Method of manufacturing semiconductor device

Abstract

According to one embodiment, the method of manufacturing a semiconductor device includes contacting a film formed on a semiconductor substrate with a rotating polishing pad which is supported on a turntable, and feeding polishing foam to a region of the polishing pad with which the film is contacted, thereby polishing the film. The polishing foam is obtained by turning the aqueous dispersion into a foamy body. The aqueous dispersion includes 0.01-20% by mass of abrasive grain and 0.01-1% by mass of foam forming and retaining agent, all based on a total mass of the aqueous dispersion.

1 .- 17 . (canceled) 
     
     
         18 . A polishing apparatus comprising:
 a rotatable turntable;   a polishing head configured to hold a semiconductor substrate having a film formed thereon and contact the film with a polishing pad supported on the rotatable turntable; and   a polishing foam generator configured to accommodate an aqueous dispersion comprising abrasive grain and a foam forming and retaining agent and discharge, through a mesh, the aqueous dispersion as a foamy body to feed the polishing foam to a region of a polishing pad with which the film is contacted.   
     
     
         19 . The apparatus according to  claim 18 , wherein the mesh is formed of a material selected from the group consisting of nylon, polyester and polyethylene. 
     
     
         20 . (canceled) 
     
     
         21 . The apparatus according to  claim 18 , wherein an aperture of the mesh is 100-500 meshes. 
     
     
         22 . The apparatus according to  claim 18 , wherein the polishing foam generator is constituted by a cylinder unit having a chamber configured to accommodate the aqueous dispersion. 
     
     
         23 . The apparatus according to  claim 22 , wherein the cylinder unit is formed of a resin. 
     
     
         24 . The apparatus according to  claim 22 , wherein the cylinder unit comprises a passageway communicated with the chamber, the aqueous dispersion being fed via the passageway. 
     
     
         25 . The apparatus according to  claim 24 , wherein the passageway is configured to supply the chamber with air in addition to the aqueous dispersion. 
     
     
         26 . The apparatus according to  claim 25 , wherein the polishing foam generator comprises a regulator configured to regulate a flow rate of the air supplied to the chamber.