Assignee
INVENSAS CORP
US·441 granted patents·30 pending applications·5,005 citations·filing 2011–2022
Top patents by PatentIndex Score
471 records- 0199US11264357B1Mixed exposure for large dieINVENSAS CORP·Filed 2020·Granted Mar 1, 2022·145 cites·22 claims
- 0299US10892246B2Structures and methods for low temperature bonding using nanoparticlesINVENSAS CORP·Filed 2020·Granted Jan 12, 2021·144 cites·11 claims
- 0399US10840135B2Flat metal features for microelectronics applicationsINVENSAS CORP·Filed 2019·Granted Nov 17, 2020·143 cites·18 claims
- 0499US10446456B2Integrated circuits protected by substrates with cavities, and methods of manufactureINVENSAS CORP·Filed 2018·Granted Oct 15, 2019·172 cites·8 claims
- 0599US9812185B2DRAM adjacent row disturb mitigationINVENSAS CORP·Filed 2016·Granted Nov 7, 2017·69 cites·20 claims
- 0699US8878353B2Structure for microelectronic packaging with bond elements to encapsulation surfaceINVENSAS CORP·Filed 2012·Granted Nov 4, 2014·137 cites·71 claims
- 0799US8670261B2Stub minimization using duplicate sets of signal terminalsINVENSAS CORP·Filed 2013·Granted Mar 11, 2014·78 cites·28 claims
- 0899US8372741B1Method for package-on-package assembly with wire bonds to encapsulation surfaceINVENSAS CORP·Filed 2012·Granted Feb 12, 2013·121 cites·25 claims
- 0999US8345441B1Stub minimization for multi-die wirebond assemblies with parallel windowsINVENSAS CORP·Filed 2011·Granted Jan 1, 2013·70 cites·30 claims
- 1098US11355443B2Dielets on flexible and stretchable packaging for microelectronicsINVENSAS CORP·Filed 2019·Granted Jun 7, 2022·144 cites·9 claims
- 1198US11329034B2Direct-bonded LED structure contacts and substrate contactsINVENSAS CORP·Filed 2020·Granted May 10, 2022·146 cites·23 claims
- 1298US11195748B2Interconnect structures and methods for forming sameINVENSAS CORP·Filed 2018·Granted Dec 7, 2021·68 cites·28 claims
- 1398US11069734B2Image sensor deviceINVENSAS CORP·Filed 2019·Granted Jul 20, 2021·100 cites·20 claims
- 1498US11056390B2Structures and methods for reliable packagesINVENSAS CORP·Filed 2019·Granted Jul 6, 2021·38 cites·22 claims
- 1598US10854578B2Diffused bitline replacement in stacked wafer memoryINVENSAS CORP·Filed 2019·Granted Dec 1, 2020·145 cites·18 claims
- 1698US10629567B2Multiple plated via arrays of different wire heights on same substrateINVENSAS CORP·Filed 2019·Granted Apr 21, 2020·15 cites·20 claims
- 1798US10269853B2Image sensor deviceINVENSAS CORP·Filed 2018·Granted Apr 23, 2019·32 cites·10 claims
- 1898US10115678B2Wire bond wires for interference shieldingINVENSAS CORP·Filed 2017·Granted Oct 30, 2018·26 cites·20 claims
- 1998US9899442B2Image sensor deviceINVENSAS CORP·Filed 2015·Granted Feb 20, 2018·154 cites·14 claims
- 2098US9824974B2Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assembliesINVENSAS CORP·Filed 2016·Granted Nov 21, 2017·54 cites·20 claims
- 2198US9812402B2Wire bond wires for interference shieldingINVENSAS CORP·Filed 2016·Granted Nov 7, 2017·30 cites·20 claims
- 2298US9741620B2Structures and methods for reliable packagesINVENSAS CORP·Filed 2015·Granted Aug 22, 2017·186 cites·20 claims
- 2398US9666559B2Multichip modules and methods of fabricationINVENSAS CORP·Filed 2015·Granted May 30, 2017·70 cites·19 claims
- 2498US9583456B2Multiple bond via arrays of different wire heights on a same substrateINVENSAS CORP·Filed 2015·Granted Feb 28, 2017·53 cites·20 claims
- 2598US9553071B1Multi-chip package with interconnects extending through logic chipINVENSAS CORP·Filed 2016·Granted Jan 24, 2017·30 cites·20 claims
- 2698US9502390B2BVA interposerINVENSAS CORP·Filed 2013·Granted Nov 22, 2016·59 cites·27 claims
- 2798US9478504B1Microelectronic assemblies with cavities, and methods of fabricationINVENSAS CORP·Filed 2015·Granted Oct 25, 2016·64 cites·10 claims
- 2898US9397038B1Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substratesINVENSAS CORP·Filed 2015·Granted Jul 19, 2016·27 cites·25 claims
- 2998US9379074B2Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnectsINVENSAS CORP·Filed 2014·Granted Jun 28, 2016·78 cites·20 claims
- 3098US9355997B2Integrated circuit assemblies with reinforcement frames, and methods of manufactureINVENSAS CORP·Filed 2014·Granted May 31, 2016·53 cites·22 claims
- 3198US9349706B2Method for package-on-package assembly with wire bonds to encapsulation surfaceINVENSAS CORP·Filed 2013·Granted May 24, 2016·47 cites·4 claims
- 3298US9263394B2Multiple bond via arrays of different wire heights on a same substrateINVENSAS CORP·Filed 2013·Granted Feb 16, 2016·66 cites·12 claims
- 3398US9263413B2Substrate-less stackable package with wire-bond interconnectINVENSAS CORP·Filed 2014·Granted Feb 16, 2016·43 cites·20 claims
- 3498US9257396B2Compact semiconductor package and related methodsINVENSAS CORP·Filed 2014·Granted Feb 9, 2016·46 cites·21 claims
- 3598US9252127B1Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufactureINVENSAS CORP·Filed 2014·Granted Feb 2, 2016·53 cites·14 claims
- 3698US9165793B1Making electrical components in handle wafers of integrated circuit packagesINVENSAS CORP·Filed 2014·Granted Oct 20, 2015·141 cites·20 claims
- 3798US9095074B2Structure for microelectronic packaging with bond elements to encapsulation surfaceINVENSAS CORP·Filed 2014·Granted Jul 28, 2015·66 cites·20 claims
- 3898US9041227B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2013·Granted May 26, 2015·37 cites·16 claims
- 3998US8907500B2Multi-die wirebond packages with elongated windowsINVENSAS CORP·Filed 2013·Granted Dec 9, 2014·47 cites·21 claims
- 4098US8883563B1Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulationINVENSAS CORP·Filed 2014·Granted Nov 11, 2014·39 cites·17 claims
- 4198US8772152B2Method for package-on-package assembly with wire bonds to encapsulation surfaceINVENSAS CORP·Filed 2013·Granted Jul 8, 2014·56 cites·20 claims
- 4297US11270979B2Symbiotic network on layersINVENSAS CORP·Filed 2020·Granted Mar 8, 2022·4 cites·21 claims
- 4397US11114408B2System and method for providing 3D wafer assembly with known-good-diesINVENSAS CORP·Filed 2019·Granted Sep 7, 2021·20 cites·11 claims
- 4497US10217720B2Multi-chip modules formed using wafer-level processing of a reconstitute waferINVENSAS CORP·Filed 2017·Granted Feb 26, 2019·18 cites·9 claims
- 4597US10181457B2Microelectronic package for wafer-level chip scale packaging with fan-outINVENSAS CORP·Filed 2016·Granted Jan 15, 2019·19 cites·6 claims
- 4697US10083934B2Multi-chip package with interconnects extending through logic chipINVENSAS CORP·Filed 2017·Granted Sep 25, 2018·20 cites·20 claims
- 4797US9871014B23D-joining of microelectronic components with conductively self-adjusting anisotropic matrixINVENSAS CORP·Filed 2016·Granted Jan 16, 2018·25 cites·16 claims
- 4897US9818723B2Multi-chip package with interconnects extending through logic chipINVENSAS CORP·Filed 2017·Granted Nov 14, 2017·20 cites·20 claims
- 4997US9741696B2Thermal vias disposed in a substrate proximate to a well thereofINVENSAS CORP·Filed 2016·Granted Aug 22, 2017·20 cites·13 claims
- 5097US9735084B2Bond via array for thermal conductivityINVENSAS CORP·Filed 2014·Granted Aug 15, 2017·38 cites·20 claims
Showing the top 50 of 471 patent records by PatentIndex Score.
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