Inventor · disambiguated record
Simon J. S. Mcelrea
Also filed as: MCELREA SIMON · MCELREA SIMON J S
18 granted patents·10 pending applications·241 citations·filing 1999–2022
94Inventor score
Top patents by PatentIndex Score
28 records- 0197US8178978B2Support mounted electrically interconnected die assemblyMCELREA SIMON J S·Filed 2009·Granted May 15, 2012·77 cites·38 claims
- 0294US7923349B2Wafer level surface passivation of stackable integrated circuit chipsVERTICAL CIRCUITS INC·Filed 2008·Granted Apr 12, 2011·37 cites·25 claims
- 0393US8723332B2Electrically interconnected stacked die assembliesMCELREA SIMON J S·Filed 2008·Granted May 13, 2014·35 cites·38 claims
- 0493US8629543B2Electrically interconnected stacked die assembliesMCELREA SIMON J S·Filed 2010·Granted Jan 14, 2014·19 cites·29 claims
- 0591US7843046B2Flat leadless packages and stacked leadless package assembliesVERTICAL CIRCUITS INC·Filed 2008·Granted Nov 30, 2010·21 cites·34 claims
- 0686US9305862B2Support mounted electrically interconnected die assemblyMCELREA SIMON J S·Filed 2012·Granted Apr 5, 2016·7 cites·17 claims
- 0784US8704379B2Semiconductor die mount by conformal die coatingCRANE SCOTT JAY·Filed 2008·Granted Apr 22, 2014·14 cites·12 claims
- 0881US8680687B2Electrical interconnect for die stacked in zig-zag configurationCO REYNALDO·Filed 2010·Granted Mar 25, 2014·7 cites·31 claims
- 0977US8872318B2Through interposer wire bond using low CTE interposer with coarse slot aperturesMCELREA SIMON·Filed 2011·Granted Oct 28, 2014·6 cites·13 claims
- 1073US8912661B2Stacked die assembly having reduced stress electrical interconnectsMCGRATH SCOTT·Filed 2010·Granted Dec 16, 2014·5 cites·24 claims
- 1173US8159053B2Flat leadless packages and stacked leadless package assembliesANDREWS JR LAWRENCE DOUGLAS·Filed 2010·Granted Apr 17, 2012·4 cites·27 claims
- 1271US9252116B2Semiconductor die mount by conformal die coatingINVENSAS CORP·Filed 2014·Granted Feb 2, 2016·2 cites·15 claims
- 1369US8847412B2Microelectronic assembly with thermally and electrically conductive underfillINVENSAS CORP·Filed 2012·Granted Sep 30, 2014·2 cites·14 claims
- 1467US9824999B2Semiconductor die mount by conformal die coatingINVENSAS CORP·Filed 2015·Granted Nov 21, 2017·1 cites·17 claims
- 1567US8324081B2Wafer level surface passivation of stackable integrated circuit chipsMCELREA SIMON J S·Filed 2011·Granted Dec 4, 2012·2 cites·9 claims
- 1653US2015017763A1Microelectronic Assembly With Thermally and Electrically Conductive UnderfillINVENSAS CORP·Filed 2014·Application pending·0 cites
- 1749US2016218088A1Support mounted electrically interconnected die assemblyINVENSAS CORP·Filed 2016·Application pending·0 cites
- 1848US2010117224A1SensorVERTICAL CIRCUITS INC·Filed 2009·Application pending·0 cites
- 1947US8742602B2Vertical electrical interconnect formed on support prior to die mountCASKEY TERRENCE·Filed 2008·Granted Jun 3, 2014·0 cites·20 claims
- 2047US2022377947A1Active cooling in a multi-device wireless chargerAIRA INC·Filed 2022·Application pending·0 cites
- 2147US2010052087A1Image SensorVERTICAL CIRCUITS INC·Filed 2009·Application pending·0 cites
- 2246US2022311278A1Free positioning multi-device wireless chargerAIRA INC·Filed 2022·Application pending·0 cites
- 2345US2009068790A1Electrical Interconnect Formed by Pulsed DispenseVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 2445US2008315407A1Three-dimensional circuitry formed on integrated circuit device using two-dimensional fabricationVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 2545US2009102038A1Chip scale stacked die packageVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 2643US6607939B2Method of making a multi-layer interconnectHONEYWELL INT INC·Filed 2001·Granted Aug 19, 2003·1 cites·4 claims
- 2734US2004124534A1Multi-layer interconnectFiled 2003·Application pending·0 cites
- 2829US6388325B2Multi-layer interconnectALLIED SIGNAL INC·Filed 1999·Granted May 14, 2002·1 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →