Chemical mechanical polishing apparatus and methods

Abstract

In one aspect, a substrate polishing apparatus is disclosed. The apparatus has a polishing platform having two or more zones, each zone adapted to contain a different slurry component. In another aspect, a substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.

The invention claimed is: 
     
         1 . A substrate polishing apparatus, comprising:
 a polishing platform having two or more zones, each zone adapted to contain a different slurry component.   
     
     
         2 . The substrate polishing apparatus of  claim 1 , comprising a linear polishing platform wherein the two or more zones are arranged across a width. 
     
     
         3 . The substrate polishing apparatus of  claim 1 , comprising a rotary polishing platform wherein the two or more zones are arranged as concentric annuli. 
     
     
         4 . The substrate polishing apparatus of  claim 1 , comprising a distributor adapted to dispense at least two of the different slurry components to the two or more zones. 
     
     
         5 . The substrate polishing apparatus of  claim 4 , wherein the distributor includes a first set of outlets adapted to disburse a first slurry component to one of the two or more zones, and a second set of outlets adapted to disburse a second slurry component to another of the two or more zones. 
     
     
         6 . The substrate polishing apparatus of  claim 1 , wherein each zone has a width of about 2 mm or more. 
     
     
         7 . The substrate polishing apparatus of  claim 1 , wherein a first zone has only an oxidation slurry component dispensed therein. 
     
     
         8 . The substrate polishing apparatus of  claim 1 , wherein a second zone has only a material removal slurry component dispensed therein. 
     
     
         9 . The substrate polishing apparatus of  claim 1 , wherein a third zone has only a corrosion inhibition slurry component dispensed therein. 
     
     
         10 . The substrate polishing apparatus of  claim 1 , wherein a first zone and a second zone include slurry components having different chemical compositions. 
     
     
         11 . The substrate polishing apparatus of  claim 1 , comprising a distribution system adapted to dispense into the two or more zones at least two different slurry components selected from a group consisting of:
 a surface modification slurry component, and   a material removal slurry component.   
     
     
         12 . The substrate polishing apparatus of  claim 1 , wherein a rinsing liquid zone is dispensed between the two or more zones. 
     
     
         13 . A substrate polishing system, comprising:
 a substrate holder adapted to hold a substrate; and   a polishing platform having a moveable polishing pad with two or more zones, each zone operable to receive a different slurry component.   
     
     
         14 . A method of polishing a substrate, comprising:
 providing a substrate in a substrate holder;   providing a polishing platform having a moveable polishing pad; and   dispensing a different slurry component into two or more zones on the polishing pad.   
     
     
         15 . A substrate polishing system, comprising:
 a substrate holder adapted to hold a substrate;   a polishing platform having a polishing pad moveable relative to the substrate; and   a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of
 a surface modification slurry component, and 
 a material removal slurry component. 
   
     
     
         16 . The system of  claim 15 , wherein the surface modification slurry component comprises an oxidation slurry component. 
     
     
         17 . The system of  claim 15 , wherein the distribution system is adapted to dispense, in a timed sequence, a corrosion inhibiting slurry component. 
     
     
         18 . The system of  claim 15 , wherein the distribution system is adapted to dispense a rinsing liquid, in a timed sequence, between the surface modification slurry component and the material removal slurry component. 
     
     
         19 . A method of polishing a substrate, comprising:
 providing a substrate in a substrate holder;   providing a polishing platform having a moveable polishing pad; and   dispensing between the polishing pad and the substrate, in a timed sequence, two or more slurry components each having a different chemical composition.   
     
     
         20 . The method of  claim 19 , wherein the two or more slurry components are selected from a group consisting of:
 a surface modification slurry component, and   a material removal slurry component.