Electronic package and fabrication method thereof

Abstract

An electronic device package and manufacturing method are provided, including steps of: providing a carrier having at least an electronic element and at least a package block disposed thereon, wherein the package block has a plurality of conductive posts bonded to the carrier; forming an encapsulant on the carrier for encapsulating the electronic element and the package block; and removing the carrier so as to expose the electronic element and the conductive posts from a surface of the encapsulant. As such, the invention dispenses with formation of through holes in the encapsulant for forming the conductive posts as in the prior art, thereby saving the fabrication cost.

What is claimed is: 
     
         1 . An electronic package, comprising:
 an encapsulant having a first surface and a second surface opposite to the first surface;   at least an electronic element embedded in the encapsulant and exposed from the first surface of the encapsulant; and   at least a package block embedded in the encapsulant and having at least one conductive post exposed from the first surface of the encapsulant.   
     
     
         2 . The electronic package of  claim 1 , wherein the encapsulant and the package block are made of the same or different materials. 
     
     
         3 . The electronic package of  claim 1 , wherein the electronic element is further exposed from the second surface of the encapsulant. 
     
     
         4 . The electronic package of  claim 1 , wherein a shielding layer is formed on the electronic element. 
     
     
         5 . The electronic package of  claim 4 , wherein the shielding layer is exposed from the second surface of the encapsulant. 
     
     
         6 . The electronic package of  claim 1 , wherein the conductive post is further exposed from the second surface of the encapsulant. 
     
     
         7 . The electronic package of  claim 6 , further comprising a circuit structure formed on the second surface of the encapsulant and electrically connected to the conductive posts. 
     
     
         8 . The electronic package of  claim 1 , further comprising a circuit structure formed on the first surface of the encapsulant and electrically connected to the electronic element and the conductive post. 
     
     
         9 . A method for fabricating an electronic package, comprising the steps of:
 providing a carrier having at least an electronic element and at least a package block disposed thereon, wherein the package block has at least one conductive post bonded to the carrier;   forming an encapsulant on the carrier for encapsulating the electronic element and the package block, wherein the encapsulant has a first surface and a second surface opposite to the first surface; and   removing the carrier so as to expose the electronic element and the conductive post from the first surface of the encapsulant.   
     
     
         10 . The method of  claim 9 , wherein fabricating the package block comprises:
 providing a metal board having at least one conductive post thereon;   forming an encapsulant on the metal board to encapsulate the conductive post; and   removing the metal board, thereby forming the package block having the conductive post exposed from a surface thereof.   
     
     
         11 . The method of  claim 9 , wherein the encapsulant is formed by molding or lamination. 
     
     
         12 . The method of  claim 9 , wherein the encapsulant and the package block are made of the same or different materials. 
     
     
         13 . The method of  claim 9 , wherein the electronic element is further exposed from the second surface of the encapsulant. 
     
     
         14 . The method of  claim 9 , wherein a shielding layer is formed on the electronic element. 
     
     
         15 . The method of  claim 14 , wherein the shielding layer is exposed from the second surface of the encapsulant. 
     
     
         16 . The method of  claim 9 , wherein the conductive post is further exposed from the second surface of the encapsulant. 
     
     
         17 . The method of  claim 16 , further comprising forming on the second surface of the encapsulant a circuit structure electrically connected to the conductive post. 
     
     
         18 . The method of  claim 9 , further comprising forming on the first surface of the encapsulant a circuit structure electrically connected to the electronic element and the conductive post.