Surface modified polishing pad

Abstract

In one embodiment, a polishing pad includes a hydrophilic polymer base having a polishing surface, and a metal oxide coating. The metal oxide coating has nanoparticles of metal oxide disposed on the polishing surface. In another embodiment, a processing station includes a rotatable platen, a polishing head, and a precursor delivery system. The polishing head is configured to retain a substrate against the polishing pad. The precursor delivery system is configured to form an oxide coating on a surface of a polishing pad disposed on the platen. In yet another embodiment, a method for modifying a surface of a polishing pad includes wetting the surface of the polishing pad and delivering a precursor to the wetted surface of the polishing pad surface. The method also includes forming a metal oxide coating having nanoparticles of metal oxide on the surface from the precursor.

What is claimed is: 
     
         1 . A polishing pad comprising:
 a hydrophilic polymer base having a polishing surface; and   a metal oxide coating having nanoparticles of metal oxide disposed on the polishing surface.   
     
     
         2 . The polishing pad of  claim 1 , wherein the base comprises polyurethane, polycarbonate, a fluoropolymer, polytetrafluoroethylene, or polyphenylene sulfide. 
     
     
         3 . The polishing pad of  claim 1 , wherein the nanoparticles of metal oxide comprise silicon dioxide (SiO 2 ), aluminum oxide (Al 2 O 3 ), or germanium dioxide (GeO 2 ). 
     
     
         4 . The polishing pad of  claim 1 , wherein the metal oxide coating has a thickness between about 50 nm to about 500 nm. 
     
     
         5 . The polishing pad of  claim 1 , wherein the nanoparticles have a diameter size between about 10 nm to about 30 nm. 
     
     
         6 . The polishing pad of  claim 1 , wherein the pad is disposed in packaging configured for storage of the polishing pad. 
     
     
         7 . A processing station comprising:
 a rotatable platen;   a polishing head configured to retain a substrate against the polishing pad; and   a precursor delivery system configured to form an oxide coating on a surface of a polishing pad disposed on the platen.   
     
     
         8 . The processing station of  claim 7 , wherein the precursor delivery system comprises a precursor delivery nozzle configured to deliver a precursor fluid to the surface of the polishing pad. 
     
     
         9 . The processing station of  claim 8 , wherein the precursor delivery system further comprises a plurality of inert gas nozzles adjacent the precursor delivery nozzle, and configured to deliver a curtain of inert gas. 
     
     
         10 . The processing station of  claim 7 , wherein the precursor delivery system comprises a heater configured to heat a precursor fluid. 
     
     
         11 . A method for modifying a surface of a polishing pad, comprising:
 wetting the surface of the polishing pad;   delivering a precursor to the wetted surface of the polishing pad surface; and   forming a metal oxide coating comprising nanoparticles of metal oxide on the surface from the precursor.   
     
     
         12 . The method of  claim 11 , wherein the precursor is a moisture-sensitive gas. 
     
     
         13 . The method of  claim 12 , wherein the precursor gas is silane (SiH 4 ), trimethylaluminum (Al 2 (CH 3 ) 6 ), or germanium tetrafluoride (GeF 4 ). 
     
     
         14 . The method of  claim 10 , wherein the surface of the polishing pad is hydrophilic. 
     
     
         15 . A method for polishing a substrate on a polishing pad comprising:
 providing a polishing fluid to a polishing surface of the polishing pad, the polishing surface having a metal oxide coating having nanoparticles of metal oxide disposed on the polishing surface;   pressing the substrate against the polishing surface in the presence of the polishing fluid; and   polishing the substrate against the polishing surface in the presence of the polishing fluid.   
     
     
         16 . The method of  claim 15 , comprising:
 forming the metal oxide coating polishing surface in-situ polishing the substrate.   
     
     
         17 . The method of  claim 15 , comprising:
 forming the metal oxide coating polishing surface prior to polishing the substrate.   
     
     
         18 . The method of  claim 15 , comprising:
 forming the metal oxide coating polishing surface after polishing the substrate.   
     
     
         19 . The method of  claim 15 , comprising wetting the polishing surface of the polishing pad to form the metal oxide coating. 
     
     
         20 . The method of  claim 15 , wherein the polishing fluid comprises the metal oxide.