Inventor · disambiguated record
Meng-Tsung Lee
Also filed as: LEE MENG-TSUNG
11 granted patents·5 pending applications·22 citations·filing 2011–2018
86Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD12CHANG CHIANG-CHENG2CHUANG CHIEN-LUNG1LIN YI HUNG1
Top patents by PatentIndex Score
16 records- 0185US9812340B2Method of fabricating semiconductor package having semiconductor elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Nov 7, 2017·4 cites·14 claims
- 0280US8680692B2Carrier, semiconductor package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2012·Granted Mar 25, 2014·5 cites·3 claims
- 0378US10049955B2Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Aug 14, 2018·2 cites·7 claims
- 0476US8866293B2Semiconductor structure and fabrication method thereofLIN YI-HUNG·Filed 2011·Granted Oct 21, 2014·4 cites·7 claims
- 0575US9875981B2Semiconductor device having conductive viasSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Jan 23, 2018·2 cites·2 claims
- 0671US9324585B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Apr 26, 2016·2 cites·5 claims
- 0769US10199331B2Fabrication method of electronic package having embedded package blockSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Feb 5, 2019·1 cites·10 claims
- 0869US9502333B2Semiconductor device having conductive viasSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 22, 2016·2 cites·11 claims
- 0953US9899237B2Carrier, semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 20, 2018·0 cites·9 claims
- 1051US2015072517A1Fabrication method of semiconductor structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 1147US2013228915A1Semiconductor package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2012·Application pending·0 cites
- 1246US10192838B2Fabrication method of packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jan 29, 2019·0 cites·9 claims
- 1345US2017077047A1Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 1444US9041189B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted May 26, 2015·0 cites·19 claims
- 1540US2013341774A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 1639US2013113095A1Packaging substrate and fabrication method thereofCHUANG CHIEN-LUNG·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →