Side-emitting LED package and method of manufacturing the same

Abstract

The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.

1 . A light emitting diode (LED) package for emitting light sideward from a light source comprising: 
 a substrate with an electrode formed thereon;    a light source disposed on the substrate and electrically connected to the electrode;    a molded part having an upper surface with a center thereof depressed concavely, the molded part covering and protecting the substrate and the light source; and    a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface.    
   
   
       2 . The LED package according to  claim 1 , wherein the reflection layer is formed by depositing metal selected from a group consisting of Al, Au, Ag, Ni, W, Ti, and Pt.  
   
   
       3 . The LED package according to  claim 1 , wherein the reflection layer is formed by attaching a thin film having a high reflectivity on the molded part.  
   
   
       4 . The LED package according to  claim 1 , wherein the light source comprises at least one LED chip disposed the molded part.  
   
   
       5 . The LED package according to  claim 1 , wherein the substrate is made of a printed circuit board or ceramic substrate with the electrode formed thereon.  
   
   
       6 . The LED package according to  claim 1 , wherein the reflection layer prevents light from leaking upward therethrough.  
   
   
       7 . A method of manufacturing a light emitting diode (LED) package for emitting light sideward from a light source, the method comprising steps of: 
 providing a substrate with an electrode formed thereon;    disposing a light source on the substrate;    forming a molded part on the substrate with the light source disposed thereon, the molded part having an upper surface with a center thereof depressed concavely;    forming a reflection layer for- covering an entire upper surface of the molded part; and    cutting the substrate, the molded part, and the reflection layer stacked in their order so that a light transmitting surface is formed on a cut section in the side of the molded part with the reflection layer thereon.    
   
   
       8 . The method according to  claim 7 , wherein the molded part contains phosphor and is formed by transparent Epoxy Molding Compound (EMC) transfer molding.  
   
   
       9 . The method according to  claim 7 , wherein the step of forming a reflection layer comprises depositing metal selected from a group consisting of Al, Au, Ag, Ni, W, Ti, and Pt.  
   
   
       10 . The method according to  claim 7 , wherein the step of forming a reflection layer comprises attaching a thin film having a high reflectivity on the molded part.  
   
   
       11 . The method according to  claim 7 , wherein the step of cutting comprises cutting the reflection layer and the substrate such that they have the same edge shape as the molded part.  
   
   
       12 . The method according to  claim 7 , wherein the step of forming a light transmitting surface comprises cutting the substrate, the molded part and the reflection layer in a direction that intersects a plane where the LED chip is disposed on.