Inventor · disambiguated record
Joshua D. Heppner
Also filed as: HEPPNER JOSHUA · HEPPNER JOSHUA D · HEPPNER JOSHUA DAVID
43 granted patents·14 pending applications·145 citations·filing 2010–2022
97Inventor score
Top patents by PatentIndex Score
57 records- 0196US11955434B2Ultra small molded module integrated with die by module-on-wafer assemblyINTEL CORP·Filed 2022·Granted Apr 9, 2024·2 cites·22 claims
- 0293US8025531B1Shielded socket housingINTEL CORP·Filed 2010·Granted Sep 27, 2011·29 cites·20 claims
- 0391US9685413B1Semiconductor package having an EMI shielding layerINTEL CORP·Filed 2016·Granted Jun 20, 2017·12 cites·16 claims
- 0491US9265170B2Integrated circuit connectorsINTEL CORP·Filed 2013·Granted Feb 16, 2016·13 cites·10 claims
- 0590US10070520B2Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrierINTEL CORP·Filed 2015·Granted Sep 4, 2018·6 cites·18 claims
- 0690US8905794B2Connector assembly and methodINTEL CORP·Filed 2012·Granted Dec 9, 2014·10 cites·28 claims
- 0789US10056182B2Surface-mount inductor structures for forming one or more inductors with substrate tracesINTEL CORP·Filed 2015·Granted Aug 21, 2018·7 cites·9 claims
- 0887US9728425B1Space-efficient underfilling techniques for electronic assembliesINTEL CORP·Filed 2016·Granted Aug 8, 2017·3 cites·17 claims
- 0986US10707171B2Ultra small molded module integrated with die by module-on-wafer assemblyINTEL CORP·Filed 2015·Granted Jul 7, 2020·5 cites·8 claims
- 1083US11024559B2Semiconductor package with electromagnetic interference shielding structuresINTEL CORP·Filed 2016·Granted Jun 1, 2021·4 cites·17 claims
- 1183US10193493B2Multi-surface solar cell packaging for self-powered electronic devicesINTEL CORP·Filed 2016·Granted Jan 29, 2019·4 cites·23 claims
- 1283US9385457B2Connector assembly and methodINTEL CORP·Filed 2014·Granted Jul 5, 2016·5 cites·15 claims
- 1383US9178328B2Shielded sockets for microprocessors and fabrication thereof by overmolding and platingHEPPNER JOSHUA D·Filed 2013·Granted Nov 3, 2015·5 cites·14 claims
- 1480US9491881B2Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrateHEPPNER JOSHUA D·Filed 2014·Granted Nov 8, 2016·5 cites·18 claims
- 1579US9635764B2Integrated circuit and method that utilize a shape memory materialINTEL CORP·Filed 2015·Granted Apr 25, 2017·4 cites·19 claims
- 1678US9953929B2Systems and methods for electromagnetic interference shieldingINTEL CORP·Filed 2016·Granted Apr 24, 2018·2 cites·7 claims
- 1778US9824901B2Complex cavity formation in molded packaging structuresINTEL CORP·Filed 2016·Granted Nov 21, 2017·2 cites·21 claims
- 1878US9172160B2Vertical socket contact with flat force responseINTEL CORP·Filed 2013·Granted Oct 27, 2015·3 cites·19 claims
- 1977US11135494B2Training aid support base and assemblyD N J ATHLETICS LLC·Filed 2020·Granted Oct 5, 2021·2 cites·20 claims
- 2074US9991211B2Semiconductor package having an EMI shielding layerINTEL CORP·Filed 2017·Granted Jun 5, 2018·2 cites·14 claims
- 2174US9615483B2Techniques and configurations associated with a package load assemblyINTEL CORP·Filed 2014·Granted Apr 4, 2017·3 cites·21 claims
- 2273US9780510B2Socket contact techniques and configurationsINTEL CORP·Filed 2014·Granted Oct 3, 2017·3 cites·11 claims
- 2372US9953909B2Ball grid array (BGA) with anchoring pinsINTEL CORP·Filed 2016·Granted Apr 24, 2018·2 cites·21 claims
- 2470US10224290B2Electromagnetically shielded electronic devices and related systems and methodsINTEL CORP·Filed 2015·Granted Mar 5, 2019·2 cites·20 claims
- 2569US10205292B2Socket contact techniques and configurationsINTEL CORP·Filed 2017·Granted Feb 12, 2019·1 cites·20 claims
- 2668US9601848B2Vertical socket contact with flat force responseINTEL CORP·Filed 2015·Granted Mar 21, 2017·1 cites·17 claims
- 2767US9385444B2Lateral slide pick and place cover for reduced bent pins in LGA socketsINTEL CORP·Filed 2013·Granted Jul 5, 2016·2 cites·17 claims
- 2866US9603276B2Electronic assembly that includes a plurality of electronic packagesINTEL CORP·Filed 2014·Granted Mar 21, 2017·1 cites·22 claims
- 2964US10820437B2Flexible packaging for a wearable electronic deviceINTEL CORP·Filed 2016·Granted Oct 27, 2020·1 cites·9 claims
- 3063US2020286834A1Ultra small molded module integrated with die by module-on-wafer assemblyINTEL CORP·Filed 2020·Application pending·0 cites
- 3161US2018061673A1Space-efficient underfilling techniques for electronic assembliesINTEL CORP·Filed 2017·Application pending·0 cites
- 3258US10615128B2Systems and methods for electromagnetic interference shieldingINTEL CORP·Filed 2018·Granted Apr 7, 2020·0 cites·17 claims
- 3358US2018376591A1Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrierINTEL CORP·Filed 2018·Application pending·0 cites
- 3456US10446461B2Complex cavity formation in molded packaging structuresINTEL CORP·Filed 2017·Granted Oct 15, 2019·0 cites·20 claims
- 3555US9325087B2Electronic assemblies with scalable clip-type connectorsCHAWLA GAURAV·Filed 2014·Granted Apr 26, 2016·2 cites·25 claims
- 3655US8961193B2Chip socket including a circular contact patternINTEL CORP·Filed 2012·Granted Feb 24, 2015·2 cites·10 claims
- 3754US10325866B2Electronic device packages with conformal EMI shielding and related methodsINTEL CORP·Filed 2017·Granted Jun 18, 2019·0 cites·14 claims
- 3853US10636716B2Through-mold structuresINTEL CORP·Filed 2018·Granted Apr 28, 2020·0 cites·17 claims
- 3952US9704811B1Perforated conductive material for EMI shielding of semiconductor device and componentsINTEL CORP·Filed 2015·Granted Jul 11, 2017·0 cites·20 claims
- 4051US9847304B2Electronic device packages with conformal EMI shielding and related methodsINTEL CORP·Filed 2015·Granted Dec 19, 2017·0 cites·9 claims
- 4150US2017250145A1Perforated conductive material for emi shielding of semiconductor device and componentsINTEL CORP·Filed 2017·Application pending·0 cites
- 4247US2016351526A1Integrated circuit chip attachment using local heat sourceINTEL CORP·Filed 2014·Application pending·0 cites
- 4345US10672625B2Electronic device package with recessed substrate for underfill containmentINTEL CORP·Filed 2016·Granted Jun 2, 2020·0 cites·16 claims
- 4445US2016028203A1Shielded sockets for microprocessors and fabrication thereof by overmolding and platingHEPPNER JOSHUA D·Filed 2015·Application pending·0 cites
- 4544US2015162719A1Chip socket including a circular contact patternINTEL CORP·Filed 2015·Application pending·0 cites
- 4644US2017178990A1Through-mold structuresINTEL CORP·Filed 2015·Application pending·0 cites
- 4743US2014167900A1Surface-mount inductor structures for forming one or more inductors with substrate tracesMURTAGIAN GREGORIO R·Filed 2012·Application pending·0 cites
- 4842US9017106B2Connector assembly and methods with integrated pitch translationINTEL CORP·Filed 2013·Granted Apr 28, 2015·0 cites·21 claims
- 4941US11653467B2Modular system for internet of things and method of assembling the sameINTEL CORP·Filed 2018·Granted May 16, 2023·0 cites·24 claims
- 5041US10111368B2Flexible substrate retention on a reusable carrierINTEL CORP·Filed 2015·Granted Oct 23, 2018·0 cites·5 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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