Inventor · disambiguated record
Hee-Kook Choi
Also filed as: CHOI HEE K · CHOI HEE-KOOK
12 granted patents·10 pending applications·408 citations·filing 1995–2008
93Inventor score
Top patents by PatentIndex Score
22 records- 0196US7098407B2Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrateSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 29, 2006·100 cites·10 claims
- 0292US7170158B2Double-sided circuit board and multi-chip package including such a circuit board and method for manufactureSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 30, 2007·73 cites·15 claims
- 0381US5765277ADie bonding apparatus with a revolving pick-up toolSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Jun 16, 1998·65 cites·10 claims
- 0479US6348363B1Method for manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Feb 19, 2002·32 cites·19 claims
- 0579US5979739ASemiconductor die bonding apparatus having multiple bonding systemSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Nov 9, 1999·59 cites·14 claims
- 0678US6386432B1Semiconductor die pickup method that prevents electrostatic dischargeSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted May 14, 2002·19 cites·5 claims
- 0763US6321971B1Die collet for a semiconductor chip and apparatus for bonding semiconductor chip to a lead frameSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Nov 27, 2001·23 cites·16 claims
- 0862US7485006B2Memory module, socket and mounting method providing improved heat dissipating characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 3, 2009·2 cites·18 claims
- 0961US7825495B2Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 2, 2010·2 cites·19 claims
- 1061US2009020878A1Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1159US7030489B2Multi-chip module having bonding wires and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 18, 2006·8 cites·20 claims
- 1251US2006246702A1Non-solder mask defined (nsmd) type wiring substrate for ball grid array (bga) package and method for manufacturing such a wiring substrateSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1350US2009130908A1Memory module, socket and mounting method providing improved heat dissipating characteristicsPARK SANG-WOOK·Filed 2008·Application pending·0 cites
- 1448US5886405ASemiconductor device package having inner leads with slotsSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Mar 23, 1999·15 cites·10 claims
- 1547US2007096288A1Double-sided circuit board and multi-chip package including such a circuit board and method for manufactureCHOI HEE K·Filed 2006·Application pending·0 cites
- 1645US2008185738A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1745US2006125093A1Multi-chip module having bonding wires and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1840US5811132AMold for semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Sep 22, 1998·10 cites·6 claims
- 1939US2004158978A1Molding method and mold for encapsulating both sides of PCB module with wafer level package mounted PCBFiled 2004·Application pending·0 cites
- 2037US2002056924A1Semiconductor package having an insulating region on an edge of a chip to prevent shortsFiled 2001·Application pending·0 cites
- 2136US2004178514A1Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the methodFiled 2003·Application pending·0 cites
- 2235US2006151878A1Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip packageJEONG SE-YOUNG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →