the substrate;   a molded part covering and protecting the substrate and the light source disposed on the substrate;   a reflective layer covering an outer surface of the molded part; and   a light transmitting surface formed in one side of the package with respect to a plane where the light source is disposed.   
   
   
       2 . The side-emitting LED package according to  claim 1 , wherein the reflective layer comprises one selected from a group consisting of a curved surface, a horizontal planar top surface with a sloped planar side surface, and a sloped planar surface. 
   
   
       3 . The side-emitting LED package according to  claim 1 , wherein the reflective layer is formed by depositing or plating metal selected from a group consisting of Al, Au, Ag, Ni, W, Ti and Pt. 
   
   
       4 . The side-emitting LED package according to  claim 1 , wherein the reflective layer is formed by attaching a high reflectivity film on the molded part. 
   
   
       5 . The side-emitting LED package according to  claim 1 , wherein the light source comprises at least one LED chip disposed inside the molded part. 
   
   
       6 . The side-emitting LED package according to  claim 1  wherein the substrate comprises a printed circuit board or a ceramic substrate with the electrode formed thereon. 
   
   
       7 . The side-emitting LED package according to  claim 1 , wherein light is transmitted through the light transmitting surface in a sideward direction perpendicular to a plane where the LED chip is disposed on. 
   
   
       8 - 15 . (canceled)