Inventor · disambiguated record
Naoya Furutake
Also filed as: FURUTAKE NAOYA
15 granted patents·4 pending applications·49 citations·filing 2005–2017
90Inventor score
Top patents by PatentIndex Score
19 records- 0188US8759212B2Semiconductor device and method of manufacturing semiconductor deviceKUME IPPEI·Filed 2011·Granted Jun 24, 2014·11 cites·15 claims
- 0284US9711216B2Semiconductor storage deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jul 18, 2017·7 cites·22 claims
- 0382US8004087B2Semiconductor device with dual damascene wirings and method for manufacturing sameNEC CORP·Filed 2005·Granted Aug 23, 2011·9 cites·10 claims
- 0481US8198730B2Semiconductor device and method of manufacturing the sameTAGAMI MASAYOSHI·Filed 2008·Granted Jun 12, 2012·9 cites·20 claims
- 0574US9190475B2Semiconductor device and semiconductor device manufacturing methodRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 17, 2015·2 cites·19 claims
- 0674US7923384B2Formation method of porous insulating film, manufacturing apparatus of semiconductor device, manufacturing method of semiconductor device, and semiconductor deviceNEC CORP·Filed 2006·Granted Apr 12, 2011·4 cites·33 claims
- 0772US8174122B2Semiconductor deviceAMANO MARI·Filed 2010·Granted May 8, 2012·3 cites·3 claims
- 0864US8829649B2Semiconductor device having a resistive element including a TaSiN layerRENESAS ELECTRONICS CORP·Filed 2012·Granted Sep 9, 2014·1 cites·11 claims
- 0963US7867906B2Semiconductor device and method for manufacturing sameNEC CORP·Filed 2006·Granted Jan 11, 2011·2 cites·5 claims
- 1060US8715791B2Method for forming porous insulating film and semiconductor deviceTADA MUNEHIRO·Filed 2006·Granted May 6, 2014·1 cites·12 claims
- 1157US9257390B2Semiconductor device with dual damascene wiringsRENESAS ELECTRONICS CORP·Filed 2014·Granted Feb 9, 2016·0 cites·20 claims
- 1253US9356026B2Semiconductor device and semiconductor device manufacturing methodRENESAS ELECTRONICS CORP·Filed 2015·Granted May 31, 2016·0 cites·1 claims
- 1353US9082643B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Jul 14, 2015·0 cites·14 claims
- 1453US2014357047A1Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1552US9230865B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Granted Jan 5, 2016·0 cites·4 claims
- 1650US2016148845A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1750US2016240564A1Semiconductor device and semiconductor device manufacturing methodRENESAS ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 1849US8916466B2Method for manufacturing dual damascene wiring in semiconductor deviceAMANO MARI·Filed 2011·Granted Dec 23, 2014·0 cites·15 claims
- 1940US2017309336A1Semiconductor storage deviceRENESAS ELECTRONICS CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →