Inventor · disambiguated record
Terrance Y. Lee
Also filed as: LEE TERRANCE · LEE TERRANCE Y
22 granted patents·2 pending applications·391 citations·filing 1992–2023
96Inventor score
Top patents by PatentIndex Score
24 records- 0199US10029405B2Printing a chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2017·Granted Jul 24, 2018·24 cites·13 claims
- 0299US9744724B2Apparatus for printing a chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2016·Granted Aug 29, 2017·42 cites·20 claims
- 0399US9457520B2Apparatus for printing a chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2015·Granted Oct 4, 2016·48 cites·16 claims
- 0499US9067299B2Printed chemical mechanical polishing padBAJAJ RAJEEV·Filed 2012·Granted Jun 30, 2015·60 cites·21 claims
- 0597US9157730B2PECVD processAPPLIED MATERIALS INC·Filed 2013·Granted Oct 13, 2015·49 cites·18 claims
- 0696US9458537B2PECVD processAPPLIED MATERIALS INC·Filed 2015·Granted Oct 4, 2016·12 cites·20 claims
- 0795US11673225B2Printing a chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2021·Granted Jun 13, 2023·1 cites·17 claims
- 0895US11207758B2Printing a chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2020·Granted Dec 28, 2021·2 cites·21 claims
- 0995US9816187B2PECVD processAPPLIED MATERIALS INC·Filed 2016·Granted Nov 14, 2017·8 cites·20 claims
- 1094US10843306B2Printing a chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2018·Granted Nov 24, 2020·3 cites·23 claims
- 1194US10500694B2Chemical mechanical polishing apparatus and methodsAPPLIED MATERIALS INC·Filed 2017·Granted Dec 10, 2019·7 cites·15 claims
- 1293US11613812B2PECVD processAPPLIED MATERIALS INC·Filed 2020·Granted Mar 28, 2023·2 cites·20 claims
- 1390US10793954B2PECVD processAPPLIED MATERIALS INC·Filed 2018·Granted Oct 6, 2020·3 cites·13 claims
- 1490US10060032B2PECVD processAPPLIED MATERIALS INC·Filed 2017·Granted Aug 28, 2018·3 cites·20 claims
- 1588US5292399APlasma etching apparatus with conductive means for inhibiting arcingAPPLIED MATERIALS INC·Filed 1992·Granted Mar 8, 1994·123 cites·33 claims
- 1687US12011801B2Printing a chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2023·Granted Jun 18, 2024·0 cites·13 claims
- 1785US11898249B2PECVD processAPPLIED MATERIALS INC·Filed 2023·Granted Feb 13, 2024·0 cites·17 claims
- 1879US10281261B2In-situ metrology method for thickness measurement during PECVD processesAPPLIED MATERIALS INC·Filed 2016·Granted May 7, 2019·2 cites·16 claims
- 1973US10030306B2PECVD apparatus and processAPPLIED MATERIALS INC·Filed 2013·Granted Jul 24, 2018·1 cites·16 claims
- 2069US10354875B1Techniques for improved removal of sacrificial maskVARIAN SEMICONDUCTOR EQUIPMENT ASS INC·Filed 2018·Granted Jul 16, 2019·1 cites·18 claims
- 2165US11453097B2Chemical mechanical polishing apparatus and methodsAPPLIED MATERIALS INC·Filed 2019·Granted Sep 27, 2022·0 cites·19 claims
- 2260US10527407B2In-situ metrology method for thickness measurement during PECVD processesAPPLIED MATERIALS INC·Filed 2019·Granted Jan 7, 2020·0 cites·20 claims
- 2355US2014199840A1Chemical mechanical polishing apparatus and methodsAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2447US2014251952A1Surface modified polishing padAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →