Assignee
VERTICAL CIRCUITS INC
US·8 granted patents·8 pending applications·284 citations·filing 1999–2010
Top patents by PatentIndex Score
16 records- 0195US7215018B2Stacked die BGA or LGA component assemblyVERTICAL CIRCUITS INC·Filed 2005·Granted May 8, 2007·80 cites·14 claims
- 0294US7923349B2Wafer level surface passivation of stackable integrated circuit chipsVERTICAL CIRCUITS INC·Filed 2008·Granted Apr 12, 2011·37 cites·25 claims
- 0394US7535109B2Die assembly having electrical interconnectVERTICAL CIRCUITS INC·Filed 2007·Granted May 19, 2009·38 cites·54 claims
- 0494US7245021B2Micropede stacked die component assemblyVERTICAL CIRCUITS INC·Filed 2005·Granted Jul 17, 2007·59 cites·12 claims
- 0592US7863159B2Semiconductor die separation methodVERTICAL CIRCUITS INC·Filed 2008·Granted Jan 4, 2011·21 cites·24 claims
- 0691US7843046B2Flat leadless packages and stacked leadless package assembliesVERTICAL CIRCUITS INC·Filed 2008·Granted Nov 30, 2010·21 cites·34 claims
- 0768US6486528B1Silicon segment programming apparatus and three terminal fuse configurationVERTICAL CIRCUITS INC·Filed 1999·Granted Nov 26, 2002·28 cites·8 claims
- 0848US2010117224A1SensorVERTICAL CIRCUITS INC·Filed 2009·Application pending·0 cites
- 0947US2010140811A1Semiconductor die interconnect formed by aerosol application of electrically conductive materialVERTICAL CIRCUITS INC·Filed 2009·Application pending·0 cites
- 1047US2010052087A1Image SensorVERTICAL CIRCUITS INC·Filed 2009·Application pending·0 cites
- 1146US2007290377A1Three Dimensional Six Surface Conformal Die CoatingVERTICAL CIRCUITS INC·Filed 2007·Application pending·0 cites
- 1245US2009068790A1Electrical Interconnect Formed by Pulsed DispenseVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 1345US2008315407A1Three-dimensional circuitry formed on integrated circuit device using two-dimensional fabricationVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 1445US2009102038A1Chip scale stacked die packageVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 1540US7705432B2Three dimensional six surface conformal die coatingVERTICAL CIRCUITS INC·Filed 2004·Granted Apr 27, 2010·0 cites·5 claims
- 1638US2011115099A1Flip-chip underfillVERTICAL CIRCUITS INC·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →