Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture

Abstract

A multi-chip package includes a double-sided circuit board having first and second surfaces. Each surface has a package area and a peripheral area. Each package area has a chip mounting area on which a chip is attached, and a bonding area with which the chip is electrically connected. The peripheral area of the first surface has a runner area on which molding compound flows, and the peripheral area of the second surface has an external connection pattern with which the bonding areas are electrically connected. In particular, the circuit board has gate holes, which are co-located on each surface to result in a common hole.

1 - 22 . (canceled)  
   
   
       23 . A method of manufacturing a multi-chip package, comprising: 
 providing a circuit board between an upper molding die and a lower molding die, the circuit board including a first surface having a first chip mounted and electrically connected thereto, a second surface having a second chip mounted and electrically connected thereto, and a gate hole formed from the first surface to the second surface, wherein the second surface faces the lower molding die;    closing the molding dies to form a cavity in which the chips are kept; and    injecting molding compound into the cavity, wherein the molding compound flows through the gate hole to encase portions of the first surface and the second surface.    
   
   
       24 . The method of  claim 23 , further comprising: 
 compressing a molding pellet into a through hole in the upper molding die.    
   
   
       25 . The method of  claim 23 , wherein the upper molding die and the lower molding die combine to form a gate neck located in the gate hole.