Space-efficient underfilling techniques for electronic assemblies

Abstract

Space-efficient underfilling techniques for electronic assemblies are described. According to some such techniques, an underfilling method may comprise mounting an electronic element on a surface of a substrate, dispensing an underfill material upon the surface of the substrate within a dispense region for forming an underfill for the electronic element, and projecting curing rays upon at least a portion of the dispensed underfill material to inhibit an outward flow of dispensed underfill material from the dispense region, and the underfill material may comprise a non-visible light (NVL)-curable material. Other embodiments are described and claimed.

What is claimed is: 
     
         1 . A method, comprising:
 mounting an electronic element on a surface of a substrate;   dispensing an underfill material upon the surface of the substrate within a dispense region for forming an underfill for the electronic element, the underfill material to comprise a non-visible light (NVL)-curable material; and   projecting curing rays upon at least a portion of the dispensed underfill material to inhibit an outward flow of dispensed underfill material from the dispense region.   
     
     
         2 . The method of  claim 1 , the curing rays to comprise ultraviolet (UV) light. 
     
     
         3 . The method of  claim 1 , the curing rays to comprise infrared (IR) light. 
     
     
         4 . The method of  claim 1 , comprising conveying a dispense assembly along a dispense path to dispense the underfill material within the dispense region. 
     
     
         5 . The method of  claim 4 , the dispense assembly to comprise a light source, the light source to project a curing beam upon dispensed underfill material as the dispense assembly traverses the dispense path. 
     
     
         6 . The method of  claim 1 , comprising projecting a curing frame upon a curing region surrounding the dispense region. 
     
     
         7 . The method of  claim 1 , the electronic element to comprise a semiconductor die. 
     
     
         8 . The method of  claim 7 , the semiconductor die to comprise one or more integrated circuits (ICs). 
     
     
         9 . The method of  claim 1 , the substrate to comprise a printed circuit board (PCB). 
     
     
         10 . The method of  claim 1 , the underfill material to comprise an NVL-curable epoxy. 
     
     
         11 . An apparatus, comprising:
 a dispenser to dispense an underfill material, the underfill material to comprise a non-visible light (NVL)-curable material selected for use to form an underfill for an electronic element mounted on a surface of a substrate; and   a light source coupled to the dispenser, the light source to emit curing rays for curing underfill material dispensed by the dispenser.   
     
     
         12 . The apparatus of  claim 11 , the curing rays to comprise ultraviolet (UV) light. 
     
     
         13 . The apparatus of  claim 11 , the curing rays to comprise infrared (IR) light. 
     
     
         14 . The apparatus of  claim 11 , the electronic element to comprise a semiconductor die. 
     
     
         15 . The apparatus of  claim 14 , the semiconductor die to comprise one or more integrated circuits (ICs). 
     
     
         16 . The apparatus of  claim 11 , the substrate to comprise a printed circuit board (PCB). 
     
     
         17 . The apparatus of  claim 11 , the underfill material to comprise an NVL-curable epoxy. 
     
     
         18 . A method, comprising:
 depositing a stencil material to form an underfilling stencil for an electronic element mounted on a surface of a substrate;   dispensing an underfill material through one or more openings of the underfilling stencil to form an underfill for the electronic element, the underfill material to comprise a non-visible light (NVL)-curable material; and   projecting curing rays to cure at least a portion of the dispensed underfill material.   
     
     
         19 . The method of  claim 18 , the curing rays to comprise ultraviolet (UV) light. 
     
     
         20 . The method of  claim 18 , the curing rays to comprise infrared (IR) light. 
     
     
         21 . The method of  claim 18 , at least a portion of the curing rays to at least partially permeate the underfilling stencil. 
     
     
         22 . The method of  claim 18 , the electronic element to comprise a semiconductor die. 
     
     
         23 . The method of  claim 22 , the semiconductor die to comprise one or more integrated circuits (ICs). 
     
     
         24 . The method of  claim 18 , the substrate to comprise a printed circuit board (PCB). 
     
     
         25 . The method of  claim 18 , the underfill material to comprise an NVL-curable epoxy.