Inventor · disambiguated record
Ichiro Mihara
Also filed as: MIHARA ICHIRO
45 granted patents·9 pending applications·1,383 citations·filing 1995–2022
98Inventor score
Top patents by PatentIndex Score
54 records- 0198US6501169B1Semiconductor device which prevents leakage of noise generated in a circuit element forming area and which shields against external electromagnetic noiseCASIO COMPUTER CO LTD·Filed 2000·Granted Dec 31, 2002·193 cites·10 claims
- 0297US6600234B2Mounting structure having columnar electrodes and a sealing filmCASIO COMPUTER CO LTD·Filed 2000·Granted Jul 29, 2003·212 cites·9 claims
- 0395US7618886B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2007·Granted Nov 17, 2009·29 cites·19 claims
- 0495US7550833B2Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2005·Granted Jun 23, 2009·42 cites·12 claims
- 0595US7112469B2Method of fabricating a semiconductor package utilizing a thermosetting resin base memberCASIO COMPUTER CO LTD·Filed 2005·Granted Sep 26, 2006·39 cites·8 claims
- 0695US7064440B2Semiconductor deviceCASIO COMPUTER CO LTD·Filed 2005·Granted Jun 20, 2006·37 cites·23 claims
- 0795US6545354B1Semiconductor device having a barrier layerCASIO COMPUTER CO LTD·Filed 2000·Granted Apr 8, 2003·170 cites·15 claims
- 0893US7547967B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2007·Granted Jun 16, 2009·23 cites·20 claims
- 0993US6847066B2Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2001·Granted Jan 25, 2005·100 cites·23 claims
- 1092US7190064B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2003·Granted Mar 13, 2007·56 cites·13 claims
- 1191US7528480B2Circuit board, semiconductor device, and manufacturing method of circuit boardCASIO COMPUTER CO LTD·Filed 2006·Granted May 5, 2009·19 cites·10 claims
- 1291US7294922B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2004·Granted Nov 13, 2007·51 cites·25 claims
- 1390US7737543B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2009·Granted Jun 15, 2010·14 cites·8 claims
- 1489US7514335B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2006·Granted Apr 7, 2009·14 cites·18 claims
- 1589US6467674B1Method of manufacturing semiconductor device having sealing film on its surfaceCASIO COMPUTER CO LTD·Filed 2000·Granted Oct 22, 2002·54 cites·12 claims
- 1687US8293574B2Semiconductor device having a plurality of semiconductor constructsMIHARA ICHIRO·Filed 2010·Granted Oct 23, 2012·9 cites·28 claims
- 1787US7719116B2Semiconductor device having reduced number of external pad portionsCASIO COMPUTER CO LTD·Filed 2006·Granted May 18, 2010·16 cites·20 claims
- 1887US7247947B2Semiconductor device comprising a plurality of semiconductor constructsCASIO COMPUTER CO LTD·Filed 2006·Granted Jul 24, 2007·16 cites·9 claims
- 1986USRE43380ESemiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereofWAKISAKA SHINJI·Filed 2010·Granted May 15, 2012·7 cites·47 claims
- 2086US7563640B2Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2007·Granted Jul 21, 2009·10 cites·11 claims
- 2186US7378645B2Optical sensor module with semiconductor device for driveCASIO COMPUTER CO LTD·Filed 2005·Granted May 27, 2008·13 cites·35 claims
- 2286US6870256B2Semiconductor device having a thin-film circuit element provided above an integrated circuitCASIO COMPUTER CO LTD·Filed 2002·Granted Mar 22, 2005·35 cites·5 claims
- 2385US7550843B2Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base memberCASIO COMPUTER CO LTD·Filed 2006·Granted Jun 23, 2009·11 cites·9 claims
- 2485US7183639B2Semiconductor device and method of manufacturing the sameNIPPON CMK KK·Filed 2004·Granted Feb 27, 2007·41 cites·36 claims
- 2584US5739392AProcess for production of acrylic acidNIPPON CATALYTIC CHEM IND·Filed 1995·Granted Apr 14, 1998·29 cites·13 claims
- 2682US7459340B2Semiconductor device and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2005·Granted Dec 2, 2008·9 cites·16 claims
- 2782US7417330B2Semiconductor device packaged into chip size and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2005·Granted Aug 26, 2008·9 cites·7 claims
- 2880US5556670ALiquid crystal display panelCASIO COMPUTER CO LTD·Filed 1995·Granted Sep 17, 1996·52 cites·5 claims
- 2975US7390688B2Semiconductor device and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2006·Granted Jun 24, 2008·11 cites·17 claims
- 3074US7368813B2Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2004·Granted May 6, 2008·14 cites·20 claims
- 3168US7445964B2Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2006·Granted Nov 4, 2008·4 cites·29 claims
- 3265US8507309B2Imaging apparatus having a photosensor provided on a lower surface of a semiconductor substrate and a lens unit provided on an upper surface of the semiconductor substrate, and manufacturing method of the sameMIHARA ICHIRO·Filed 2011·Granted Aug 13, 2013·2 cites·9 claims
- 3364US8587124B2Semiconductor device having low dielectric insulating film and manufacturing method of the sameMIZUSAWA AIKO·Filed 2008·Granted Nov 19, 2013·2 cites·16 claims
- 3461US8067274B2Method of forming wiring on a plurality of semiconductor devices from a single metal plate, and a semiconductor construction assembly formed by the methodMIHARA ICHIRO·Filed 2009·Granted Nov 29, 2011·2 cites·7 claims
- 3561US7692282B2Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2007·Granted Apr 6, 2010·1 cites·21 claims
- 3659US9070638B2Semiconductor device having low dielectric insulating film and manufacturing method of the sameTERA PROBE INC·Filed 2014·Granted Jun 30, 2015·0 cites·18 claims
- 3759US8278734B2Semiconductor device and manufacturing method thereofMIHARA ICHIRO·Filed 2010·Granted Oct 2, 2012·1 cites·16 claims
- 3859US6140155AMethod of manufacturing semiconductor device using dry photoresist filmCASIO COMPUTER CO LTD·Filed 1999·Granted Oct 31, 2000·28 cites·20 claims
- 3958US7592672B2Grounding structure of semiconductor device including a conductive pasteCASIO COMPUTER CO LTD·Filed 2007·Granted Sep 22, 2009·1 cites·14 claims
- 4055US6319851B1Method for packaging semiconductor device having bump electrodesCASIO COMPUTER CO LTD·Filed 2000·Granted Nov 20, 2001·6 cites·20 claims
- 4155US2025300026A1Semiconductor device and wiring boardAOI ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4254US9640478B2Semiconductor device having low dielectric insulating film and manufacturing method of the sameTERA PROBE INC·Filed 2015·Granted May 2, 2017·0 cites·20 claims
- 4354US8871627B2Semiconductor device having low dielectric insulating film and manufacturing method of the sameTERAMIKROS INC·Filed 2013·Granted Oct 28, 2014·0 cites·19 claims
- 4452US7867826B2Semiconductor device packaged into chip size and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2008·Granted Jan 11, 2011·0 cites·8 claims
- 4552USRE41511ESemiconductor device having a thin-film circuit element provided above an integrated circuitCASIO COMPUTER CO LTD·Filed 2007·Granted Aug 17, 2010·0 cites·7 claims
- 4652US2009174062A1Circuit board, semiconductor device, and manufacturing method of circuit boardCASIO COMPUTER CO LTD·Filed 2009·Application pending·0 cites
- 4752US2009065926A1Semiconductor device and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2008·Application pending·0 cites
- 4850US8749065B2Semiconductor device comprising electromigration prevention film and manufacturing method thereofKOUNO ICHIRO·Filed 2008·Granted Jun 10, 2014·1 cites·7 claims
- 4949US2007158857A1Semiconductor device having a plurality of semiconductor constructsCASIO COMPUTER CO LTD·Filed 2007·Application pending·0 cites
- 5049US2006202353A1Semiconductor device and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2006·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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