Circuit board, semiconductor device, and manufacturing method of circuit board

Abstract

A circuit board includes a semiconductor substrate which has a plurality of through holes passing from an upper surface to a lower surface thereof. A plurality of wiring lines are provided on the upper surface of the semiconductor substrate and have bottomed cylindrical portions located within regions corresponding to the through holes. Bottom surfaces of the bottomed cylindrical portions of the wiring lines serve as connection pad portions.

1 . A semiconductor device comprising:
 a semi conductor substrate having through holes;   wiring lines provided on an upper surface of the semiconductor substrate a rid including bottomed cylindrical portions respectively positioned in regions corresponding to the through holes;   a first insulating film provided on the wiring lines and on the semiconductor substrate;   a semiconductor construct mounted on the first insulating film; and   a second insulating film provided on a periphery of the semiconductor construct on the semiconductor substrate.   
     
     
         2 . The semiconductor device according to  claim 1 , further comprising a plurality of solder balls provided on bottom surfaces of the bottomed cylindrical portions of the wiring lines. 
     
     
         3 . The semiconductor device according to  claim 1 , further comprising:
 a third insulating film provided on the semiconductor construct and on the second insulating film; and   second wiring lines provided on the third insulating film so that the second wiring lines are connected to external connection electrodes of the semiconductor construct.   
     
     
         4 . The semiconductor device according to  claim 3 , wherein through holes passing through the first, second and third insulating films are further provided to correspond to parts of the wiring lines. 
     
     
         4 . The semiconductor device according to  claim 3 , further comprising:
 a second semiconductor construct electrically connected to the second wiring lines and to the wiring lines via the through holes.   
     
     
         6 . The semiconductor device according to  claim 1 , wherein the external connection electrodes are columnar electrodes. 
     
     
         7 . The semiconductor device according to  claim 1 , wherein the semiconductor construct comprises:
 a semiconductor substrate having connection pads;   an insulating film provided on the semiconductor substrate and having openings which expose the connection pads;   wiring lines provided on the insulating film and connected to the connection pads via the openings of the insulating film;   external connection electrodes provided on the wiring lines; and   a sealing film provided on the insulating film between the external connection electrodes and on the wiring lines.   
     
     
         8 . The semiconductor device according to  claim 7 , further comprising:
 a third insulating film provided on the semiconductor construct and having openings which expose at least parts of the columnar electrodes; and   second wiring lines provided on the third insulating film and connected to the columnar electrodes .   
     
     
         9 . The semiconductor device according to  claim 8 , further comprising:
 a second semiconductor construct connected to the second wiring lines.