Ultra small molded module integrated with die by module-on-wafer assembly

Abstract

Embodiments of the invention include molded modules and methods for forming molded modules. According to an embodiment the molded modules may be integrated into an electrical package. Electrical packages according to embodiments of the invention may include a die with a redistribution layer formed on at least one surface. The molded module may be mounted to the die. According to an embodiment, the molded module may include a mold layer and a plurality of components encapsulated within the mold layer. Terminals from each of the components may be substantially coplanar with a surface of the mold layer in order to allow the terminals to be electrically coupled to the redistribution layer on the die. Additional embodiments of the invention may include one or more through mold vias formed in the mold layer to provide power delivery and/or one or more faraday cages around components.

What is claimed is: 
     
         1 . A method of forming a molded module, comprising:
 mounting a plurality of components on a temporary adhesive formed over a carrier substrate, wherein the components each have terminals that are in contact with the temporary adhesive;   encapsulating the plurality of components with a mold layer; and   removing the temporary adhesive and the carrier substrate from the mold layer, wherein the terminals are exposed and are substantially coplanar with a first surface of the mold layer.   
     
     
         2 . The method of  claim 1 , further comprising:
 singulating the mold layer to form a plurality of molded modules.   
     
     
         3 . The method of  claim 2 , further comprising:
 mounting at least one of the molded modules to a die, wherein the die includes a redistribution layer.   
     
     
         4 . The method of  claim 1 , further comprising:
 forming one or more via openings in the mold layer; and   disposing a conductive material in the one or more via openings to form through mold vias.   
     
     
         5 . The method of  claim 4 , wherein the via openings are formed with a laser drilling process. 
     
     
         6 . The method of  claim 1 , further comprising:
 mounting one or more conductive pins on the temporary adhesive; and   forming the mold layer to a thickness that exposes a surface of the conductive pins.   
     
     
         7 . The method of  claim 1 , wherein forming the mold layer includes forming a one or more partial via openings. 
     
     
         8 . The method of  claim 7 , further comprising:
 forming one or more via openings in the mold layer by laser drilling portions of the mold layer below the partial via openings; and   disposing a conductive material in the one or more via openings to form through mold vias.   
     
     
         9 . A molded module, comprising:
 a mold layer having a first surface and a second surface that is opposite to the first surface; and   a plurality of components encapsulated within the mold layer, wherein each of the components include terminals that are substantially coplanar with the first surface of the mold layer.   
     
     
         10 . The molded module of  claim 9 , further comprising one or more through mold vias, wherein the through mold vias include a first surface that is substantially coplanar with the first surface of the mold layer and a second surface that is substantially coplanar with the second surface of the mold layer. 
     
     
         11 . The molded module of  claim 10 , wherein the through mold vias have tapered sidewalls. 
     
     
         12 . The molded module of  claim 10 , wherein the through mold vias have substantially vertical sidewalls. 
     
     
         13 . The molded module of  claim 10 , wherein the through mold vias are conductive pins or via bars. 
     
     
         14 . The molded module of  claim 10 , wherein a plurality of through mold vias are arranged around one or more components to form a faraday cage. 
     
     
         15 . The molded module of  claim 9 , wherein the components include active and/or passive components. 
     
     
         16 . The molded module of  claim 9 , further comprising one or more stacked components that are electrically coupled to a pad with a wire bond. 
     
     
         17 . The molded module of  claim 16 , wherein the pad has a surface that is substantially coplanar with the first surface of the mold layer.