Light emitting diode package and fabrication method thereof

Abstract

An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

1 . A light emitting diode package comprising:
 first and second lead frames made of a heat and electric conductor, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base, the second lead frame having a smaller width than the first frame and arranged apart at a predetermined interval from the first frame;   a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames;   a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames; and   a transparent encapsulant for encapsulating the light emitting diode chip.   
     
     
         2 . The light emitting diode package according to  claim 1 , wherein ends of the extensions are positioned at side portions of the package body. 
     
     
         3 . The light emitting diode package according to  claim 1 , wherein at least one of the extensions of the first lead frame extends out of the package body to form a terminal. 
     
     
         4 . The light emitting diode package according to  claim 1 , wherein the package body has a recess formed around the light emitting diode chip and a protrusion is formed in a predetermined width on an upper end of the recess. 
     
     
         5 . The light emitting diode package according to  claim 4 , wherein a portion of the transparent encapsulant fills the recess and another portion of the transparent encapsulant protrudes over the protrusion in a predetermined curvature. 
     
     
         6 . The light emitting diode package according to  claim 1 , wherein the underside surfaces of the bases of the first and second lead frames are coplanar with an underside surface of the package body. 
     
     
         7 . The light emitting diode package according to  claim 1 , wherein the first and second lead frames are arranged in parallel with each other. 
     
     
         8 . A method of fabricating a light emitting diode package comprising:
 machining a plate made of a heat and electric conductor of a predetermined thickness into a frame structure, the frame structure comprising first and second lead frame parts each having a planar base and extensions extending in opposed directions from the base, the second lead frame part formed in a smaller width than the first lead frame part and arranged apart at a predetermined interval from the first lead frame part;   bending the extensions of the first and second lead frame parts in such a way that the bases are positioned lower than the extensions so that the extensions extend in upward directions from the bases;   injection-molding a resin to form a package body, the package body surrounding the extensions of the first and second lead frame parts adjacent to the bases and thereby fixing the first and second lead frame parts in such a way that at least a part of upper surfaces and bottom surfaces of the bases of the first and second lead frame parts are exposed from the package body and distal ends of the extensions of the first and second lead frame parts extend out of side portions of the package body;   disposing a light emitting diode chip on the exposed upper surface of the base of the first lead frame part and electrically connecting the light emitting diode chip with the first and second lead frame parts;   encapsulating the light emitting diode chip with a transparent encapsulant; and   cutting the extensions of the frame structure to obtain a light emitting diode package.   
     
     
         9 . The method according to  claim 8 , wherein the step of forming a package body comprises forming a recess around the light emitting diode chip and a protrusion in a predetermined width on an upper end of the recess. 
     
     
         10 . The method according to  claim 9 , wherein the step of encapsulating comprises dispensing the transparent encapsulant in such a way that a portion of the transparent encapsulant fills the recess and another portion of the transparent encapsulant protrudes over the protrusion in a predetermined curvature. 
     
     
         11 . The method according to  claim 8 , wherein the step of forming a package body comprises forming the package body in such a way that the underside surfaces of the bases of the first and second frame parts are coplanar with an underside surface of the package body. 
     
     
         12 . The method according to  claim 8 , wherein the step of forming a frame structure comprises forming the first and second lead frame parts in parallel with each other.