Perforated conductive material for emi shielding of semiconductor device and components

Abstract

An electric device and method of fabrication of that electric device is disclosed. The electric device includes one or more electrical devices attached to a substrate. The electric device further includes one or more grounding pads attached to the substrate. The electric device further includes a perforated conductive material placed on the substrate. The electric device further includes a molding compound deposited to cover the perforated conductive material, the one or more devices, and the one or more grounding pads.

1 . An electrical device, comprising:
 one or more electrical devices attached to a substrate;   one or more grounding pads attached to the substrate;   a perforated conductive material placed on the substrate, wherein the perforated conductive material allows a molding compound to pass through.   wherein the molding compound deposited over and through the perforated conductive material to cover the perforated conductive material, the one or more devices under the perforated conductive material, and the one or more grounding pads.   
     
     
         2 . The device of  claim 1 , wherein the one or more electrical devices include a semiconductor. 
     
     
         3 . The device of  claim 1 , wherein the perforated conductive material is coupled to the one or more grounding pads. 
     
     
         4 . The device of  claim 1 , wherein the one or more grounding pads are attached to a first side of the substrate and a second side of the substrate. 
     
     
         5 . The device of  claim 4 , wherein the first side grounding pads are in electrical communication with the second side grounding pads. 
     
     
         6 . The device of  claim 1 , wherein the perforated conductive material is arranged in an array on the substrate. 
     
     
         7 . The device of  claim 6 , wherein the array includes a first piece of perforated conductive material overlapping a second piece of perforated conductive material. 
     
     
         8 . The device of  claim 6 , wherein the array is a grid of perforated conductive material. 
     
     
         9 . The device of  claim 1 , further comprising an adhesive, the adhesive coupling the perforated conductive material to the substrate. 
     
     
         10 . The device of  claim 9 , wherein the adhesive includes a thermal bonding compound. 
     
     
         11 . The device of  claim 1 , wherein the perforated conductive material is nonconductive material with a metallization coating 
     
     
         12 . A method, comprising:
 attaching one or more electrical devices to a substrate;   attaching one or more grounding pads to the substrate;   placing a perforated conductive material on the substrate, wherein the perforated conductive material allows a molding compound to pass through.   depositing the molding compound over and through the perforated conductive material to cover the perforated conductive material, the one or more devices under the perforated conductive material, and the one or more grounding pads.   
     
     
         13 . The method of  claim 12 , wherein attaching one or more electrical devices to the substrate includes attaching a semiconductor. 
     
     
         14 . The method of  claim 13 , wherein the semiconductor is a processor, and attaching the processor includes attaching the processor in a flip-chip orientation or surface mounted. 
     
     
         15 . The method of  claim 12 , further comprising coupling the perforated conductive material to the substrate, wherein coupling the perforated conductive material to the substrate includes soldering, gluing, or taping. 
     
     
         16 . The method of  claim 12 , wherein placing the perforated conductive material on the substrate further comprises:
 layering a perforated conductive material over the one or more devices; and   connecting the perforated conductive material to the one or more grounding pads, such that the perforated conductive material covers the one or more devices.   
     
     
         17 . The method of  claim 12 , wherein placing a perforated conductive material on the substrate further comprises:
 placing the perforated conductive material on the substrate between the one or more devices, such that the perforated conductive material shields each device on the substrate from electromagnetic interference from other devices attached to the substrate.   
     
     
         18 . The method of  claim 12 , wherein placing the perforated conductive material includes placing the perforated conductive material in an array. 
     
     
         19 . The method of  claim 18 , placing the perforated conductive material in the array includes placing a first piece of perforated conductive material and overlapping a second piece of perforated conductive material over the first piece of perforated conductive material. 
     
     
         20 . The method of  claim 18 , wherein the array is a grid of perforated conductive material. 
     
     
         21 . The method of  claim 12 , further comprising:
 separating the substrate into one or more distinct systems in a package.   
     
     
         22 . A non-transitory computer readable storage medium storing one or more programs for execution by one or more processors, the one or more programs comprising instructions for:
 attaching one or more electrical devices to a substrate;   attaching one or more grounding pads to the substrate;   placing a perforated conductive material on the substrate, wherein the perforated conductive material allows a molding compound to pass through; and
 depositing the molding compound over and through the perforated conductive material to cover the perforated conductive material, the one or more devices under the perforated conductive material, and the one or more grounding pads.