US2016218088A1PendingUtilityA1
Support mounted electrically interconnected die assembly
Est. expiryMar 12, 2028(~1.6 yrs left)· nominal 20-yr term from priority
H10W 90/24H10W 72/834H10W 90/20H10W 99/00H10W 70/093H10W 72/07131H10W 90/22H10W 90/734H10W 90/732H10W 90/00H10W 74/01H10W 72/00H10D 62/117H01L 2225/06524H01L 25/0657H10W 76/12H10W 70/60
49
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Claims
Abstract
Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.
Claims
exact text as granted — not AI-modified1 . A device comprising a support having electrical connection sites at a surface thereof, and a stacked die assembly mounted onto the surface and electrically connected to one or more of the connection sites, wherein each die in the stacked die assembly has peripheral interconnect terminals, and the die in the stack are electrically interconnected by lines or traces of an electrically conductive material, which may be an electrically conductive polymer, or an electrically conductive ink, that contacts interconnect terminals on the respective die.
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