Through-mold structures

Abstract

Devices and methods include an electronic package having a through-mold interconnect are shown herein. Examples of the electronic package include a package assembly. The package assembly including a substrate having a first substrate surface. The first substrate surface including a conductive layer attached to the first substrate surface. The package assembly includes a die communicatively coupled to the conductive layer and a contact block. The contact block including a first contact surface on one end of the contact block, a second contact surface on an opposing side of the contact block, and a contact block wall extended therebetween. The contact block includes a conductive material. The first contact surface is coupled to the package assembly with a joint extended partially up the contact block wall. The electronic package further includes an overmold covering portions of the substrate, conductive layer, and die. The second contact surface of the contact block is exposed through the overmold.

The claimed invention is: 
     
         1 . An electronic package including a through-mold interconnect comprising:
 a package assembly including:
 a substrate including a first substrate surface, the first substrate surface including a conductive layer attached on the first substrate surface; 
 a die communicatively coupled to the conductive layer; 
   a contact block including a first contact surface on one end of the contact block, a second contact surface on an opposing side of the contact block, and a contact block wall extended therebetween, wherein the contact block includes a conductive material and the first contact surface is coupled to the package assembly with a joint located partially along the contact block wall; and   an overmold covering portions of the substrate, conductive layer, and die, wherein the second contact surface of the contact block is exposed through the overmold.   
     
     
         2 . The electronic package of  claim 1 , wherein the contact block is thermally conductive and configured as a heat sink. 
     
     
         3 . The electronic package of  claim 1 , wherein the joint couples the contact block to the conductive layer, the die, or both. 
     
     
         4 . The electronic package of  claim 1 , wherein the cross sectional area of the conductive material on the contact block exceeds 0.05 mm 2 . 
     
     
         5 . The electronic package of  claim 1 , wherein a coefficient of thermal conductivity of the contact block exceeds 80 W·m −1 ·k −1 . 
     
     
         6 . The electronic package of  claim 1 , wherein the contact block includes a height exceeding 200 μm. 
     
     
         7 . The electronic package of  claim 1 , wherein the contact block is magnetic. 
     
     
         8 . The electronic package of  claim 1 , wherein the contact block includes a complex geometry. 
     
     
         9 . The electronic package of  claim 8 , wherein the contact block includes at least one element selected from a group consisting of: a microfluidic conduit, a structural reinforcement, a threaded bushing, an electromagnetic shield, a filter, 
     
     
         10 . A method of making an electronic package including a contact block comprising:
 constructing a package assembly including:
 attaching a conductive layer on a substrate, 
 attaching a die to the conductive layer; 
   placing one or more contact blocks on the package assembly, each contact block including a first contact surface on a first end of the contact block, a second contact surface on an opposing second contact end of the contact block, and a contact block wall extended therebetween;   coupling the one or more contact blocks to the package assembly, wherein a joint is located partially along the contact block wall; and   covering a portion of the package assembly including a portion of the substrate, exposed conductive layer, and die with an overmold, wherein the second contact surface of the contact block remains exposed through the overmold.   
     
     
         11 . The method of making the electronic package of  claim 10 , further comprising coupling a structure on the second contact surface of at least one contact block and on top of the overmold, wherein coupling the conductive structure includes coupling a thermally conductive structure configured as a heat sink. 
     
     
         12 . The method of making the electronic package of  claim 10 , further comprising coupling an electrically conductive structure on the top of the overmold and in electrical communication with at least one contact block, the electrically conductive structure configured as an antenna. 
     
     
         13 . The method of making the electronic package of  claim 10 , wherein placing the contact block includes placing a contact block including a total cross sectional area of conductive material exceeding 0.05 mm 2 . 
     
     
         14 . The method of making the electronic package of  claim 10 , wherein placing the contact block includes placing a contact block including a coefficient of thermal conductivity exceeding 80 W·m −1 ·k −1 . 
     
     
         15 . The method of making the electronic package of  claim 10 , wherein placing the contact block includes placing a magnetic contact block. 
     
     
         16 . A method of forming an aperture in an electronics package comprising:
 constructing a package assembly including:
 attaching a conductive layer on a substrate; 
 attaching a die to the conductive layer; 
   coupling one or more contact blocks to the package assembly, each contact block including a first contact surface on a first end of the contact block, a second contact surface on an opposing second contact end of the contact block, and a contact block wall extended therebetween, wherein the contact block includes a conductive material and the first contact surface is coupled to the package assembly at a joint located partially along the contact block wall;   covering a portion of the package assembly including a portion of the substrate, exposed conductive layer, and die with an overmold, wherein the second contact surface of the contact block remains exposed through the overmold; and   removing at least one of the contact blocks to form an aperture in the overmold.   
     
     
         17 . The method of  claim 16 , wherein removing the contact block includes exposing a surface of the die. 
     
     
         18 . The method of  claim 16 , wherein removing the contact block includes exposing a surface of the conductive layer. 
     
     
         19 . The method of  claim 16 , wherein attaching the one or more contact blocks to the package assembly includes coupling at least one contact block to a component, wherein the component is coupled to the conductive layer. 
     
     
         20 . The method of  claim 19 , wherein the component is selected from a group consisting of: an optical sensor, environmental sensor, capacitive sensor, or electrical sensor. 
     
     
         21 . The method of  claim 19 , wherein the component includes a Fresnel lens. 
     
     
         22 . The method of  claim 19 , wherein the component includes metamaterial. 
     
     
         23 . The method of  claim 16 , further comprising locating a component within the aperture and coupling the component to an exposed portion of the conductive layer or the die within the aperture, the component selected from a group consisting of: a Fresnel lens, optical sensor, environmental sensor, capacitive sensor, or electrical sensor.