Inventor · disambiguated record
Yukiteru Matsui
Also filed as: MATSUI YUKITERU
55 granted patents·32 pending applications·579 citations·filing 2000–2021
98Inventor score
Top patents by PatentIndex Score
87 records- 0197US6375545B1Chemical mechanical method of polishing wafer surfacesTOSHIBA KK·Filed 2000·Granted Apr 23, 2002·131 cites·17 claims
- 0295US6740590B1Aqueous dispersion, aqueous dispersion for chemical mechanical polishing used for manufacture of semiconductor devices, method for manufacture of semiconductor devices, and method for formation of embedded writingTOSHIBA KK·Filed 2000·Granted May 25, 2004·102 cites·22 claims
- 0395US6454819B1Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor deviceTOSHIBA KK·Filed 2000·Granted Sep 24, 2002·108 cites·37 claims
- 0491US7332104B2Slurry for CMP, polishing method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2006·Granted Feb 19, 2008·15 cites·15 claims
- 0588US8740667B2Polishing method and polishing apparatusKODERA MASAKO·Filed 2012·Granted Jun 3, 2014·8 cites·20 claims
- 0688US7166017B2Slurry for CMP, polishing method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2004·Granted Jan 23, 2007·23 cites·24 claims
- 0786US10850363B2Manufacturing method of semiconductor device and semiconductor manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2015·Granted Dec 1, 2020·3 cites·7 claims
- 0884US9837279B2Manufacturing method of semiconductor device and semiconductor device manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2016·Granted Dec 5, 2017·3 cites·10 claims
- 0983US7402521B2Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program thereforTOSHIBA KK·Filed 2006·Granted Jul 22, 2008·8 cites·20 claims
- 1083US6858539B2Post-CMP treating liquid and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2002·Granted Feb 22, 2005·24 cites·9 claims
- 1183US6576554B2Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP processTOSHIBA KK·Filed 2001·Granted Jun 10, 2003·25 cites·6 claims
- 1281US7435682B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Granted Oct 14, 2008·8 cites·20 claims
- 1380US8871644B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2013·Granted Oct 28, 2014·4 cites·20 claims
- 1480US6935928B2Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing methodTOSHIBA KK·Filed 2004·Granted Aug 30, 2005·24 cites·20 claims
- 1580US6794285B2Slurry for CMP, and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2003·Granted Sep 21, 2004·19 cites·13 claims
- 1679US7459398B2Slurry for CMP, polishing method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Granted Dec 2, 2008·6 cites·7 claims
- 1778US9144879B2Planarization method and planarization apparatusTOSHIBA KK·Filed 2013·Granted Sep 29, 2015·3 cites·7 claims
- 1876US8575030B2Semiconductor device manufacturing methodMINAMIHABA GAKU·Filed 2011·Granted Nov 5, 2013·4 cites·20 claims
- 1976US7416942B2Method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2007·Granted Aug 26, 2008·5 cites·20 claims
- 2073US7071108B2Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic functionTOSHIBA KK·Filed 2002·Granted Jul 4, 2006·15 cites·22 claims
- 2171US7833431B2Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2006·Granted Nov 16, 2010·3 cites·20 claims
- 2270US10195716B2Dresser, method of manufacturing dresser, and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Feb 5, 2019·1 cites·18 claims
- 2370US8119517B2Chemical mechanical polishing method and method of manufacturing semiconductor deviceSHIDA HIROTAKA·Filed 2009·Granted Feb 21, 2012·3 cites·15 claims
- 2469US8703004B2Method for chemical planarization and chemical planarization apparatusMATSUI YUKITERU·Filed 2012·Granted Apr 22, 2014·2 cites·20 claims
- 2567US11883926B2Polishing pad, semiconductor fabricating device and fabricating method of semiconductor deviceKIOXIA CORP·Filed 2021·Granted Jan 30, 2024·0 cites·16 claims
- 2667US8114776B2Method of manufacturing semiconductor deviceEDA HAJIME·Filed 2010·Granted Feb 14, 2012·3 cites·21 claims
- 2766US8685857B2Chemical mechanical polishing method of organic film and method of manufacturing semiconductor deviceMATSUI YUKITERU·Filed 2008·Granted Apr 1, 2014·2 cites·8 claims
- 2866US7060621B2Slurry for CMP, polishing method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2004·Granted Jun 13, 2006·8 cites·15 claims
- 2964US10121677B2Manufacturing method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Nov 6, 2018·1 cites·10 claims
- 3063US8936729B2Planarizing methodGAWASE AKIFUMI·Filed 2012·Granted Jan 20, 2015·2 cites·17 claims
- 3158US11986920B2Polishing method, polishing agent and cleaning agent for polishingKIOXIA CORP·Filed 2020·Granted May 21, 2024·0 cites·15 claims
- 3258US7829406B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2008·Granted Nov 9, 2010·2 cites·20 claims
- 3356US10991588B2Manufacturing method of semiconductor device and semiconductor device manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2017·Granted Apr 27, 2021·0 cites·26 claims
- 3456US10010997B2Abrasive cloth and polishing methodTOSHIBA MEMORY CORP·Filed 2015·Granted Jul 3, 2018·0 cites·16 claims
- 3556US6875088B2Polishing member and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2003·Granted Apr 5, 2005·4 cites·26 claims
- 3655US12300499B2Polishing solution, polishing apparatus, and polishing methodKIOXIA CORP·Filed 2021·Granted May 13, 2025·0 cites·6 claims
- 3755US11534886B2Polishing device, polishing head, polishing method, and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2020·Granted Dec 27, 2022·0 cites·20 claims
- 3855US9174322B2Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2014·Granted Nov 3, 2015·0 cites·20 claims
- 3955US7700489B2Method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2004·Granted Apr 20, 2010·4 cites·14 claims
- 4054US8754433B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2012·Granted Jun 17, 2014·0 cites·8 claims
- 4153US7452819B2Chemical mechanical polishing method of organic film and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2004·Granted Nov 18, 2008·3 cites·15 claims
- 4253US7186654B2Chemical mechanical polishing slurry and method of manufacturing semiconductor device by using the sameTOSHIBA KK·Filed 2003·Granted Mar 6, 2007·3 cites·18 claims
- 4353US2019283206A1Polishing pad, semiconductor fabricating device and fabricating method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2018·Application pending·0 cites
- 4453US2014187042A1Method for chemical planarization and chemical planarization apparatusTOSHIBA KK·Filed 2014·Application pending·0 cites
- 4552US2018277388A1Manufacturing method of semiconductor device and semiconductor manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2018·Application pending·0 cites
- 4652US2013273817A1Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 4751US10283383B2Planarization method and planarization apparatusTOSHIBA MEMORY CORP·Filed 2015·Granted May 7, 2019·0 cites·13 claims
- 4851US8480915B2Method of manufacturing semiconductor deviceMINAMIHABA GAKU·Filed 2011·Granted Jul 9, 2013·0 cites·18 claims
- 4951US7888139B2Fabricating method of nonvolatile semiconductor storage apparatusTOSHIBA KK·Filed 2009·Granted Feb 15, 2011·0 cites·14 claims
- 5049US10985027B2Method for manufacturing semiconductor deviceKIOXIA CORP·Filed 2020·Granted Apr 20, 2021·0 cites·20 claims
Showing the top 50 of 87 patent records by PatentIndex Score.
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