Inventor · disambiguated record
Yoshihisa Kagawa
Also filed as: KAGAWA YOSHIHISA
40 granted patents·14 pending applications·371 citations·filing 2002–2024
97Inventor score
Files withSONY CORP23SONY SEMICONDUCTOR SOLUTIONS CORP7KAGAWA YOSHIHISA5SONY GROUP CORP5JAPAN SERVO4
Top patents by PatentIndex Score
54 records- 0198US9799587B2Semiconductor deviceFUJII NOBUTOSHI·Filed 2012·Granted Oct 24, 2017·241 cites·21 claims
- 0296US8896125B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusKAGAWA YOSHIHISA·Filed 2012·Granted Nov 25, 2014·26 cites·36 claims
- 0395US10431621B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2018·Granted Oct 1, 2019·7 cites·26 claims
- 0494US10236238B2Semiconductor deviceSONY CORP·Filed 2017·Granted Mar 19, 2019·8 cites·20 claims
- 0594US9443802B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2015·Granted Sep 13, 2016·7 cites·24 claims
- 0693US9111763B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2014·Granted Aug 18, 2015·9 cites·17 claims
- 0791US10026769B2Semiconductor device and solid-state imaging deviceSONY CORP·Filed 2014·Granted Jul 17, 2018·12 cites·14 claims
- 0889US9373785B2Memory device and method of manufacturing the sameKAGAWA YOSHIHISA·Filed 2011·Granted Jun 21, 2016·6 cites·12 claims
- 0987US10038024B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2016·Granted Jul 31, 2018·3 cites·15 claims
- 1087US9190275B2Bonding substrates with electrical connection through insulating filmSONY CORP·Filed 2014·Granted Nov 17, 2015·5 cites·18 claims
- 1186US10985102B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2019·Granted Apr 20, 2021·2 cites·17 claims
- 1285US2025072136A1Semiconductor Device, Solid-State Image Pickup Element, Imaging Device, and Electronic ApparatusSONY GROUP CORP·Filed 2024·Application pending·0 cites
- 1383US9911778B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2016·Granted Mar 6, 2018·2 cites·12 claims
- 1483US9379006B2Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatusSONY CORP·Filed 2014·Granted Jun 28, 2016·5 cites·18 claims
- 1582US11923279B2Semiconductor deviceSONY GROUP CORP·Filed 2022·Granted Mar 5, 2024·0 cites·9 claims
- 1681US10837448B2Counter-rotating axial flow fanNIDEC SERVO CORP·Filed 2019·Granted Nov 17, 2020·2 cites·10 claims
- 1781US9666627B2Electronic apparatus and manufacturing method for an electronic apparatus having multiple substrates directly electrically connected through an insulating filmSONY CORP·Filed 2015·Granted May 30, 2017·2 cites·20 claims
- 1879US8664763B2Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatusKAGAWA YOSHIHISA·Filed 2012·Granted Mar 4, 2014·4 cites·8 claims
- 1978US11626356B2Semiconductor deviceSONY GROUP CORP·Filed 2022·Granted Apr 11, 2023·0 cites·24 claims
- 2078US11569123B2Semiconductor device, fabrication method for a semiconductor device and electronic apparatusSONY CORP·Filed 2021·Granted Jan 31, 2023·0 cites·17 claims
- 2177US11107855B2Method for bonding and connecting substratesSONY CORP·Filed 2019·Granted Aug 31, 2021·1 cites·20 claims
- 2276US10707258B2Semiconductor device with multiple substrates electrically connected through an insulating filmSONY CORP·Filed 2018·Granted Jul 7, 2020·1 cites·19 claims
- 2375US10134795B2Semiconductor device with multiple substrates electrically connected through an insulating film and manufacturing methodSONY CORP·Filed 2017·Granted Nov 20, 2018·1 cites·7 claims
- 2475US2021366958A1Semiconductor device and manufacturing methodSONY GROUP CORP·Filed 2021·Application pending·0 cites
- 2574US7037092B2Roller pump with housing having integrated reduction gear housingJAPAN SERVO·Filed 2002·Granted May 2, 2006·15 cites·16 claims
- 2673US12482754B2Semiconductor device and method of manufacturing semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Granted Nov 25, 2025·0 cites·19 claims
- 2771US7602061B2Semiconductor device and method for manufacturing semiconductor deviceSONY CORP·Filed 2007·Granted Oct 13, 2009·5 cites·5 claims
- 2870US10804313B2Semiconductor device and solid-state imaging deviceSONY CORP·Filed 2018·Granted Oct 13, 2020·1 cites·12 claims
- 2967US7662728B2Substrate processing methodTOKYO ELECTRON LTD·Filed 2006·Granted Feb 16, 2010·2 cites·20 claims
- 3064US10930845B2Memory device and method of manufacturing the sameSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Feb 23, 2021·0 cites·24 claims
- 3162US11004879B2Semiconductor device, solid-state image pickup element, imaging device, and electronic apparatusSONY CORP·Filed 2020·Granted May 11, 2021·0 cites·20 claims
- 3261US2021233946A1Semiconductor device, solid-state image pickup element, imaging device, and electronic apparatusSONY GROUP CORP·Filed 2021·Application pending·0 cites
- 3360US12302376B2Wireless communication device, wireless communication system, control circuit, storage medium, and wireless communication methodMITSUBISHI ELECTRIC CORP·Filed 2022·Granted May 13, 2025·0 cites·17 claims
- 3460US11587857B2Semiconductor deviceSONY CORP·Filed 2018·Granted Feb 21, 2023·0 cites·20 claims
- 3560US10347832B2Memory device and method of manufacturing the sameSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Jul 9, 2019·0 cites·22 claims
- 3658US8685786B2Method of manufacturing a semiconductor memory device having a resistance change memory layerSONY CORP·Filed 2013·Granted Apr 1, 2014·0 cites·5 claims
- 3758US7845180B2Automatic icemakerJAPAN SERVO·Filed 2007·Granted Dec 7, 2010·2 cites·18 claims
- 3856US12514018B2Imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Dec 30, 2025·0 cites·23 claims
- 3956US9748478B2Memory device and method of manufacturing the sameSONY CORP·Filed 2016·Granted Aug 29, 2017·0 cites·1 claims
- 4055US11749609B2Semiconductor device and method of manufacturing semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Sep 5, 2023·0 cites·20 claims
- 4154US2009011149A1Substrate processing methodTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 4253US10665623B2Semiconductor device, solid-state image pickup element, imaging device, and electronic apparatusSONY CORP·Filed 2016·Granted May 26, 2020·0 cites·14 claims
- 4351US2024175802A1Photodetection device and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 4449US7601402B2Method for forming insulation film and apparatus for forming insulation filmTOKYO ELECTRON LTD·Filed 2003·Granted Oct 13, 2009·2 cites·13 claims
- 4549US2011031466A1Semiconductor memory device and a method of manufacturing the sameSONY CORP·Filed 2010·Application pending·0 cites
- 4646US9720405B2Antenna inspection system, antenna inspection apparatus and antenna inspection methodKAGAWA YOSHIHISA·Filed 2013·Granted Aug 1, 2017·0 cites·11 claims
- 4746US2007219495A1Control System for Liquid Infusion ApparatusJAPAN SERVO·Filed 2007·Application pending·0 cites
- 4845US2019301472A1Counter-rotating fanNIDEC SERVO CORP·Filed 2019·Application pending·0 cites
- 4943US2012045323A1FanKAGAWA YOSHIHISA·Filed 2011·Application pending·0 cites
- 5043US2005220639A1Extrusion-type liquid delivery apparatusJAPAN SERVO·Filed 2005·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →