Assignee
DIAS RAJENDRA C
US·1 granted patent·2 pending applications·0 citations·filing 2013–2016
Top patents by PatentIndex Score
3 records- 0135US9786517B2Ablation method and recipe for wafer level underfill material patterning and removalDIAS RAJENDRA C·Filed 2013·Granted Oct 10, 2017·0 cites·13 claims
- 0231US2015072515A1Laser ablation method and recipe for sacrificial material patterning and removalDIAS RAJENDRA C·Filed 2013·Application pending·0 cites
- 0329US2017287847A1Integrated circuit package having integrated emi shieldDIAS RAJENDRA C·Filed 2016·Application pending·0 cites
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